DE3732830A1
(de)
*
|
1987-09-29 |
1989-04-06 |
Siemens Ag |
Schaltungsanordnung zur pruefung der funktionsfaehigkeit einer komplexen schaltung
|
IT1220189B
(it)
*
|
1987-12-22 |
1990-06-06 |
Sgs Thomson Microelectronics |
Metodo per aumentare incrementalmente in fase di collaudo elettrico su fetta di un dispositivo integrato l'area di collettore di un transistore pnp laterale
|
US6288561B1
(en)
*
|
1988-05-16 |
2001-09-11 |
Elm Technology Corporation |
Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
|
US5206582A
(en)
*
|
1988-05-18 |
1993-04-27 |
Hewlett-Packard Company |
Control system for automated parametric test equipment
|
US6304987B1
(en)
|
1995-06-07 |
2001-10-16 |
Texas Instruments Incorporated |
Integrated test circuit
|
GB8827629D0
(en)
*
|
1988-11-25 |
1988-12-29 |
Lsi Logic Europ |
Testing of analogue circuits
|
US5142224A
(en)
*
|
1988-12-13 |
1992-08-25 |
Comsat |
Non-destructive semiconductor wafer probing system using laser pulses to generate and detect millimeter wave signals
|
US5053700A
(en)
*
|
1989-02-14 |
1991-10-01 |
Amber Engineering, Inc. |
Method for wafer scale testing of redundant integrated circuit dies
|
US4956602A
(en)
*
|
1989-02-14 |
1990-09-11 |
Amber Engineering, Inc. |
Wafer scale testing of redundant integrated circuit dies
|
JPH02129985U
(fr)
*
|
1989-04-04 |
1990-10-26 |
|
|
JPH07113898B2
(ja)
*
|
1989-05-09 |
1995-12-06 |
株式会社日立製作所 |
障害検出方式
|
US5377124A
(en)
*
|
1989-09-20 |
1994-12-27 |
Aptix Corporation |
Field programmable printed circuit board
|
US5001604A
(en)
*
|
1989-10-26 |
1991-03-19 |
Lusby W Randolph |
Embedded testing circuit and method for fabricating same
|
KR920007535B1
(ko)
*
|
1990-05-23 |
1992-09-05 |
삼성전자 주식회사 |
식별회로를 구비한 반도체 집적회로 칩
|
US5059899A
(en)
*
|
1990-08-16 |
1991-10-22 |
Micron Technology, Inc. |
Semiconductor dies and wafers and methods for making
|
US5663654A
(en)
*
|
1990-08-29 |
1997-09-02 |
Micron Technology, Inc. |
Universal wafer carrier for wafer level die burn-in
|
US7511520B2
(en)
*
|
1990-08-29 |
2009-03-31 |
Micron Technology, Inc. |
Universal wafer carrier for wafer level die burn-in
|
DE69133311T2
(de)
*
|
1990-10-15 |
2004-06-24 |
Aptix Corp., San Jose |
Verbindungssubstrat mit integrierter Schaltung zur programmierbaren Verbindung und Probenuntersuchung
|
JPH04218939A
(ja)
*
|
1990-12-19 |
1992-08-10 |
Sharp Corp |
集積回路装置
|
DE69219165T2
(de)
*
|
1991-01-11 |
1997-08-07 |
Texas Instruments Inc |
Prüf- und Einbrennsystem für einen Wafer und Methode für deren Herstellung
|
JP2936807B2
(ja)
*
|
1991-07-12 |
1999-08-23 |
日本電気株式会社 |
集積回路
|
US5206583A
(en)
*
|
1991-08-20 |
1993-04-27 |
International Business Machines Corporation |
Latch assisted fuse testing for customized integrated circuits
|
US5315241A
(en)
*
|
1991-09-18 |
1994-05-24 |
Sgs-Thomson Microelectronics, Inc. |
Method for testing integrated circuits
|
US5262719A
(en)
*
|
1991-09-19 |
1993-11-16 |
International Business Machines Corporation |
Test structure for multi-layer, thin-film modules
|
JPH0590362A
(ja)
*
|
1991-09-26 |
1993-04-09 |
Hitoshi Nishimura |
半導体ウエハの検査構造
|
US5198760A
(en)
*
|
1991-09-30 |
1993-03-30 |
Hughes Aircraft Company |
Method by which to detect direction of current flow in outputs of integrated circuits
|
US5311122A
(en)
*
|
1991-12-02 |
1994-05-10 |
Motorola, Inc. |
RF test equipment and wire bond interface circuit
|
JPH05198637A
(ja)
*
|
1992-01-23 |
1993-08-06 |
Mitsubishi Electric Corp |
半導体集積回路及びそのテスト方法
|
US5279975A
(en)
*
|
1992-02-07 |
1994-01-18 |
Micron Technology, Inc. |
Method of testing individual dies on semiconductor wafers prior to singulation
|
JPH05267415A
(ja)
*
|
1992-03-18 |
1993-10-15 |
Fujitsu Ltd |
半導体装置
|
US5457400A
(en)
*
|
1992-04-10 |
1995-10-10 |
Micron Technology, Inc. |
Semiconductor array having built-in test circuit for wafer level testing
|
US5241266A
(en)
*
|
1992-04-10 |
1993-08-31 |
Micron Technology, Inc. |
Built-in test circuit connection for wafer level burnin and testing of individual dies
|
US5332973A
(en)
*
|
1992-05-01 |
1994-07-26 |
The University Of Manitoba |
Built-in fault testing of integrated circuits
|
US5442282A
(en)
*
|
1992-07-02 |
1995-08-15 |
Lsi Logic Corporation |
Testing and exercising individual, unsingulated dies on a wafer
|
US5648661A
(en)
*
|
1992-07-02 |
1997-07-15 |
Lsi Logic Corporation |
Integrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the dies
|
US5389556A
(en)
*
|
1992-07-02 |
1995-02-14 |
Lsi Logic Corporation |
Individually powering-up unsingulated dies on a wafer
|
JPH06230086A
(ja)
*
|
1992-09-22 |
1994-08-19 |
Nec Corp |
Lsiのテスト回路
|
US5286656A
(en)
*
|
1992-11-02 |
1994-02-15 |
National Semiconductor Corporation |
Individualized prepackage AC performance testing of IC dies on a wafer using DC parametric test patterns
|
FR2700063B1
(fr)
*
|
1992-12-31 |
1995-02-10 |
Sgs Thomson Microelectronics |
Procédé de test de puces de circuit intégré et dispositif intégré correspondant.
|
DE4305526A1
(de)
*
|
1993-02-24 |
1994-08-25 |
Telefunken Microelectron |
Verfahren zum Betrieb einer integrierten Schaltung
|
US5418452A
(en)
*
|
1993-03-25 |
1995-05-23 |
Fujitsu Limited |
Apparatus for testing integrated circuits using time division multiplexing
|
US5399505A
(en)
*
|
1993-07-23 |
1995-03-21 |
Motorola, Inc. |
Method and apparatus for performing wafer level testing of integrated circuit dice
|
US5594273A
(en)
*
|
1993-07-23 |
1997-01-14 |
Motorola Inc. |
Apparatus for performing wafer-level testing of integrated circuits where test pads lie within integrated circuit die but overly no active circuitry for improved yield
|
US5654588A
(en)
*
|
1993-07-23 |
1997-08-05 |
Motorola Inc. |
Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure
|
FI100136B
(fi)
*
|
1993-10-01 |
1997-09-30 |
Nokia Telecommunications Oy |
Menetelmä integroidun piirin testaamiseksi sekä integroitu piiri
|
US5418470A
(en)
*
|
1993-10-22 |
1995-05-23 |
Tektronix, Inc. |
Analog multi-channel probe system
|
US6587978B1
(en)
|
1994-02-14 |
2003-07-01 |
Micron Technology, Inc. |
Circuit and method for varying a pulse width of an internal control signal during a test mode
|
US5831918A
(en)
|
1994-02-14 |
1998-11-03 |
Micron Technology, Inc. |
Circuit and method for varying a period of an internal control signal during a test mode
|
US5532174A
(en)
*
|
1994-04-22 |
1996-07-02 |
Lsi Logic Corporation |
Wafer level integrated circuit testing with a sacrificial metal layer
|
US6055661A
(en)
*
|
1994-06-13 |
2000-04-25 |
Luk; Fong |
System configuration and methods for on-the-fly testing of integrated circuits
|
US6577148B1
(en)
|
1994-08-31 |
2003-06-10 |
Motorola, Inc. |
Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
|
US5508631A
(en)
*
|
1994-10-27 |
1996-04-16 |
Mitel Corporation |
Semiconductor test chip with on wafer switching matrix
|
JP2725615B2
(ja)
*
|
1994-10-31 |
1998-03-11 |
日本電気株式会社 |
集積回路試験装置
|
US5515302A
(en)
*
|
1994-11-07 |
1996-05-07 |
Motorola, Inc. |
Method for identifying excessive power consumption sites within a circuit
|
US5648730A
(en)
*
|
1994-11-30 |
1997-07-15 |
Texas Instruments Incorporated |
Large integrated circuit with modular probe structures
|
JP3301874B2
(ja)
*
|
1994-12-19 |
2002-07-15 |
松下電器産業株式会社 |
半導体装置及びその検査方法
|
JP3615256B2
(ja)
*
|
1995-02-10 |
2005-02-02 |
本田技研工業株式会社 |
半導体集積回路
|
US5617036A
(en)
*
|
1995-02-24 |
1997-04-01 |
The Whitaker Corporation |
Laser/pin assembly with integrated burn-in assembly
|
US5798653A
(en)
*
|
1995-04-20 |
1998-08-25 |
Sun Microsystems, Inc. |
Burn-in system for reliable integrated circuit manufacturing
|
EP0745859B1
(fr)
*
|
1995-05-31 |
2004-10-27 |
STMicroelectronics, Inc. |
Contacts configurables pour faciliter le test parallèle de circuits intégrés
|
US5952838A
(en)
*
|
1995-06-21 |
1999-09-14 |
Sony Corporation |
Reconfigurable array of test structures and method for testing an array of test structures
|
JP3026308B2
(ja)
*
|
1995-09-14 |
2000-03-27 |
ローム株式会社 |
不揮発性記憶装置および不揮発性記憶装置の製造方法
|
US5969538A
(en)
|
1996-10-31 |
1999-10-19 |
Texas Instruments Incorporated |
Semiconductor wafer with interconnect between dies for testing and a process of testing
|
US6166557A
(en)
*
|
1996-10-31 |
2000-12-26 |
Texas Instruments Incorporated |
Process of selecting dies for testing on a wafer
|
US5892249A
(en)
*
|
1996-02-23 |
1999-04-06 |
National Semiconductor Corporation |
Integrated circuit having reprogramming cell
|
US5692084A
(en)
*
|
1996-06-11 |
1997-11-25 |
The Whitaker Corporation |
Package for an optoelectronic device
|
US5764836A
(en)
*
|
1996-06-11 |
1998-06-09 |
The Whitaker Corporation |
Pigtailed package for an optoelectronic device
|
US5991214A
(en)
*
|
1996-06-14 |
1999-11-23 |
Micron Technology, Inc. |
Circuit and method for varying a period of an internal control signal during a test mode
|
US6239604B1
(en)
*
|
1996-10-04 |
2001-05-29 |
U.S. Philips Corporation |
Method for inspecting an integrated circuit by measuring a voltage drop in a supply line of sub-circuit thereof
|
US5929650A
(en)
*
|
1997-02-04 |
1999-07-27 |
Motorola, Inc. |
Method and apparatus for performing operative testing on an integrated circuit
|
US6104198A
(en)
*
|
1997-05-20 |
2000-08-15 |
Zen Licensing Group Llp |
Testing the integrity of an electrical connection to a device using an onboard controllable signal source
|
DE19742946C2
(de)
*
|
1997-09-29 |
2000-10-12 |
Siemens Ag |
Testschaltung auf einem Halbleiter-Chip
|
US6405335B1
(en)
|
1998-02-25 |
2002-06-11 |
Texas Instruments Incorporated |
Position independent testing of circuits
|
DE19819570C2
(de)
*
|
1998-04-30 |
2000-06-15 |
Siemens Ag |
Anordnung zum Testen mehrerer Speicherchips auf einem Wafer
|
US6040622A
(en)
*
|
1998-06-11 |
2000-03-21 |
Sandisk Corporation |
Semiconductor package using terminals formed on a conductive layer of a circuit board
|
US6233184B1
(en)
*
|
1998-11-13 |
2001-05-15 |
International Business Machines Corporation |
Structures for wafer level test and burn-in
|
US6140833A
(en)
*
|
1998-11-16 |
2000-10-31 |
Siemens Aktiengesellschaft |
In-situ measurement method and apparatus for semiconductor processing
|
JP4234244B2
(ja)
*
|
1998-12-28 |
2009-03-04 |
富士通マイクロエレクトロニクス株式会社 |
ウエハーレベルパッケージ及びウエハーレベルパッケージを用いた半導体装置の製造方法
|
DE19917586C2
(de)
*
|
1999-04-19 |
2002-01-17 |
Infineon Technologies Ag |
Anordnung zur Durchführung von Burn-In-Behandlungen von Halbleitervorrichtungen auf Waferebene
|
DE19930169B4
(de)
*
|
1999-06-30 |
2004-09-30 |
Infineon Technologies Ag |
Testeinrichtung und Verfahren zum Prüfen eines Speichers
|
JP3483130B2
(ja)
*
|
1999-11-29 |
2004-01-06 |
松下電器産業株式会社 |
集積回路の検査方法
|
US6214630B1
(en)
*
|
1999-12-22 |
2001-04-10 |
United Microelectronics Corp. |
Wafer level integrated circuit structure and method of manufacturing the same
|
US6728915B2
(en)
|
2000-01-10 |
2004-04-27 |
Texas Instruments Incorporated |
IC with shared scan cells selectively connected in scan path
|
US6429677B1
(en)
*
|
2000-02-10 |
2002-08-06 |
International Business Machines Corporation |
Method and apparatus for characterization of gate dielectrics
|
DE10010285A1
(de)
*
|
2000-02-25 |
2001-09-13 |
Infineon Technologies Ag |
Teststruktur bei integriertem Halbleiter
|
US6769080B2
(en)
|
2000-03-09 |
2004-07-27 |
Texas Instruments Incorporated |
Scan circuit low power adapter with counter
|
EP1266404B1
(fr)
*
|
2000-03-10 |
2005-07-27 |
Infineon Technologies AG |
Ensemble circuit de test et procede pour tester une pluralite de composants electriques
|
US20020025100A1
(en)
*
|
2000-06-16 |
2002-02-28 |
Mcgill University |
Method and apparatus for OPTO-electronic built-in tests
|
DE10037794A1
(de)
|
2000-08-03 |
2002-02-21 |
Infineon Technologies Ag |
Verfahren und Vorrichtung zum Testen einer integrierten Schaltung, zu testende integrierte Schaltung, und Wafer mit einer Vielzahl von zu testenden integrierten Schaltungen
|
US6462575B1
(en)
*
|
2000-08-28 |
2002-10-08 |
Micron Technology, Inc. |
Method and system for wafer level testing and burning-in semiconductor components
|
US6683467B1
(en)
*
|
2000-09-29 |
2004-01-27 |
Intel Corporation |
Method and apparatus for providing rotational burn-in stress testing
|
GB0030346D0
(en)
*
|
2000-12-13 |
2001-01-24 |
Mitel Semiconductor Ltd |
Integrated circuit test structure
|
US6850075B1
(en)
*
|
2000-12-22 |
2005-02-01 |
Cypress Semiconductor Corp. |
SRAM self-timed write stress test mode
|
US6777969B1
(en)
*
|
2001-03-21 |
2004-08-17 |
Cypress Semiconductor Corp. |
Low stress test mode
|
TW490783B
(en)
*
|
2001-05-22 |
2002-06-11 |
Hi Max Optoelectronics Corp |
Testing device and method built in the wafer scribe line
|
JP2003107135A
(ja)
*
|
2001-09-28 |
2003-04-09 |
Mitsubishi Electric Corp |
バーンイン装置
|
US6717430B2
(en)
*
|
2002-02-13 |
2004-04-06 |
Motorola, Inc. |
Integrated circuit testing with a visual indicator
|
US6825683B1
(en)
*
|
2002-04-18 |
2004-11-30 |
Cypress Semiconductor Corporation |
System and method for testing multiple integrated circuits that are in the same package
|
US7026646B2
(en)
*
|
2002-06-20 |
2006-04-11 |
Micron Technology, Inc. |
Isolation circuit
|
KR100496862B1
(ko)
*
|
2002-10-01 |
2005-06-22 |
삼성전자주식회사 |
멀티칩패키지의 테스트 장치 및 방법
|
DE10258511A1
(de)
*
|
2002-12-14 |
2004-07-08 |
Infineon Technologies Ag |
Integrierte Schaltung sowie zugehörige gehäuste integrierte Schaltung
|
KR100523139B1
(ko)
*
|
2003-06-23 |
2005-10-20 |
주식회사 하이닉스반도체 |
웨이퍼 테스트시 사용되는 프로빙 패드의 수를 감소시키기위한 반도체 장치 및 그의 테스팅 방법
|
US20050149789A1
(en)
*
|
2003-11-19 |
2005-07-07 |
Honeywell International, Inc. |
Pseudo random verification of waveform fault coverage
|
US7365556B2
(en)
*
|
2004-09-02 |
2008-04-29 |
Texas Instruments Incorporated |
Semiconductor device testing
|
US7475318B2
(en)
*
|
2005-01-28 |
2009-01-06 |
Honeywell International Inc. |
Method for testing the sensitive input range of Byzantine filters
|
JP2007010606A
(ja)
*
|
2005-07-04 |
2007-01-18 |
Matsushita Electric Ind Co Ltd |
Lsi検査モジュール、lsi検査モジュールの制御方法、lsi検査モジュールとlsi検査装置との通信方法、およびlsi検査方法
|
US7405585B2
(en)
*
|
2006-02-14 |
2008-07-29 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Versatile semiconductor test structure array
|
US7906982B1
(en)
|
2006-02-28 |
2011-03-15 |
Cypress Semiconductor Corporation |
Interface apparatus and methods of testing integrated circuits using the same
|
JP2007278767A
(ja)
*
|
2006-04-04 |
2007-10-25 |
Denso Corp |
Ic実装済み電子部品実装基板及びそのリーク電流試験方法
|
JP2007287770A
(ja)
*
|
2006-04-13 |
2007-11-01 |
Matsushita Electric Ind Co Ltd |
半導体集積回路
|
JP4328791B2
(ja)
*
|
2006-09-20 |
2009-09-09 |
エルピーダメモリ株式会社 |
被測定素子の特性測定方法及び半導体装置の特性管理システム
|
JP4274576B2
(ja)
*
|
2007-01-12 |
2009-06-10 |
エルピーダメモリ株式会社 |
半導体装置
|
WO2008152557A1
(fr)
*
|
2007-06-12 |
2008-12-18 |
Nxp B.V. |
Procédé de test à un composant semiconducteur
|
JP5170395B2
(ja)
*
|
2008-02-21 |
2013-03-27 |
日本電気株式会社 |
ウエハ及びその温度試験方法
|
US7719299B2
(en)
*
|
2008-04-02 |
2010-05-18 |
Texas Instruments Incorporated |
Process and temperature insensitive flicker noise monitor circuit
|
WO2009144791A1
(fr)
*
|
2008-05-28 |
2009-12-03 |
株式会社アドバンテスト |
Système de test et plaquette d'écriture
|
US8179143B2
(en)
*
|
2008-10-15 |
2012-05-15 |
Test Research, Inc. |
Apparatus for testing printed circuit and method therefor
|
US9759772B2
(en)
|
2011-10-28 |
2017-09-12 |
Teradyne, Inc. |
Programmable test instrument
|
US10776233B2
(en)
|
2011-10-28 |
2020-09-15 |
Teradyne, Inc. |
Programmable test instrument
|
CN103490374B
(zh)
*
|
2013-09-25 |
2017-05-17 |
山东贞明光电科技有限公司 |
一种量产测试设备及其短路过流保护电路
|
CN103887202B
(zh)
*
|
2014-03-24 |
2016-08-17 |
上海华力微电子有限公司 |
监测方法
|
US9947712B2
(en)
*
|
2016-01-27 |
2018-04-17 |
Varex Imaging Corporation |
Matrix type integrated circuit with fault isolation capability
|
CN109406922B
(zh)
*
|
2017-08-15 |
2020-09-22 |
昆山维信诺科技有限公司 |
电子产品及其测试方法和装置
|
KR102471500B1
(ko)
*
|
2018-03-12 |
2022-11-28 |
에스케이하이닉스 주식회사 |
반도체 장치 및 이를 포함하는 테스트 시스템
|
CN110021334B
(zh)
*
|
2019-04-19 |
2021-08-27 |
上海华虹宏力半导体制造有限公司 |
一种晶圆测试方法
|