AU575037B2 - Cyanide-free copper plating electrolyte and process - Google Patents

Cyanide-free copper plating electrolyte and process

Info

Publication number
AU575037B2
AU575037B2 AU23054/84A AU2305483A AU575037B2 AU 575037 B2 AU575037 B2 AU 575037B2 AU 23054/84 A AU23054/84 A AU 23054/84A AU 2305483 A AU2305483 A AU 2305483A AU 575037 B2 AU575037 B2 AU 575037B2
Authority
AU
Australia
Prior art keywords
cyanide
copper plating
free copper
plating electrolyte
electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU23054/84A
Other versions
AU2305483A (en
Inventor
Lillie C. Tomaszewski
Thaddeus W. Tomaszewski
Robert A. Tremmel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/455,353 external-priority patent/US4469569A/en
Priority claimed from US06/551,135 external-priority patent/US4462874A/en
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of AU2305483A publication Critical patent/AU2305483A/en
Application granted granted Critical
Publication of AU575037B2 publication Critical patent/AU575037B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AU23054/84A 1983-01-03 1983-12-30 Cyanide-free copper plating electrolyte and process Ceased AU575037B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US455353 1983-01-03
US06/455,353 US4469569A (en) 1983-01-03 1983-01-03 Cyanide-free copper plating process
US06/551,135 US4462874A (en) 1983-11-16 1983-11-16 Cyanide-free copper plating process
US551135 1983-11-16

Publications (2)

Publication Number Publication Date
AU2305483A AU2305483A (en) 1984-07-05
AU575037B2 true AU575037B2 (en) 1988-07-21

Family

ID=27037829

Family Applications (1)

Application Number Title Priority Date Filing Date
AU23054/84A Ceased AU575037B2 (en) 1983-01-03 1983-12-30 Cyanide-free copper plating electrolyte and process

Country Status (8)

Country Link
AU (1) AU575037B2 (en)
BR (1) BR8400007A (en)
CA (1) CA1225064A (en)
DE (1) DE3347593A1 (en)
ES (2) ES528624A0 (en)
FR (1) FR2538815B1 (en)
GB (2) GB2133040B (en)
MX (1) MX165687B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4933051A (en) * 1989-07-24 1990-06-12 Omi International Corporation Cyanide-free copper plating process
CA2053342A1 (en) * 1990-10-22 1992-04-23 Robert A. Tremmel Nickel electroplating process with reduced nickel ion build up
KR100877923B1 (en) 2001-06-07 2009-01-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 Electrolytic copper plating method
CN102605401B (en) * 2012-03-23 2015-11-18 如皋市易达电子有限责任公司 The online tin recovery structure of a kind of surface processing trough
DE102013021502A1 (en) 2013-12-19 2015-06-25 Schlenk Metallfolien Gmbh & Co. Kg Electrically conductive fluids based on metal diphosphonate complexes
CN113652720B (en) * 2021-07-15 2023-06-13 江门市瑞期精细化学工程有限公司 Cyanide-free copper plating bottoming method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475293A (en) * 1964-09-22 1969-10-28 Monsanto Co Electrodeposition of metals
US3706634A (en) * 1971-11-15 1972-12-19 Monsanto Co Electrochemical compositions and processes
GB1407771A (en) * 1972-05-17 1975-09-24 Monsanto Co Metal electrodeposition process and aqueous solutions for use therein

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB539882A (en) * 1939-09-16 1941-09-26 Mond Nickel Co Ltd Improvements relating to apparatus for electroplating
US3796634A (en) * 1970-03-19 1974-03-12 Us Health Education & Welfare Insolubilized biologically active enzymes
US3806429A (en) * 1972-07-03 1974-04-23 Oxy Metal Finishing Corp Electrodeposition of bright nickel-iron deposits,electrolytes therefor and coating an article with a composite nickel-iron,chromium coating
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US3914162A (en) * 1973-06-25 1975-10-21 Monsanto Co Compositions and process for the electrodeposition of metals
US3928147A (en) * 1973-10-09 1975-12-23 Monsanto Co Method for electroplating
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
GB1419613A (en) * 1974-06-13 1975-12-31 Lea Ronal Inc Cyanidefree electroplating baths
US3974044A (en) * 1975-03-31 1976-08-10 Oxy Metal Industries Corporation Bath and method for the electrodeposition of bright nickel-iron deposits
US4179343A (en) * 1979-02-12 1979-12-18 Oxy Metal Industries Corporation Electroplating bath and process for producing bright, high-leveling nickel iron electrodeposits
DE3012168A1 (en) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin METHOD FOR GALVANIC DEPOSITION OF COPPER DEPOSITS

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475293A (en) * 1964-09-22 1969-10-28 Monsanto Co Electrodeposition of metals
US3706634A (en) * 1971-11-15 1972-12-19 Monsanto Co Electrochemical compositions and processes
GB1407771A (en) * 1972-05-17 1975-09-24 Monsanto Co Metal electrodeposition process and aqueous solutions for use therein

Also Published As

Publication number Publication date
ES8506112A1 (en) 1985-06-16
DE3347593A1 (en) 1984-07-05
BR8400007A (en) 1984-07-31
GB2133040A (en) 1984-07-18
GB2167447B (en) 1987-03-04
ES8501454A1 (en) 1984-12-01
ES535227A0 (en) 1985-06-16
GB2133040B (en) 1987-02-04
FR2538815B1 (en) 1990-02-02
AU2305483A (en) 1984-07-05
CA1225064A (en) 1987-08-04
DE3347593C2 (en) 1990-05-31
ES528624A0 (en) 1984-12-01
GB8400009D0 (en) 1984-02-08
GB2167447A (en) 1986-05-29
MX165687B (en) 1992-11-27
GB8529856D0 (en) 1986-01-15
FR2538815A1 (en) 1984-07-06

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Legal Events

Date Code Title Description
MK14 Patent ceased section 143(a) (annual fees not paid) or expired