KR900012518A - 양면배선기판의 제조방법 - Google Patents

양면배선기판의 제조방법

Info

Publication number
KR900012518A
KR900012518A KR1019900000685A KR900000685A KR900012518A KR 900012518 A KR900012518 A KR 900012518A KR 1019900000685 A KR1019900000685 A KR 1019900000685A KR 900000685 A KR900000685 A KR 900000685A KR 900012518 A KR900012518 A KR 900012518A
Authority
KR
South Korea
Prior art keywords
double
manufacturing
wiring board
sided wiring
sided
Prior art date
Application number
KR1019900000685A
Other languages
English (en)
Other versions
KR920005072B1 (ko
Inventor
요시오 야리다
가즈요시 시라끼
Original Assignee
가시오 게이상기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1011368A external-priority patent/JPH02192793A/ja
Priority claimed from JP1048777A external-priority patent/JPH02228092A/ja
Application filed by 가시오 게이상기 가부시끼가이샤 filed Critical 가시오 게이상기 가부시끼가이샤
Publication of KR900012518A publication Critical patent/KR900012518A/ko
Application granted granted Critical
Publication of KR920005072B1 publication Critical patent/KR920005072B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0221—Perforating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1019900000685A 1989-01-20 1990-01-20 양면배선기판의 제조방법 KR920005072B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP89-11368 1989-01-20
JP1011368A JPH02192793A (ja) 1989-01-20 1989-01-20 両面配線基板の製造方法
JP89-48777 1989-03-01
JP1048777A JPH02228092A (ja) 1989-03-01 1989-03-01 両面配線基板の製造方法

Publications (2)

Publication Number Publication Date
KR900012518A true KR900012518A (ko) 1990-08-04
KR920005072B1 KR920005072B1 (ko) 1992-06-26

Family

ID=26346784

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900000685A KR920005072B1 (ko) 1989-01-20 1990-01-20 양면배선기판의 제조방법

Country Status (2)

Country Link
US (1) US5049244A (ko)
KR (1) KR920005072B1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3345691B2 (ja) * 1993-11-01 2002-11-18 ポリプラスチックス株式会社 コネクターの製造方法
US5979048A (en) * 1995-06-21 1999-11-09 Polyplastics, Co., Inc. Method of manufacturing connectors
JP4683769B2 (ja) * 2001-05-31 2011-05-18 三井金属鉱業株式会社 銅メッキ回路層付銅張積層板及びその銅メッキ回路層付銅張積層板を用いたプリント配線板の製造方法
JP2006229034A (ja) * 2005-02-18 2006-08-31 Toshiba Corp 配線基板とその製造方法
KR20120135433A (ko) * 2005-04-21 2012-12-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 소자, 발광 장치 및 전자 장치
EP2129199A1 (en) * 2008-05-28 2009-12-02 LG Electronics Inc. Method of manufactoring flexible film
KR102179672B1 (ko) * 2019-05-29 2020-11-17 주식회사 테토스 기판 측면부 배선 형성 방법
CN111599754B (zh) * 2020-06-19 2022-03-15 绍兴同芯成集成电路有限公司 一种超薄晶圆加工工艺
CN111710647B (zh) * 2020-07-06 2022-03-15 绍兴同芯成集成电路有限公司 一种开窗孔双面电镀厚铜膜工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
US3854973A (en) * 1970-01-26 1974-12-17 Macdermid Inc Method of making additive printed circuit boards
US3934335A (en) * 1974-10-16 1976-01-27 Texas Instruments Incorporated Multilayer printed circuit board
US4217182A (en) * 1978-06-07 1980-08-12 Litton Systems, Inc. Semi-additive process of manufacturing a printed circuit
US4554732A (en) * 1982-02-16 1985-11-26 General Electric Company High reliability electrical components
US4604799A (en) * 1982-09-03 1986-08-12 John Fluke Mfg. Co., Inc. Method of making molded circuit board
US4908094A (en) * 1986-04-14 1990-03-13 International Business Machines Corporation Method for laminating organic materials via surface modification
US4761303A (en) * 1986-11-10 1988-08-02 Macdermid, Incorporated Process for preparing multilayer printed circuit boards
US4964947A (en) * 1989-01-20 1990-10-23 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate

Also Published As

Publication number Publication date
US5049244A (en) 1991-09-17
KR920005072B1 (ko) 1992-06-26

Similar Documents

Publication Publication Date Title
KR890016886A (ko) 인쇄 회로판의 제조방법
KR900012519A (ko) 양면배선기판의 제조방법
NO176079C (no) Integrert kretskort
KR900013972U (ko) 전자부품의 접속구조
DE69033784D1 (de) Gedruckte Schaltungsplatte
KR900012518A (ko) 양면배선기판의 제조방법
KR880702043A (ko) 다층프린트배선판 및 그 제조방법
KR890015480A (ko) 인쇄 배선판의 제조방법
KR900013822A (ko) 배선기판 및 그의 제조법
IT9022326A1 (it) Tabellone
KR890012247U (ko) 회로 기판 고정구
KR850004578U (ko) 배선기판
KR900016368U (ko) 조립식 회로기판의 받침대
FR2648943B1 (fr) Circuit echantillonneur-bloqueur
KR910001198U (ko) 회로기판 테스터
SE8901828D0 (sv) Isoleringsskiva
IT217903Z2 (it) Scheda elettronica di allarme per fanali di navigazione
KR860009166U (ko) 회로 기판 고정장치
BR8702555A (pt) Ducha eletronica
KR880009114U (ko) 프린트 회로 기판 고정구
KR900017695U (ko) 음향기기의 슬립회로
KR880013208U (ko) 프린트 배선판
KR870014063U (ko) 프린트 배선기판
KR880003790U (ko) 프린트 배선 기판
KR910005910U (ko) 건축용 조립판재

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19950503

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee