DE3676822D1 - Mehrschichtige gedruckte verdrahtungsplatte. - Google Patents

Mehrschichtige gedruckte verdrahtungsplatte.

Info

Publication number
DE3676822D1
DE3676822D1 DE8787900434T DE3676822T DE3676822D1 DE 3676822 D1 DE3676822 D1 DE 3676822D1 DE 8787900434 T DE8787900434 T DE 8787900434T DE 3676822 T DE3676822 T DE 3676822T DE 3676822 D1 DE3676822 D1 DE 3676822D1
Authority
DE
Germany
Prior art keywords
wiring board
printed wiring
multilayer printed
multilayer
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787900434T
Other languages
English (en)
Inventor
T Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCR International Inc
Original Assignee
NCR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCR Corp filed Critical NCR Corp
Application granted granted Critical
Publication of DE3676822D1 publication Critical patent/DE3676822D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
DE8787900434T 1985-12-20 1986-11-28 Mehrschichtige gedruckte verdrahtungsplatte. Expired - Lifetime DE3676822D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81118885A 1985-12-20 1985-12-20
PCT/US1986/002569 WO1987004040A1 (en) 1985-12-20 1986-11-28 Multilayer printed circuit board

Publications (1)

Publication Number Publication Date
DE3676822D1 true DE3676822D1 (de) 1991-02-14

Family

ID=25205819

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787900434T Expired - Lifetime DE3676822D1 (de) 1985-12-20 1986-11-28 Mehrschichtige gedruckte verdrahtungsplatte.

Country Status (5)

Country Link
EP (1) EP0253833B1 (de)
JP (1) JPS63501996A (de)
CA (1) CA1260625A (de)
DE (1) DE3676822D1 (de)
WO (1) WO1987004040A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061824A (en) * 1989-08-23 1991-10-29 Ncr Corporation Backpanel having multiple logic family signal layers
JPH0828583B2 (ja) * 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ
CN107728043B (zh) * 2017-11-15 2020-08-28 奥士康科技股份有限公司 一种电路板测试方法及电路板测试系统

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4159508A (en) * 1975-12-22 1979-06-26 Fujitsu Limited Multilayer printed wiring board
DE2934410C3 (de) * 1978-08-25 1981-11-26 Fujitsu Ltd., Kawasaki, Kanagawa Gedruckte Schaltung
GB2092830B (en) * 1981-02-09 1985-04-17 Int Computers Ltd Multilayer printed circuit board

Also Published As

Publication number Publication date
WO1987004040A1 (en) 1987-07-02
EP0253833B1 (de) 1991-01-09
CA1260625A (en) 1989-09-26
JPS63501996A (ja) 1988-08-04
EP0253833A1 (de) 1988-01-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NCR INTERNATIONAL INC., DAYTON, OHIO, US

8328 Change in the person/name/address of the agent

Free format text: KAHLER, K., DIPL.-ING., 8948 MINDELHEIM KAECK, J., DIPL.-ING. DIPL.-WIRTSCH.-ING., 8910 LANDSBERG FIENER, J., PAT.-ANWAELTE, 8948 MINDELHEIM

8327 Change in the person/name/address of the patent owner

Owner name: AT&T GLOBAL INFORMATION SOLUTIONS INTERNATIONAL IN

8339 Ceased/non-payment of the annual fee