FR2700062B1 - Procédé pour fabriquer un transistor à films minces. - Google Patents

Procédé pour fabriquer un transistor à films minces.

Info

Publication number
FR2700062B1
FR2700062B1 FR9315834A FR9315834A FR2700062B1 FR 2700062 B1 FR2700062 B1 FR 2700062B1 FR 9315834 A FR9315834 A FR 9315834A FR 9315834 A FR9315834 A FR 9315834A FR 2700062 B1 FR2700062 B1 FR 2700062B1
Authority
FR
France
Prior art keywords
manufacturing
thin film
film transistor
transistor
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9315834A
Other languages
English (en)
Other versions
FR2700062A1 (fr
Inventor
Eui Yeol Oh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
Gold Star Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019920026233A external-priority patent/KR940016916A/ko
Priority claimed from KR1019920026230A external-priority patent/KR100290919B1/ko
Priority claimed from KR1019930000263A external-priority patent/KR960008737B1/ko
Application filed by Gold Star Co Ltd filed Critical Gold Star Co Ltd
Publication of FR2700062A1 publication Critical patent/FR2700062A1/fr
Application granted granted Critical
Publication of FR2700062B1 publication Critical patent/FR2700062B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H01L29/6675—Amorphous silicon or polysilicon transistors
    • H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725—Source or drain electrodes for field effect devices
    • H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/043—Dual dielectric

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
FR9315834A 1992-12-29 1993-12-29 Procédé pour fabriquer un transistor à films minces. Expired - Lifetime FR2700062B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1019920026233A KR940016916A (ko) 1992-12-29 1992-12-29 박막트랜지스터 제조방법
KR1019920026230A KR100290919B1 (ko) 1992-12-29 1992-12-29 박막트랜지스터제조방법
KR1019930000263A KR960008737B1 (ko) 1993-01-11 1993-01-11 자기 정합을 이용한 박막트랜지스터

Publications (2)

Publication Number Publication Date
FR2700062A1 FR2700062A1 (fr) 1994-07-01
FR2700062B1 true FR2700062B1 (fr) 1996-08-23

Family

ID=27348896

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9315834A Expired - Lifetime FR2700062B1 (fr) 1992-12-29 1993-12-29 Procédé pour fabriquer un transistor à films minces.

Country Status (4)

Country Link
US (1) US5610082A (fr)
JP (1) JP3537854B2 (fr)
DE (1) DE4344897B4 (fr)
FR (1) FR2700062B1 (fr)

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KR970007965B1 (en) * 1994-05-12 1997-05-19 Lg Semicon Co Ltd Structure and fabrication method of tft
GB2307768B (en) * 1995-11-25 1998-06-10 Lg Electronics Inc Matrix array of active matrix lcd and manufacturing method thereof
JP3323889B2 (ja) * 1996-10-28 2002-09-09 三菱電機株式会社 薄膜トランジスタの製造方法
JP2985838B2 (ja) * 1997-07-18 1999-12-06 日本電気株式会社 薄膜トランジスタアレイ基板の製造方法
KR100453176B1 (ko) * 1998-06-13 2005-04-08 엘지.필립스 엘시디 주식회사 액정표시장치의제조방법
US6063653A (en) * 1998-07-07 2000-05-16 Industrial Technology Research Institute Method of fabricating a TFT-LCD
JP4246298B2 (ja) * 1998-09-30 2009-04-02 インターナショナル・ビジネス・マシーンズ・コーポレーション 液晶ディスプレイパネルの製造方法
KR100601168B1 (ko) * 1999-05-13 2006-07-13 삼성전자주식회사 박막 트랜지스터 기판 및 그의 제조 방법
US6261880B1 (en) * 1999-05-24 2001-07-17 Chi Mei Electronics Corp Process for manufacturing thin film transistors
TW428328B (en) * 1999-07-30 2001-04-01 Hannstar Display Corp Fabricating method of thin film transistor
TW415110B (en) * 1999-08-12 2000-12-11 Hannstar Display Corp Fabrication method of thin-film transistor
GB9919913D0 (en) * 1999-08-24 1999-10-27 Koninkl Philips Electronics Nv Thin-film transistors and method for producing the same
KR100583979B1 (ko) 2000-02-11 2006-05-26 엘지.필립스 엘시디 주식회사 액정 표시장치 제조방법 및 그 제조방법에 따른액정표시장치
GB0021030D0 (en) * 2000-08-26 2000-10-11 Koninkl Philips Electronics Nv A method of forming a bottom-gate thin film transistor
JP4801248B2 (ja) * 2000-10-31 2011-10-26 アプライド マテリアルズ インコーポレイテッド 酸化膜形成方法及び装置
KR100726132B1 (ko) * 2000-10-31 2007-06-12 엘지.필립스 엘시디 주식회사 액정표시장치용 어레이기판과 그 제조방법
KR100480331B1 (ko) * 2002-04-08 2005-04-06 엘지.필립스 엘시디 주식회사 액정표시장치용 어레이 기판 및 그의 제조방법
US6710409B1 (en) 2002-10-15 2004-03-23 Matrix Semiconductor, Inc. Inverted staggered thin film transistor with etch stop layer and method of making same
JP3991883B2 (ja) * 2003-02-20 2007-10-17 日本電気株式会社 薄膜トランジスタ基板の製造方法
TWI285929B (en) * 2006-02-15 2007-08-21 Au Optronics Corp Manufacturing method of pixel structure
TW200746534A (en) * 2006-06-06 2007-12-16 Univ Yuan Ze Manufacturing method of fuel cell having integrated catalyst layer and micro-sensor
US7629206B2 (en) * 2007-02-26 2009-12-08 3M Innovative Properties Company Patterning self-aligned transistors using back surface illumination
US20090278120A1 (en) * 2008-05-09 2009-11-12 Korea Institute Of Science And Technology Thin Film Transistor
US8558978B2 (en) * 2009-02-13 2013-10-15 Apple Inc. LCD panel with index-matching passivation layers
US8247276B2 (en) * 2009-02-20 2012-08-21 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor, method for manufacturing the same, and semiconductor device
US9401431B2 (en) * 2009-04-21 2016-07-26 Cbrite Inc. Double self-aligned metal oxide TFT
KR101113354B1 (ko) * 2010-04-16 2012-02-29 삼성모바일디스플레이주식회사 표시 장치 및 그 제조방법
KR20120042143A (ko) 2010-10-22 2012-05-03 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 이의 제조 방법
KR101757443B1 (ko) * 2010-12-08 2017-07-13 엘지디스플레이 주식회사 미세 결정 실리콘 박막 트랜지스터와 이를 포함하는 표시장치 및 그 제조 방법
CN102800705B (zh) * 2011-05-24 2015-01-07 北京大学 一种金属氧化物半导体薄膜晶体管的制作方法
TWI605590B (zh) * 2011-09-29 2017-11-11 半導體能源研究所股份有限公司 半導體裝置及其製造方法
CN102651322A (zh) * 2012-02-27 2012-08-29 京东方科技集团股份有限公司 一种薄膜晶体管及其制造方法、阵列基板、显示器件
CN103811417B (zh) * 2012-11-08 2016-07-27 瀚宇彩晶股份有限公司 像素结构的制作方法
TWI511200B (zh) * 2013-07-25 2015-12-01 Ye Xin Technology Consulting Co Ltd 顯示面板製作方法
US11302717B2 (en) * 2016-04-08 2022-04-12 Semiconductor Energy Laboratory Co., Ltd. Transistor and method for manufacturing the same

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Also Published As

Publication number Publication date
JPH06244204A (ja) 1994-09-02
US5610082A (en) 1997-03-11
DE4344897B4 (de) 2005-11-17
DE4344897A1 (de) 1994-07-07
FR2700062A1 (fr) 1994-07-01
JP3537854B2 (ja) 2004-06-14

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