KR850009737U - 다층 프린트 기판의 접지구조체 - Google Patents

다층 프린트 기판의 접지구조체

Info

Publication number
KR850009737U
KR850009737U KR2019840009434U KR840009434U KR850009737U KR 850009737 U KR850009737 U KR 850009737U KR 2019840009434 U KR2019840009434 U KR 2019840009434U KR 840009434 U KR840009434 U KR 840009434U KR 850009737 U KR850009737 U KR 850009737U
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
multilayer printed
ground structure
ground
Prior art date
Application number
KR2019840009434U
Other languages
English (en)
Other versions
KR900002363Y1 (ko
Inventor
시게요시 마쓰다
Original Assignee
알프스덴기 가부시기 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 알프스덴기 가부시기 가이샤 filed Critical 알프스덴기 가부시기 가이샤
Publication of KR850009737U publication Critical patent/KR850009737U/ko
Application granted granted Critical
Publication of KR900002363Y1 publication Critical patent/KR900002363Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Structure Of Printed Boards (AREA)
KR2019840009434U 1983-12-28 1984-09-25 다층 프린트 기판의 접지구조체 KR900002363Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP83-199136 1983-12-28
JP1983199136U JPS60109362U (ja) 1983-12-28 1983-12-28 多層プリント基板のア−ス構造

Publications (2)

Publication Number Publication Date
KR850009737U true KR850009737U (ko) 1985-12-05
KR900002363Y1 KR900002363Y1 (ko) 1990-03-22

Family

ID=16402738

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019840009434U KR900002363Y1 (ko) 1983-12-28 1984-09-25 다층 프린트 기판의 접지구조체

Country Status (3)

Country Link
US (1) US4649461A (ko)
JP (1) JPS60109362U (ko)
KR (1) KR900002363Y1 (ko)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4430798A1 (de) * 1994-08-30 1996-03-07 Siemens Ag Stanzgitter zur Verbindung von elektrischen Bauelementen
JPH0627995Y2 (ja) * 1986-03-20 1994-07-27 株式会社東芝 シ−ルド構造
JPH0669120B2 (ja) * 1986-06-20 1994-08-31 松下電器産業株式会社 シ−ルド装置
JPS63127254U (ko) * 1987-02-09 1988-08-19
US4873764A (en) * 1987-12-23 1989-10-17 Zenith Electronics Corporation Component mounting process for printed circuit boards
JP2631544B2 (ja) * 1989-01-27 1997-07-16 日本シイエムケイ株式会社 プリント配線板
US5162971A (en) * 1989-03-23 1992-11-10 Matsushita Electric Industrial Co., Ltd. High-density circuit module and process for producing same
US5250342A (en) * 1989-05-24 1993-10-05 United Technologies Corporation Composite EMI shield having clean, highly conductive surfaces for conductive bonding
US5235492A (en) * 1990-04-24 1993-08-10 Motorola, Inc. Electromagnetic shielding apparatus for cellular telephones
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference
US5313015A (en) * 1991-12-31 1994-05-17 Schlegel Corporation Ground plane shield
US5311407A (en) * 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components
FR2697715B1 (fr) * 1992-10-30 1994-12-30 Dav Circuit imprimé double face et ensemble de conduction électrique comprenant un tel circuit imprimé.
JPH07105759B2 (ja) * 1993-03-30 1995-11-13 山一電機株式会社 光電変換器
JP3153711B2 (ja) * 1994-07-27 2001-04-09 シャープ株式会社 アップダウンチューナ
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
JP3011944U (ja) * 1994-12-01 1995-06-06 船井電機株式会社 電気機器
US5691504A (en) * 1995-05-05 1997-11-25 Dell Usa, L.P. Multilayer computer chassis having integral circuit board mounting and grounding structure
US5796593A (en) * 1996-01-25 1998-08-18 Dell Usa, L.P. Planar mounts capable of mounting planars of varying thickness
DE19700666A1 (de) * 1996-03-08 1998-07-16 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Elektrische Schaltungsanordnung für den Betrieb von elektrischen Lampen
JPH09326586A (ja) * 1996-06-05 1997-12-16 Alps Electric Co Ltd 高周波電子機器
FR2775553B1 (fr) * 1998-03-02 2000-05-19 Valeo Electronique Raccordement d'un point d'une carte electronique a circuit imprime sur un substrat metallique qui porte ladite carte
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6985341B2 (en) 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
US6698060B1 (en) * 2002-06-10 2004-03-02 Hando Industrial Co., Ltd. Caster structure
TW549530U (en) * 2002-11-29 2003-08-21 Hon Hai Prec Ind Co Ltd Case for portable storage peripheral
US8365397B2 (en) * 2007-08-02 2013-02-05 Em Research, Inc. Method for producing a circuit board comprising a lead frame
KR102172314B1 (ko) * 2013-11-12 2020-10-30 삼성전자주식회사 반도체 장치
TWI558277B (zh) * 2014-08-19 2016-11-11 乾坤科技股份有限公司 電路板層間導電結構、磁性元件及其製作方法
US9883582B2 (en) * 2015-11-20 2018-01-30 Hamilton Sundstrand Corporation Circuit boards and circuit board assemblies
JP6929820B2 (ja) * 2018-05-23 2021-09-01 ミネベアミツミ株式会社 回路基板、モータユニット、およびファン
US10667398B1 (en) * 2018-09-26 2020-05-26 United States Of America As Represented By The Administrator Of Nasa Dual dynamic random (DDR) access memory interface design for aerospace printed circuit boards
US11152903B2 (en) 2019-10-22 2021-10-19 Texas Instruments Incorporated Ground noise suppression on a printed circuit board
KR102582898B1 (ko) * 2021-06-01 2023-09-27 이홍재 사랑의 열매 핀구조

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE820915C (de) * 1948-04-16 1951-11-15 Robert Kapp Verfahren zur Herstellung von vielteiligen elektrischen und radio-elektrischen Apparaten
US2869040A (en) * 1954-01-11 1959-01-13 Sylvania Electric Prod Solder-dipped stamped wiring
US2923860A (en) * 1957-08-22 1960-02-02 Miller John Dawson Printed circuit board
US3151278A (en) * 1960-08-22 1964-09-29 Amphenol Borg Electronics Corp Electronic circuit module with weldable terminals
US3272909A (en) * 1964-11-04 1966-09-13 Avco Corp Printed circuit package with indicia
US3443160A (en) * 1966-03-10 1969-05-06 Gen Motors Corp Electronic module assembly and connector means therefor
US3296099A (en) * 1966-05-16 1967-01-03 Western Electric Co Method of making printed circuits
JPS4826069B1 (ko) * 1968-03-04 1973-08-04
GB1261039A (en) * 1968-10-02 1972-01-19 Elliott Brothers London Ltd Improvements relating to printed circuit assemblies
US3719860A (en) * 1971-09-30 1973-03-06 Burroughs Corp Circuit component mounting with cooling plate
US3806767A (en) * 1973-03-15 1974-04-23 Tek Wave Inc Interboard connector
US3977074A (en) * 1975-02-06 1976-08-31 General Motors Corporation Double sided printed circuit board and method for making same
JPS56140689A (en) * 1980-04-01 1981-11-04 Matsushita Electric Ind Co Ltd Cirucuit unit using printed circuit board
US4498119A (en) * 1980-11-03 1985-02-05 Lockheed Corporation Electronic circuit board and method and apparatus for thermal management thereof
JPS5831752A (ja) * 1981-08-21 1983-02-24 株式会社ノダ 艶消し模様と艶有り模様部分を混在した化粧材およびその製造方法
JPS58131798A (ja) * 1982-01-29 1983-08-05 ソニー株式会社 多層配線基板

Also Published As

Publication number Publication date
US4649461A (en) 1987-03-10
JPS60109362U (ja) 1985-07-25
JPH0223024Y2 (ko) 1990-06-21
KR900002363Y1 (ko) 1990-03-22

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee