ES2071433T3 - Componentes magneticos monoliticos multicapa y metodo para su fabricacion. - Google Patents

Componentes magneticos monoliticos multicapa y metodo para su fabricacion.

Info

Publication number
ES2071433T3
ES2071433T3 ES92303700T ES92303700T ES2071433T3 ES 2071433 T3 ES2071433 T3 ES 2071433T3 ES 92303700 T ES92303700 T ES 92303700T ES 92303700 T ES92303700 T ES 92303700T ES 2071433 T3 ES2071433 T3 ES 2071433T3
Authority
ES
Spain
Prior art keywords
manufacture
magnetic
magnetic components
monolithic magnetic
multilayer monolithic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92303700T
Other languages
English (en)
Inventor
Gideon S Grader
David Wilfred Johnson Jr
Apurba Roy
John Thomson Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of ES2071433T3 publication Critical patent/ES2071433T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/16Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0033Printed inductances with the coil helically wound around a magnetic core
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Soft Magnetic Materials (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Hard Magnetic Materials (AREA)

Abstract

LOS COMPONENTES MAGNETICOS SE FABRICAN COMO ESTRUCTURAS MONOLITICAS USANDO TECNICAS DE BANDA CERAMICA MULTICAPA. LA FABRICACION DE ESTOS COMPONENTES MAGNETICOS COMPRENDE LA CONSTRUCCION DE CAPAS MULTIPLES DE UN MATERIAL MAGNETICO Y UN MATERIAL AISLANTE NO MAGNETICO PARA FORMAR UNA ESTRUCTURA MONOLITICA CON ZONAS MAGNETICAS Y ZONAS AISLANTES NO MAGNETICAS BIEN DEFINIDAS. LOS BOBINAS SE FORMAN USANDO CONDUCTORES IMPRESOS CONECTADOS A TRAVES DE LA ESTRUCTURA MULTICAPA MEDIANTE VIAS DE CONDUCCION.
ES92303700T 1991-05-02 1992-04-24 Componentes magneticos monoliticos multicapa y metodo para su fabricacion. Expired - Lifetime ES2071433T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/695,653 US5349743A (en) 1991-05-02 1991-05-02 Method of making a multilayer monolithic magnet component

Publications (1)

Publication Number Publication Date
ES2071433T3 true ES2071433T3 (es) 1995-06-16

Family

ID=24793921

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92303700T Expired - Lifetime ES2071433T3 (es) 1991-05-02 1992-04-24 Componentes magneticos monoliticos multicapa y metodo para su fabricacion.

Country Status (14)

Country Link
US (2) US5349743A (es)
EP (1) EP0512718B1 (es)
JP (1) JP2637332B2 (es)
KR (1) KR920022325A (es)
AU (1) AU654348B2 (es)
CA (1) CA2067008C (es)
DE (1) DE69202097T2 (es)
ES (1) ES2071433T3 (es)
FI (1) FI921968A (es)
HK (1) HK81296A (es)
IL (1) IL101736A (es)
MX (1) MX9201989A (es)
PT (1) PT100444A (es)
TW (1) TW198120B (es)

Families Citing this family (168)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5239744A (en) 1992-01-09 1993-08-31 At&T Bell Laboratories Method for making multilayer magnetic components
JPH06164222A (ja) * 1992-11-25 1994-06-10 Murata Mfg Co Ltd マイクロ波用磁性体及びその製造方法
US5389428A (en) * 1992-12-08 1995-02-14 At&T Corp. Sintered ceramic components and method for making same
JP3158757B2 (ja) * 1993-01-13 2001-04-23 株式会社村田製作所 チップ型コモンモードチョークコイル及びその製造方法
US5525941A (en) * 1993-04-01 1996-06-11 General Electric Company Magnetic and electromagnetic circuit components having embedded magnetic material in a high density interconnect structure
US5430613A (en) * 1993-06-01 1995-07-04 Eaton Corporation Current transformer using a laminated toroidal core structure and a lead frame
JP2656000B2 (ja) * 1993-08-31 1997-09-24 日立金属株式会社 ストリップライン型高周波部品
JP3116713B2 (ja) * 1994-03-31 2000-12-11 株式会社村田製作所 インダクタ内蔵電子部品
US5575932A (en) * 1994-05-13 1996-11-19 Performance Controls, Inc. Method of making densely-packed electrical conductors
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device
TW265450B (en) * 1994-06-30 1995-12-11 At & T Corp Devices using metallized magnetic substrates
GB2292016B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Inductor device
US6362713B1 (en) * 1994-10-19 2002-03-26 Taiyo Yuden Kabushiki Kaisha Chip inductor, chip inductor array and method of manufacturing same
JP3152088B2 (ja) * 1994-11-28 2001-04-03 株式会社村田製作所 コイル部品の製造方法
DE4442994A1 (de) * 1994-12-02 1996-06-05 Philips Patentverwaltung Planare Induktivität
US5821846A (en) * 1995-05-22 1998-10-13 Steward, Inc. High current ferrite electromagnetic interference suppressor and associated method
US5661882A (en) * 1995-06-30 1997-09-02 Ferro Corporation Method of integrating electronic components into electronic circuit structures made using LTCC tape
JP3127792B2 (ja) 1995-07-19 2001-01-29 株式会社村田製作所 Lc共振器およびlcフィルタ
US5610569A (en) * 1996-01-31 1997-03-11 Hughes Electronics Staggered horizontal inductor for use with multilayer substrate
US5852866A (en) * 1996-04-04 1998-12-29 Robert Bosch Gmbh Process for producing microcoils and microtransformers
FR2749989B1 (fr) * 1996-06-17 1998-07-24 Commissariat Energie Atomique Dispositif d'alimentation impulsionnelle a reseau de bobinages
US5793272A (en) * 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
JP3097569B2 (ja) * 1996-09-17 2000-10-10 株式会社村田製作所 積層チップインダクタの製造方法
JP3438859B2 (ja) * 1996-11-21 2003-08-18 ティーディーケイ株式会社 積層型電子部品とその製造方法
JPH1140915A (ja) * 1997-05-22 1999-02-12 Nec Corp プリント配線板
US5880662A (en) * 1997-08-21 1999-03-09 Dale Electronics, Inc. High self resonant frequency multilayer inductor and method for making same
US6246311B1 (en) * 1997-11-26 2001-06-12 Vlt Corporation Inductive devices having conductive areas on their surfaces
US6016005A (en) * 1998-02-09 2000-01-18 Cellarosi; Mario J. Multilayer, high density micro circuit module and method of manufacturing same
US6007758A (en) * 1998-02-10 1999-12-28 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
US6169801B1 (en) 1998-03-16 2001-01-02 Midcom, Inc. Digital isolation apparatus and method
US6008102A (en) * 1998-04-09 1999-12-28 Motorola, Inc. Method of forming a three-dimensional integrated inductor
US6696746B1 (en) * 1998-04-29 2004-02-24 Micron Technology, Inc. Buried conductors
US6025261A (en) * 1998-04-29 2000-02-15 Micron Technology, Inc. Method for making high-Q inductive elements
US6054914A (en) * 1998-07-06 2000-04-25 Midcom, Inc. Multi-layer transformer having electrical connection in a magnetic core
US6162311A (en) * 1998-10-29 2000-12-19 Mmg Of North America, Inc. Composite magnetic ceramic toroids
US6566731B2 (en) 1999-02-26 2003-05-20 Micron Technology, Inc. Open pattern inductor
US6278269B1 (en) * 1999-03-08 2001-08-21 Allegro Microsystems, Inc. Magnet structure
GB2348321A (en) * 1999-03-23 2000-09-27 Mitel Semiconductor Ltd A laminated transformer and a method of its manufacture
US6198374B1 (en) 1999-04-01 2001-03-06 Midcom, Inc. Multi-layer transformer apparatus and method
US6240622B1 (en) 1999-07-09 2001-06-05 Micron Technology, Inc. Integrated circuit inductors
KR100349419B1 (ko) * 1999-07-27 2002-08-19 학교법인 한국정보통신학원 이중 나선형 인덕터 구조
US6470545B1 (en) * 1999-09-15 2002-10-29 National Semiconductor Corporation Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate
JP2001160636A (ja) * 1999-09-20 2001-06-12 Denso Corp 圧電素子
JP2001102217A (ja) * 1999-09-30 2001-04-13 Tdk Corp コイル装置
US6413339B1 (en) * 1999-12-22 2002-07-02 International Business Machines Corporation Low temperature sintering of ferrite materials
US6704277B1 (en) 1999-12-29 2004-03-09 Intel Corporation Testing for digital signaling
DE10002377A1 (de) 2000-01-20 2001-08-02 Infineon Technologies Ag Spule und Spulensystem zur Integration in eine mikroelektronische Schaltung sowie mikroelektronische Schaltung
JP2003534657A (ja) 2000-05-19 2003-11-18 フィリップ エイ. ハーディング スロット付きコア変圧器およびインダクタ
US6655002B1 (en) * 2000-06-28 2003-12-02 Texas Instruments Incorporated Microactuator for use in mass data storage devices, or the like, and method for making same
US6374481B1 (en) * 2000-06-28 2002-04-23 Texas Instruments Incorporated Method for making microactuator for use in mass data storage devices
TWI258154B (en) * 2000-09-22 2006-07-11 Flex Multi Fineline Electronix Electronic transformer/inductor devices and methods for making same
JP3449351B2 (ja) * 2000-11-09 2003-09-22 株式会社村田製作所 積層セラミック電子部品の製造方法及び積層セラミック電子部品
JP3449350B2 (ja) * 2000-11-09 2003-09-22 株式会社村田製作所 積層セラミック電子部品の製造方法及び積層セラミック電子部品
US6587025B2 (en) * 2001-01-31 2003-07-01 Vishay Dale Electronics, Inc. Side-by-side coil inductor
JP2002373810A (ja) * 2001-06-14 2002-12-26 Tdk Corp チップ型コモンモードチョークコイル
US6667536B2 (en) * 2001-06-28 2003-12-23 Agere Systems Inc. Thin film multi-layer high Q transformer formed in a semiconductor substrate
US6911889B2 (en) * 2001-08-20 2005-06-28 Steward, Inc. High frequency filter device and related methods
US6990725B2 (en) * 2001-10-05 2006-01-31 Fontanella Mark D Fabrication approaches for the formation of planar inductors and transformers
US6914513B1 (en) 2001-11-08 2005-07-05 Electro-Science Laboratories, Inc. Materials system for low cost, non wire-wound, miniature, multilayer magnetic circuit components
US6624515B1 (en) 2002-03-11 2003-09-23 Micron Technology, Inc. Microelectronic die including low RC under-layer interconnects
US9919472B1 (en) * 2002-05-07 2018-03-20 Microfabrica Inc. Stacking and bonding methods for forming multi-layer, three-dimensional, millimeter scale and microscale structures
US7135952B2 (en) 2002-09-16 2006-11-14 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
KR100479625B1 (ko) * 2002-11-30 2005-03-31 주식회사 쎄라텍 칩타입 파워인덕터 및 그 제조방법
JP3827314B2 (ja) * 2003-03-17 2006-09-27 Tdk株式会社 インダクティブデバイスの製造方法
JP4514031B2 (ja) * 2003-06-12 2010-07-28 株式会社デンソー コイル部品及びコイル部品製造方法
US6990729B2 (en) * 2003-09-05 2006-01-31 Harris Corporation Method for forming an inductor
JP2005150168A (ja) * 2003-11-11 2005-06-09 Murata Mfg Co Ltd 積層コイル部品
JP4479353B2 (ja) * 2004-05-28 2010-06-09 株式会社村田製作所 積層型電子部品
JP2008523627A (ja) 2004-12-07 2008-07-03 マルティ−ファインライン エレクトロニクス インコーポレイテッド 小型回路、誘導部品、及びそれらの製造方法
US7436282B2 (en) 2004-12-07 2008-10-14 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
US7158005B2 (en) * 2005-02-10 2007-01-02 Harris Corporation Embedded toroidal inductor
JP4873522B2 (ja) * 2005-05-10 2012-02-08 Fdk株式会社 積層インダクタ
JP4844045B2 (ja) * 2005-08-18 2011-12-21 Tdk株式会社 電子部品及びその製造方法
JP4530044B2 (ja) * 2005-12-29 2010-08-25 株式会社村田製作所 積層コイル部品
US7875955B1 (en) 2006-03-09 2011-01-25 National Semiconductor Corporation On-chip power inductor
US7645941B2 (en) 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
DE102006022785A1 (de) * 2006-05-16 2007-11-22 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Induktives Bauelement und Verfahren zum Herstellen eines induktiven Bau-elements
US7340825B2 (en) * 2006-07-06 2008-03-11 Harris Corporation Method of making a transformer
US7449987B2 (en) 2006-07-06 2008-11-11 Harris Corporation Transformer and associated method of making
WO2008093568A1 (ja) * 2007-02-02 2008-08-07 Murata Manufacturing Co., Ltd. 積層コイル部品
JP4867698B2 (ja) * 2007-02-20 2012-02-01 Tdk株式会社 薄膜磁気デバイス及びこれを有する電子部品モジュール
US7733207B2 (en) * 2007-05-31 2010-06-08 Electronics And Telecommunications Research Institute Vertically formed inductor and electronic device having the same
DE102007028239A1 (de) * 2007-06-20 2009-01-02 Siemens Ag Monolithisches induktives Bauelement, Verfahren zum Herstellen des Bauelements und Verwendung des Bauelements
DE102007028240B3 (de) * 2007-06-20 2008-12-04 Siemens Ag Verfahren zum Herstellen eines keramischen Mehrschichtkörpers mit lateral strukturierter Keramiklage
JP2009027033A (ja) * 2007-07-20 2009-02-05 Tdk Corp 積層型複合電子部品
JP4877152B2 (ja) * 2007-08-22 2012-02-15 株式会社村田製作所 巻線型電子部品
US9823090B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a target object
JP2009239159A (ja) * 2008-03-28 2009-10-15 Toko Inc 積層型電子部品及びその製造方法
DE102008034691A1 (de) 2008-07-01 2010-03-04 Siemens Aktiengesellschaft Keramischer Mehrschichtkörper, Induktives Bauelement mit dem Mehrschichtkörper und Verfahren zum Herstellen des Mehrschichtkörpers
JP5536656B2 (ja) * 2008-09-18 2014-07-02 ルネサスエレクトロニクス株式会社 半導体装置
US8446243B2 (en) * 2008-10-31 2013-05-21 Infineon Technologies Austria Ag Method of constructing inductors and transformers
JP5190331B2 (ja) * 2008-11-14 2013-04-24 東光株式会社 電子部品及びその製造方法
SE534510C2 (sv) * 2008-11-19 2011-09-13 Silex Microsystems Ab Funktionell inkapsling
JP5327231B2 (ja) * 2008-12-03 2013-10-30 株式会社村田製作所 電子部品
KR20110048717A (ko) * 2009-11-03 2011-05-12 주식회사 이엠따블유 자성체 복합물 및 그 제조방법
US9999129B2 (en) * 2009-11-12 2018-06-12 Intel Corporation Microelectronic device and method of manufacturing same
JP5382144B2 (ja) * 2010-02-01 2014-01-08 株式会社村田製作所 電子部品の製造方法
US8068004B1 (en) * 2010-02-03 2011-11-29 Xilinx, Inc. Embedded inductor
CN101777413A (zh) * 2010-02-11 2010-07-14 深圳顺络电子股份有限公司 一种ltcc低温共烧陶瓷功率电感器
WO2011108701A1 (ja) * 2010-03-05 2011-09-09 株式会社 村田製作所 セラミック電子部品、及びセラミック電子部品の製造方法
US20110291788A1 (en) * 2010-05-26 2011-12-01 Tyco Electronics Corporation Planar inductor devices
US8513771B2 (en) 2010-06-07 2013-08-20 Infineon Technologies Ag Semiconductor package with integrated inductor
CN104133357B (zh) 2010-06-11 2019-05-21 株式会社理光 可拆卸装置、显影剂容器和成像设备
WO2012111203A1 (ja) * 2011-02-15 2012-08-23 株式会社村田製作所 積層型インダクタ素子
US8823133B2 (en) 2011-03-29 2014-09-02 Xilinx, Inc. Interposer having an inductor
DE102011112826B4 (de) * 2011-05-23 2020-06-18 Micro-Epsilon Messtechnik Gmbh & Co. Kg Sensor und Verfahren zur Herstellung des Sensors
US9406738B2 (en) 2011-07-20 2016-08-02 Xilinx, Inc. Inductive structure formed using through silicon vias
KR101504798B1 (ko) * 2011-09-05 2015-03-23 삼성전기주식회사 자성체 기판, 커먼모드필터, 자성체 기판 제조방법 및 커먼모드필터 제조방법
DE102012213263A1 (de) * 2011-09-20 2013-03-21 Robert Bosch Gmbh Handwerkzeugvorrichtung mit zumindest einer Ladespule
US9330823B1 (en) 2011-12-19 2016-05-03 Xilinx, Inc. Integrated circuit structure with inductor in silicon interposer
DE102012201847A1 (de) * 2012-02-08 2013-08-08 Würth Elektronik eiSos Gmbh & Co. KG Elektronisches Bauelement
DE102012003364A1 (de) 2012-02-22 2013-08-22 Phoenix Contact Gmbh & Co. Kg Planarer Übertrager
US9337138B1 (en) 2012-03-09 2016-05-10 Xilinx, Inc. Capacitors within an interposer coupled to supply and ground planes of a substrate
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
JP5598492B2 (ja) * 2012-03-30 2014-10-01 Tdk株式会社 積層コイル部品
US10215550B2 (en) 2012-05-01 2019-02-26 Allegro Microsystems, Llc Methods and apparatus for magnetic sensors having highly uniform magnetic fields
US9817078B2 (en) 2012-05-10 2017-11-14 Allegro Microsystems Llc Methods and apparatus for magnetic sensor having integrated coil
KR101367952B1 (ko) * 2012-05-30 2014-02-28 삼성전기주식회사 적층형 전자부품용 비자성체 조성물, 이를 이용한 적층형 전자부품 및 이의 제조방법
US8754500B2 (en) * 2012-08-29 2014-06-17 International Business Machines Corporation Plated lamination structures for integrated magnetic devices
US10725100B2 (en) 2013-03-15 2020-07-28 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an externally accessible coil
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US9810519B2 (en) 2013-07-19 2017-11-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as tooth detectors
US10145908B2 (en) 2013-07-19 2018-12-04 Allegro Microsystems, Llc Method and apparatus for magnetic sensor producing a changing magnetic field
US10495699B2 (en) 2013-07-19 2019-12-03 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having an integrated coil or magnet to detect a non-ferromagnetic target
GB2529235B (en) * 2014-08-14 2019-05-08 Murata Manufacturing Co An embedded magnetic component device
US9720054B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9823092B2 (en) 2014-10-31 2017-11-21 Allegro Microsystems, Llc Magnetic field sensor providing a movement detector
US10712403B2 (en) 2014-10-31 2020-07-14 Allegro Microsystems, Llc Magnetic field sensor and electronic circuit that pass amplifier current through a magnetoresistance element
US9719806B2 (en) 2014-10-31 2017-08-01 Allegro Microsystems, Llc Magnetic field sensor for sensing a movement of a ferromagnetic target object
KR20160126751A (ko) * 2015-04-24 2016-11-02 삼성전기주식회사 코일 전자부품 및 그 제조방법
FR3045921B1 (fr) * 2015-12-17 2019-07-12 Commissariat A L'energie Atomique Et Aux Energies Alternatives Circuit a inductance integrant une fonction de gestion thermique passive
DE102016203613A1 (de) 2016-03-04 2017-09-07 Würth Elektronik GmbH & Co. KG Elektronisches Bauelement und Verfahren zu dessen Herstellung
US10636560B2 (en) 2016-03-11 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Induction based current sensing
US10566409B2 (en) * 2016-05-10 2020-02-18 Dumitru Nicolae LESENCO Integrated quantized inductor and fabrication method thereof
US10012518B2 (en) 2016-06-08 2018-07-03 Allegro Microsystems, Llc Magnetic field sensor for sensing a proximity of an object
US10041810B2 (en) 2016-06-08 2018-08-07 Allegro Microsystems, Llc Arrangements for magnetic field sensors that act as movement detectors
US10260905B2 (en) 2016-06-08 2019-04-16 Allegro Microsystems, Llc Arrangements for magnetic field sensors to cancel offset variations
WO2018047486A1 (ja) * 2016-09-09 2018-03-15 株式会社村田製作所 積層トロイダルコイルおよびその製造方法
JP6830347B2 (ja) * 2016-12-09 2021-02-17 太陽誘電株式会社 コイル部品
US10984939B2 (en) * 2017-01-30 2021-04-20 Tdk Corporation Multilayer coil component
US10996289B2 (en) 2017-05-26 2021-05-04 Allegro Microsystems, Llc Coil actuated position sensor with reflected magnetic field
US10837943B2 (en) 2017-05-26 2020-11-17 Allegro Microsystems, Llc Magnetic field sensor with error calculation
US11428755B2 (en) 2017-05-26 2022-08-30 Allegro Microsystems, Llc Coil actuated sensor with sensitivity detection
US10324141B2 (en) 2017-05-26 2019-06-18 Allegro Microsystems, Llc Packages for coil actuated position sensors
US10310028B2 (en) 2017-05-26 2019-06-04 Allegro Microsystems, Llc Coil actuated pressure sensor
US10641842B2 (en) 2017-05-26 2020-05-05 Allegro Microsystems, Llc Targets for coil actuated position sensors
US10483343B2 (en) * 2017-06-16 2019-11-19 Huawei Technologies Co., Ltd. Inductors for chip to chip near field communication
JP6984212B2 (ja) 2017-07-28 2021-12-17 Tdk株式会社 コイル部品
CN108155888A (zh) * 2018-01-05 2018-06-12 北京航天微电科技有限公司 一种用于抑制电源电磁干扰的ltcc大功率emi滤波器
US10866117B2 (en) 2018-03-01 2020-12-15 Allegro Microsystems, Llc Magnetic field influence during rotation movement of magnetic target
US20190272936A1 (en) * 2018-03-05 2019-09-05 Intel Corporation Fully embedded magnetic-core in core layer for custom inductor in ic substrate
US11891340B2 (en) * 2018-07-23 2024-02-06 Skyworks Solutions, Inc. Spinel-based oxides containing magnesium, aluminum and titanium and methods of forming articles having same
US11398334B2 (en) * 2018-07-30 2022-07-26 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier comprising embedded inductor with an inlay
US11255700B2 (en) 2018-08-06 2022-02-22 Allegro Microsystems, Llc Magnetic field sensor
US10823586B2 (en) 2018-12-26 2020-11-03 Allegro Microsystems, Llc Magnetic field sensor having unequally spaced magnetic field sensing elements
US11061084B2 (en) 2019-03-07 2021-07-13 Allegro Microsystems, Llc Coil actuated pressure sensor and deflectable substrate
US10955306B2 (en) 2019-04-22 2021-03-23 Allegro Microsystems, Llc Coil actuated pressure sensor and deformable substrate
EP3736839A1 (en) * 2019-05-06 2020-11-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier comprising embedded magnet stack
US11237020B2 (en) 2019-11-14 2022-02-01 Allegro Microsystems, Llc Magnetic field sensor having two rows of magnetic field sensing elements for measuring an angle of rotation of a magnet
US11280637B2 (en) 2019-11-14 2022-03-22 Allegro Microsystems, Llc High performance magnetic angle sensor
US11262422B2 (en) 2020-05-08 2022-03-01 Allegro Microsystems, Llc Stray-field-immune coil-activated position sensor
IT202000028775A1 (it) * 2020-11-27 2022-05-27 St Microelectronics Srl Trasformatore integrato atto ad operare ad elevate tensioni e relativo procedimento di fabbricazione
US11493361B2 (en) 2021-02-26 2022-11-08 Allegro Microsystems, Llc Stray field immune coil-activated sensor
US11578997B1 (en) 2021-08-24 2023-02-14 Allegro Microsystems, Llc Angle sensor using eddy currents
DE102022101327A1 (de) 2022-01-20 2023-07-20 SUMIDA Components & Modules GmbH Ferritrohrkern, Entstördrossel mit einem solchen Ferritrohrkern und Verfahren zum Bilden eines Ferritrohrkerns

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001363A (en) * 1970-03-19 1977-01-04 U.S. Philips Corporation Method of manufacturing a ceramic ferromagnetic object
US3965552A (en) * 1972-07-24 1976-06-29 N L Industries, Inc. Process for forming internal conductors and electrodes
US4301580A (en) * 1977-04-16 1981-11-24 Wallace Clarence L Manufacture of multi-layered electrical assemblies
US4388131A (en) * 1977-05-02 1983-06-14 Burroughs Corporation Method of fabricating magnets
GB2045540B (en) * 1978-12-28 1983-08-03 Tdk Electronics Co Ltd Electrical inductive device
US4583068A (en) * 1984-08-13 1986-04-15 At&T Bell Laboratories Low profile magnetic structure in which one winding acts as support for second winding
US4731297A (en) * 1985-08-20 1988-03-15 Tdk Corporation Laminated components of open magnetic circuit type
US4620916A (en) * 1985-09-19 1986-11-04 Zwemer Dirk A Degradation retardants for electrophoretic display devices
US4959631A (en) * 1987-09-29 1990-09-25 Kabushiki Kaisha Toshiba Planar inductor
US4837659A (en) * 1988-03-21 1989-06-06 Itt Corporation Transformer/inductor with integrated capacitor using soft ferrites
US4880599A (en) * 1988-03-25 1989-11-14 General Electric Company Method of making a ferrite composite containing silver metallization
US4922156A (en) * 1988-04-08 1990-05-01 Itt Corporation Integrated power capacitor and inductors/transformers utilizing insulated amorphous metal ribbon
US4862129A (en) * 1988-04-29 1989-08-29 Itt Corporation Single-turn primary and single-turn secondary flat voltage transformer

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JPH0696940A (ja) 1994-04-08
US5479695A (en) 1996-01-02
JP2637332B2 (ja) 1997-08-06
US5349743A (en) 1994-09-27
DE69202097T2 (de) 1995-08-17
AU1596392A (en) 1992-11-26
FI921968A (fi) 1992-11-03
AU654348B2 (en) 1994-11-03
MX9201989A (es) 1992-11-01
TW198120B (es) 1993-01-11
KR920022325A (ko) 1992-12-19
DE69202097D1 (de) 1995-05-24
EP0512718A1 (en) 1992-11-11
FI921968A0 (fi) 1992-04-30
IL101736A (en) 1995-12-31
HK81296A (en) 1996-05-17
IL101736A0 (en) 1992-12-30
EP0512718B1 (en) 1995-04-19
CA2067008C (en) 1996-07-02
CA2067008A1 (en) 1992-11-03

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