KR880702043A - 다층프린트배선판 및 그 제조방법 - Google Patents
다층프린트배선판 및 그 제조방법Info
- Publication number
- KR880702043A KR880702043A KR1019880700696A KR880700696A KR880702043A KR 880702043 A KR880702043 A KR 880702043A KR 1019880700696 A KR1019880700696 A KR 1019880700696A KR 880700696 A KR880700696 A KR 880700696A KR 880702043 A KR880702043 A KR 880702043A
- Authority
- KR
- South Korea
- Prior art keywords
- manufacturing
- wiring board
- printed wiring
- multilayer printed
- multilayer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5205—Sealing means between cable and housing, e.g. grommet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP86-249191 | 1986-10-20 | ||
JP61249191A JPH0754874B2 (ja) | 1986-10-20 | 1986-10-20 | 多層プリント配線板 |
PCT/JP1987/000801 WO1988002978A1 (en) | 1986-10-20 | 1987-10-19 | Multi-layer printed circuit board and a method of fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880702043A true KR880702043A (ko) | 1988-11-07 |
KR900009091B1 KR900009091B1 (ko) | 1990-12-20 |
Family
ID=17189251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880700696A KR900009091B1 (ko) | 1986-10-20 | 1987-10-19 | 다층프린트배선판 및 그 제조방법 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0287681A1 (ko) |
JP (1) | JPH0754874B2 (ko) |
KR (1) | KR900009091B1 (ko) |
WO (1) | WO1988002978A1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09107162A (ja) * | 1995-10-13 | 1997-04-22 | Murata Mfg Co Ltd | プリント回路基板 |
US6459605B1 (en) | 2000-08-11 | 2002-10-01 | American Superconductor Corp. | Low inductance transistor module with distributed bus |
US6472613B1 (en) * | 2000-09-29 | 2002-10-29 | American Superconductor Corporation | Low-inductance connector for printed-circuit board |
KR20030020464A (ko) * | 2001-08-29 | 2003-03-10 | 주식회사 팬택앤큐리텔 | 단차를 갖는 인쇄회기판 |
US20080295327A1 (en) * | 2007-06-01 | 2008-12-04 | 3M Innovative Properties Company | Flexible circuit |
JP2009206324A (ja) * | 2008-02-28 | 2009-09-10 | Fuji Electric Systems Co Ltd | 多層プリント配線基板 |
TWI573503B (zh) * | 2014-06-09 | 2017-03-01 | The Power Supply Path Structure of Soft Circuit Board | |
KR102514383B1 (ko) * | 2015-11-13 | 2023-03-28 | 삼성전자주식회사 | 인쇄회로기판을 포함하는 전자 장치 |
JP2018137343A (ja) * | 2017-02-22 | 2018-08-30 | 株式会社日立産機システム | プリント配線板およびインバータ |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60101997A (ja) * | 1983-11-08 | 1985-06-06 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
JPS60101774U (ja) * | 1983-12-14 | 1985-07-11 | 日本ビクター株式会社 | プリント基板 |
JPS60196998A (ja) * | 1984-03-19 | 1985-10-05 | 東芝ケミカル株式会社 | 多層回路基板の識別方法 |
JPS6127270U (ja) * | 1984-07-18 | 1986-02-18 | 三菱電機株式会社 | プリント配線装置 |
-
1986
- 1986-10-20 JP JP61249191A patent/JPH0754874B2/ja not_active Expired - Fee Related
-
1987
- 1987-10-19 KR KR1019880700696A patent/KR900009091B1/ko active IP Right Grant
- 1987-10-19 WO PCT/JP1987/000801 patent/WO1988002978A1/ja not_active Application Discontinuation
- 1987-10-19 EP EP87906790A patent/EP0287681A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JPS63102397A (ja) | 1988-05-07 |
KR900009091B1 (ko) | 1990-12-20 |
EP0287681A1 (en) | 1988-10-26 |
JPH0754874B2 (ja) | 1995-06-07 |
WO1988002978A1 (en) | 1988-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
NORF | Unpaid initial registration fee |