KR840006487U - 다층 프린트 배선판 - Google Patents

다층 프린트 배선판

Info

Publication number
KR840006487U
KR840006487U KR2019840001919U KR840001919U KR840006487U KR 840006487 U KR840006487 U KR 840006487U KR 2019840001919 U KR2019840001919 U KR 2019840001919U KR 840001919 U KR840001919 U KR 840001919U KR 840006487 U KR840006487 U KR 840006487U
Authority
KR
South Korea
Prior art keywords
wiring board
printed wiring
multilayer printed
multilayer
board
Prior art date
Application number
KR2019840001919U
Other languages
English (en)
Other versions
KR880003047Y1 (ko
Inventor
아더 브루어 제임스
케네디 랜그우드 죤
로젠 마크암 하베이
Original Assignee
인터내셔널 비지네스 머신즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인터내셔널 비지네스 머신즈 코포레이션 filed Critical 인터내셔널 비지네스 머신즈 코포레이션
Publication of KR840006487U publication Critical patent/KR840006487U/ko
Application granted granted Critical
Publication of KR880003047Y1 publication Critical patent/KR880003047Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
KR2019840001919U 1983-03-08 1984-03-07 다층 프린트 배선판 KR880003047Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US47337683A 1983-03-08 1983-03-08
US473,377 1983-03-08

Publications (2)

Publication Number Publication Date
KR840006487U true KR840006487U (ko) 1984-12-03
KR880003047Y1 KR880003047Y1 (ko) 1988-08-31

Family

ID=23879279

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019840001919U KR880003047Y1 (ko) 1983-03-08 1984-03-07 다층 프린트 배선판

Country Status (7)

Country Link
KR (1) KR880003047Y1 (ko)
BR (1) BR8401006A (ko)
DE (1) DE3408045A1 (ko)
ES (2) ES277526Y (ko)
GB (1) GB2139007B (ko)
HK (1) HK17790A (ko)
IT (2) IT1196038B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8924229D0 (en) * 1989-10-27 1989-12-13 Bicc Plc An improved circuit board
GB8924282D0 (en) * 1989-10-27 1989-12-13 Bicc Plc An improved circuit board
ES2111470B1 (es) * 1995-08-07 1998-11-01 Mecanismos Aux Ind Integracion electronica en cajas de servicios.

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3253246A (en) * 1963-07-30 1966-05-24 Ibm Printed circuit card connector
FR2223934B1 (ko) * 1973-03-26 1979-01-12 Cii Honeywell Bull

Also Published As

Publication number Publication date
ES277526Y (es) 1985-03-01
GB2139007B (en) 1986-10-01
KR880003047Y1 (ko) 1988-08-31
IT1196038B (it) 1988-11-10
IT1196039B (it) 1988-11-10
ES277525U (es) 1984-07-16
ES277525Y (es) 1985-03-01
DE3408045A1 (de) 1984-12-06
ES277526U (es) 1984-07-16
GB8405863D0 (en) 1984-04-11
IT8419881A0 (it) 1984-03-02
BR8401006A (pt) 1984-10-16
GB2139007A (en) 1984-10-31
IT8419882A0 (it) 1984-03-02
HK17790A (en) 1990-03-16

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee