ES528624A0 - A PROCEDURE FOR DEPOSITING A PRIMARY LAYER OF DUCTILE AND ADHESIVE COPPER. - Google Patents

A PROCEDURE FOR DEPOSITING A PRIMARY LAYER OF DUCTILE AND ADHESIVE COPPER.

Info

Publication number
ES528624A0
ES528624A0 ES528624A ES528624A ES528624A0 ES 528624 A0 ES528624 A0 ES 528624A0 ES 528624 A ES528624 A ES 528624A ES 528624 A ES528624 A ES 528624A ES 528624 A0 ES528624 A0 ES 528624A0
Authority
ES
Spain
Prior art keywords
ductile
depositing
procedure
primary layer
adhesive copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES528624A
Other languages
Spanish (es)
Other versions
ES8501454A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/455,353 external-priority patent/US4469569A/en
Priority claimed from US06/551,135 external-priority patent/US4462874A/en
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of ES528624A0 publication Critical patent/ES528624A0/en
Publication of ES8501454A1 publication Critical patent/ES8501454A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
ES528624A 1983-01-03 1984-01-02 Copper plating bath process and anode therefore Expired ES8501454A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/455,353 US4469569A (en) 1983-01-03 1983-01-03 Cyanide-free copper plating process
US06/551,135 US4462874A (en) 1983-11-16 1983-11-16 Cyanide-free copper plating process

Publications (2)

Publication Number Publication Date
ES528624A0 true ES528624A0 (en) 1984-12-01
ES8501454A1 ES8501454A1 (en) 1984-12-01

Family

ID=27037829

Family Applications (2)

Application Number Title Priority Date Filing Date
ES528624A Expired ES8501454A1 (en) 1983-01-03 1984-01-02 Copper plating bath process and anode therefore
ES535227A Granted ES535227A0 (en) 1983-01-03 1984-08-16 A PROCEDURE FOR DEPOSITING A DUCTILE AND ADHESIVE COPPER LAYER

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES535227A Granted ES535227A0 (en) 1983-01-03 1984-08-16 A PROCEDURE FOR DEPOSITING A DUCTILE AND ADHESIVE COPPER LAYER

Country Status (8)

Country Link
AU (1) AU575037B2 (en)
BR (1) BR8400007A (en)
CA (1) CA1225064A (en)
DE (1) DE3347593A1 (en)
ES (2) ES8501454A1 (en)
FR (1) FR2538815B1 (en)
GB (2) GB2133040B (en)
MX (1) MX165687B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4933051A (en) * 1989-07-24 1990-06-12 Omi International Corporation Cyanide-free copper plating process
CA2053342A1 (en) * 1990-10-22 1992-04-23 Robert A. Tremmel Nickel electroplating process with reduced nickel ion build up
EP1264918B1 (en) * 2001-06-07 2011-11-23 Shipley Co. L.L.C. Electrolytic copper plating method
CN102605401B (en) * 2012-03-23 2015-11-18 如皋市易达电子有限责任公司 The online tin recovery structure of a kind of surface processing trough
DE102013021502A1 (en) 2013-12-19 2015-06-25 Schlenk Metallfolien Gmbh & Co. Kg Electrically conductive fluids based on metal diphosphonate complexes
CN113652720B (en) * 2021-07-15 2023-06-13 江门市瑞期精细化学工程有限公司 Cyanide-free copper plating bottoming method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB539882A (en) * 1939-09-16 1941-09-26 Mond Nickel Co Ltd Improvements relating to apparatus for electroplating
DE1496917A1 (en) * 1964-09-22 1969-05-22 Monsanto Co Electrolytic baths and processes for the production of galvanic coatings
US3796634A (en) * 1970-03-19 1974-03-12 Us Health Education & Welfare Insolubilized biologically active enzymes
BE791401A (en) * 1971-11-15 1973-05-14 Monsanto Co ELECTROCHEMICAL COMPOSITIONS AND PROCESSES
NL7306732A (en) * 1972-05-17 1973-11-20
US3806429A (en) * 1972-07-03 1974-04-23 Oxy Metal Finishing Corp Electrodeposition of bright nickel-iron deposits,electrolytes therefor and coating an article with a composite nickel-iron,chromium coating
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US3914162A (en) * 1973-06-25 1975-10-21 Monsanto Co Compositions and process for the electrodeposition of metals
US3928147A (en) * 1973-10-09 1975-12-23 Monsanto Co Method for electroplating
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
GB1419613A (en) * 1974-06-13 1975-12-31 Lea Ronal Inc Cyanidefree electroplating baths
US3974044A (en) * 1975-03-31 1976-08-10 Oxy Metal Industries Corporation Bath and method for the electrodeposition of bright nickel-iron deposits
US4179343A (en) * 1979-02-12 1979-12-18 Oxy Metal Industries Corporation Electroplating bath and process for producing bright, high-leveling nickel iron electrodeposits
DE3012168A1 (en) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin METHOD FOR GALVANIC DEPOSITION OF COPPER DEPOSITS

Also Published As

Publication number Publication date
FR2538815B1 (en) 1990-02-02
GB2133040B (en) 1987-02-04
DE3347593A1 (en) 1984-07-05
GB8529856D0 (en) 1986-01-15
CA1225064A (en) 1987-08-04
GB2167447B (en) 1987-03-04
BR8400007A (en) 1984-07-31
MX165687B (en) 1992-11-27
ES8501454A1 (en) 1984-12-01
AU2305483A (en) 1984-07-05
AU575037B2 (en) 1988-07-21
GB2133040A (en) 1984-07-18
GB8400009D0 (en) 1984-02-08
DE3347593C2 (en) 1990-05-31
GB2167447A (en) 1986-05-29
ES8506112A1 (en) 1985-06-16
FR2538815A1 (en) 1984-07-06
ES535227A0 (en) 1985-06-16

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