KR900012519A - 양면배선기판의 제조방법 - Google Patents

양면배선기판의 제조방법

Info

Publication number
KR900012519A
KR900012519A KR1019900000686A KR900000686A KR900012519A KR 900012519 A KR900012519 A KR 900012519A KR 1019900000686 A KR1019900000686 A KR 1019900000686A KR 900000686 A KR900000686 A KR 900000686A KR 900012519 A KR900012519 A KR 900012519A
Authority
KR
South Korea
Prior art keywords
double
manufacturing
wiring board
sided wiring
sided
Prior art date
Application number
KR1019900000686A
Other languages
English (en)
Other versions
KR920005070B1 (ko
Inventor
요시오 야리다
가즈요시 시라끼
Original Assignee
가시오 게이상기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1011366A external-priority patent/JPH02192789A/ja
Priority claimed from JP2062389A external-priority patent/JP2699514B2/ja
Application filed by 가시오 게이상기 가부시끼가이샤 filed Critical 가시오 게이상기 가부시끼가이샤
Publication of KR900012519A publication Critical patent/KR900012519A/ko
Application granted granted Critical
Publication of KR920005070B1 publication Critical patent/KR920005070B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1019900000686A 1989-01-20 1990-01-20 양면배선기판의 제조방법 KR920005070B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1011366A JPH02192789A (ja) 1989-01-20 1989-01-20 両面配線基板の製造方法
JP89-11366 1989-01-20
JP2062389A JP2699514B2 (ja) 1989-01-30 1989-01-30 両面配線基板の製造方法
JP89-20623 1989-01-30

Publications (2)

Publication Number Publication Date
KR900012519A true KR900012519A (ko) 1990-08-04
KR920005070B1 KR920005070B1 (ko) 1992-06-26

Family

ID=26346779

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900000686A KR920005070B1 (ko) 1989-01-20 1990-01-20 양면배선기판의 제조방법

Country Status (2)

Country Link
US (2) US4964947A (ko)
KR (1) KR920005070B1 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5049244A (en) * 1989-01-20 1991-09-17 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
US4964947A (en) * 1989-01-20 1990-10-23 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
US5013402A (en) * 1989-01-20 1991-05-07 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate
US5066360A (en) * 1990-09-24 1991-11-19 International Business Machines Corp. Pad printing of resist over via holes
US5628921A (en) * 1991-02-14 1997-05-13 Beckett Technologies Corp. Demetallizing procedure
JP3166251B2 (ja) * 1991-12-18 2001-05-14 株式会社村田製作所 セラミック多層電子部品の製造方法
US5681441A (en) * 1992-12-22 1997-10-28 Elf Technologies, Inc. Method for electroplating a substrate containing an electroplateable pattern
US5621193A (en) * 1995-05-23 1997-04-15 Northrop Grumman Corporation Ceramic edge connect process
DE10062840A1 (de) * 2000-12-15 2002-06-20 Giesecke & Devrient Gmbh Durchkontaktierung von flexiblen Leiterplatten
US20030207212A1 (en) * 2002-05-02 2003-11-06 Law Benjamin Pain-Fong Micro-optics device and method for fabricating
JP2006229034A (ja) * 2005-02-18 2006-08-31 Toshiba Corp 配線基板とその製造方法
US20070204957A1 (en) * 2006-03-01 2007-09-06 Braymen Steven D Plasma processing of large workpieces
JP5161617B2 (ja) * 2008-03-03 2013-03-13 日本メクトロン株式会社 フレキシブル回路基板、及びその製造方法
KR20090119671A (ko) * 2008-05-16 2009-11-19 엘지전자 주식회사 연성필름 및 이를 포함하는 표시장치
EP2120520B1 (en) * 2008-05-16 2012-03-07 LG Electronics Inc. Flexible film and display device including the same
EP2146561A1 (en) * 2008-05-28 2010-01-20 LG Electronics Inc. Flexible film and display device including the same
KR101084572B1 (ko) * 2008-05-28 2011-11-17 엘지전자 주식회사 연성필름 및 이를 포함하는 표시장치
KR102067846B1 (ko) * 2011-06-06 2020-01-17 디에스엠 아이피 어셋츠 비.브이. 금속박 패턴 적층체, 금속박 적층체, 금속박 적층 기판, 태양 전지 모듈 및 금속박 패턴 적층체의 제조 방법
KR101753225B1 (ko) * 2015-06-02 2017-07-19 에더트로닉스코리아 (주) Ｌｄｓ 공법을 이용한 적층 회로 제작 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2849298A (en) * 1955-05-03 1958-08-26 St Regis Paper Co Printed circuitry laminates and production thereof
US2848359A (en) * 1955-06-20 1958-08-19 Gen Am Transport Methods of making printed electric circuits
US3154478A (en) * 1957-11-04 1964-10-27 Gen Am Transport Chemical nickel plating processes and baths and methods of making printed electric circuits
US3134690A (en) * 1960-02-09 1964-05-26 Eriksson Lars Erik Method for deposition of a copper layer on a non-conductive material
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
US3854973A (en) * 1970-01-26 1974-12-17 Macdermid Inc Method of making additive printed circuit boards
US4217182A (en) * 1978-06-07 1980-08-12 Litton Systems, Inc. Semi-additive process of manufacturing a printed circuit
US4303798A (en) * 1979-04-27 1981-12-01 Kollmorgen Technologies Corporation Heat shock resistant printed circuit board assemblies
US4608274A (en) * 1982-08-06 1986-08-26 Faultless Pcbs Method of manufacturing circuit boards
DE3408630A1 (de) * 1984-03-09 1985-09-12 Hoechst Ag, 6230 Frankfurt Verfahren und schichtmaterial zur herstellung durchkontaktierter elektrischer leiterplatten
JPS60208888A (ja) * 1984-04-03 1985-10-21 カシオ計算機株式会社 フレキシブル基板の製造方法
JPS60208894A (ja) * 1984-04-03 1985-10-21 カシオ計算機株式会社 フレキシブル基板の製造方法
US4561931A (en) * 1984-12-21 1985-12-31 Rca Corporation Method including producing a stencil from layer of dichromate-sensitized PVA and fluorescein-type dye
US4682415A (en) * 1985-10-28 1987-07-28 U.S. Product Development Company Method of making printed circuits
US4756795A (en) * 1986-10-31 1988-07-12 International Business Machines Corporation Raw card fabrication process with nickel overplate
US4761303A (en) * 1986-11-10 1988-08-02 Macdermid, Incorporated Process for preparing multilayer printed circuit boards
ATE56050T1 (de) * 1987-04-24 1990-09-15 Siemens Ag Verfahren zur herstellung von leiterplatten.
US4964947A (en) * 1989-01-20 1990-10-23 Casio Computer Co., Ltd. Method of manufacturing double-sided wiring substrate

Also Published As

Publication number Publication date
US5092958A (en) 1992-03-03
US4964947A (en) 1990-10-23
KR920005070B1 (ko) 1992-06-26

Similar Documents

Publication Publication Date Title
KR890016886A (ko) 인쇄 회로판의 제조방법
KR900012519A (ko) 양면배선기판의 제조방법
KR900013972U (ko) 전자부품의 접속구조
DE69033784D1 (de) Gedruckte Schaltungsplatte
KR900012518A (ko) 양면배선기판의 제조방법
KR880702043A (ko) 다층프린트배선판 및 그 제조방법
KR890015480A (ko) 인쇄 배선판의 제조방법
KR900013822A (ko) 배선기판 및 그의 제조법
IT9022326A0 (it) Tabellone
KR890012247U (ko) 회로 기판 고정구
KR850004578U (ko) 배선기판
KR900016368U (ko) 조립식 회로기판의 받침대
FR2648943B1 (fr) Circuit echantillonneur-bloqueur
KR910001198U (ko) 회로기판 테스터
SE8901828D0 (sv) Isoleringsskiva
KR900011352A (ko) 세라믹 회로기판 및 회로형성방법
IT217903Z2 (it) Scheda elettronica di allarme per fanali di navigazione
KR860009166U (ko) 회로 기판 고정장치
BR8702555A (pt) Ducha eletronica
KR880009114U (ko) 프린트 회로 기판 고정구
KR900017695U (ko) 음향기기의 슬립회로
KR880003790U (ko) 프린트 배선 기판
KR880013208U (ko) 프린트 배선판
KR870014063U (ko) 프린트 배선기판
KR910005910U (ko) 건축용 조립판재

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19950503

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee