ES2025121B3 - Tablero de conexion impreso. - Google Patents
Tablero de conexion impreso.Info
- Publication number
- ES2025121B3 ES2025121B3 ES87115866T ES87115866T ES2025121B3 ES 2025121 B3 ES2025121 B3 ES 2025121B3 ES 87115866 T ES87115866 T ES 87115866T ES 87115866 T ES87115866 T ES 87115866T ES 2025121 B3 ES2025121 B3 ES 2025121B3
- Authority
- ES
- Spain
- Prior art keywords
- connection board
- printed connection
- printed
- board
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62086606A JPH0614587B2 (ja) | 1987-04-08 | 1987-04-08 | プリント配線板 |
JP8660887A JPH069304B2 (ja) | 1987-04-08 | 1987-04-08 | プリント配線板 |
JP8660787A JPH069300B2 (ja) | 1987-04-08 | 1987-04-08 | プリント配線板 |
JP62086605A JPH069303B2 (ja) | 1987-04-08 | 1987-04-08 | プリント配線板 |
JP62086604A JPH069302B2 (ja) | 1987-04-08 | 1987-04-08 | プリント配線板 |
JP9603887A JPS63261788A (ja) | 1987-04-17 | 1987-04-17 | プリント配線板 |
JP9603687A JPS63261786A (ja) | 1987-04-17 | 1987-04-17 | プリント配線板 |
JP62096034A JPH06103782B2 (ja) | 1987-04-17 | 1987-04-17 | プリント配線板 |
JP9603587A JPS63261785A (ja) | 1987-04-17 | 1987-04-17 | プリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2025121B3 true ES2025121B3 (es) | 1992-03-16 |
Family
ID=27577235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES87115866T Expired - Lifetime ES2025121B3 (es) | 1987-04-08 | 1987-10-29 | Tablero de conexion impreso. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4806706A (es) |
EP (1) | EP0285701B1 (es) |
DE (1) | DE3771707D1 (es) |
ES (1) | ES2025121B3 (es) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0397929A1 (en) * | 1989-05-17 | 1990-11-22 | Soltec B.V. | Printed circuit board with improved soldering qualities |
JPH0423485A (ja) * | 1990-05-18 | 1992-01-27 | Cmk Corp | プリント配線板とその製造法 |
JPH0480988A (ja) * | 1990-07-24 | 1992-03-13 | Cmk Corp | プリント配線板の製造方法 |
GB2258183A (en) * | 1991-08-01 | 1993-02-03 | Motorola Inc | Solder mask defined printed circuit board |
JP2678958B2 (ja) * | 1992-03-02 | 1997-11-19 | カシオ計算機株式会社 | フィルム配線基板およびその製造方法 |
WO1994004305A1 (en) * | 1992-08-18 | 1994-03-03 | Precision Dispensing Equipment, Inc. | Method and apparatus for applying flux |
US5313021A (en) * | 1992-09-18 | 1994-05-17 | Aptix Corporation | Circuit board for high pin count surface mount pin grid arrays |
JP3370393B2 (ja) * | 1993-09-27 | 2003-01-27 | 富士通株式会社 | プリント回路基板 |
US5446247A (en) * | 1993-11-19 | 1995-08-29 | Motorola, Inc. | Electrical contact and method for making an electrical contact |
US5587342A (en) * | 1995-04-03 | 1996-12-24 | Motorola, Inc. | Method of forming an electrical interconnect |
US5884397A (en) * | 1996-08-06 | 1999-03-23 | International Business Machines Corporation | Method for fabricating chip carriers and printed circuit boards |
US6693358B2 (en) * | 2000-10-23 | 2004-02-17 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device |
JP2002240192A (ja) * | 2001-02-15 | 2002-08-28 | Minebea Co Ltd | 片面紙フェノール樹脂銅張積層板 |
US7377032B2 (en) * | 2003-11-21 | 2008-05-27 | Mitsui Mining & Smelting Co., Ltd. | Process for producing a printed wiring board for mounting electronic components |
CN104394654B (zh) * | 2014-10-08 | 2018-07-13 | 皆利士多层线路版(中山)有限公司 | 印刷线路板及绿油封孔工艺 |
JP2016207952A (ja) | 2015-04-28 | 2016-12-08 | 富士通株式会社 | 部品内蔵基板 |
CN115529714A (zh) * | 2021-06-25 | 2022-12-27 | 全亿大科技(佛山)有限公司 | 线路板及制作方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4390615A (en) * | 1979-11-05 | 1983-06-28 | Courtney Robert W | Coating compositions |
JPS5724775U (es) * | 1980-07-17 | 1982-02-08 | ||
US4389771A (en) * | 1981-01-05 | 1983-06-28 | Western Electric Company, Incorporated | Treatment of a substrate surface to reduce solder sticking |
DE8110967U1 (de) * | 1981-04-10 | 1982-11-11 | Braun Ag, 6000 Frankfurt | Schaltvorrichtung fuer elektrisch gespeiste, mit leiterplatten ausgestattete kleingeraete |
DE3320183A1 (de) * | 1983-06-03 | 1984-12-06 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Verfahren zum herstellen gedruckter schaltungen |
-
1987
- 1987-10-21 US US07/112,095 patent/US4806706A/en not_active Expired - Lifetime
- 1987-10-29 EP EP87115866A patent/EP0285701B1/en not_active Expired - Lifetime
- 1987-10-29 ES ES87115866T patent/ES2025121B3/es not_active Expired - Lifetime
- 1987-10-29 DE DE8787115866T patent/DE3771707D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE3771707D1 (de) | 1991-08-29 |
EP0285701B1 (en) | 1991-07-24 |
EP0285701A1 (en) | 1988-10-12 |
US4806706A (en) | 1989-02-21 |
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