GB2202094B - Multilayer printed circuit board - Google Patents

Multilayer printed circuit board

Info

Publication number
GB2202094B
GB2202094B GB8801471A GB8801471A GB2202094B GB 2202094 B GB2202094 B GB 2202094B GB 8801471 A GB8801471 A GB 8801471A GB 8801471 A GB8801471 A GB 8801471A GB 2202094 B GB2202094 B GB 2202094B
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
multilayer printed
multilayer
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8801471A
Other versions
GB2202094A (en
GB8801471D0 (en
Inventor
Phillip George Breret Hamilton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of GB8801471D0 publication Critical patent/GB8801471D0/en
Publication of GB2202094A publication Critical patent/GB2202094A/en
Application granted granted Critical
Publication of GB2202094B publication Critical patent/GB2202094B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
GB8801471A 1987-03-10 1988-01-22 Multilayer printed circuit board Expired - Fee Related GB2202094B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB878705543A GB8705543D0 (en) 1987-03-10 1987-03-10 Printed circuit board

Publications (3)

Publication Number Publication Date
GB8801471D0 GB8801471D0 (en) 1988-02-24
GB2202094A GB2202094A (en) 1988-09-14
GB2202094B true GB2202094B (en) 1990-09-26

Family

ID=10613617

Family Applications (2)

Application Number Title Priority Date Filing Date
GB878705543A Pending GB8705543D0 (en) 1987-03-10 1987-03-10 Printed circuit board
GB8801471A Expired - Fee Related GB2202094B (en) 1987-03-10 1988-01-22 Multilayer printed circuit board

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB878705543A Pending GB8705543D0 (en) 1987-03-10 1987-03-10 Printed circuit board

Country Status (1)

Country Link
GB (2) GB8705543D0 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2631544B2 (en) * 1989-01-27 1997-07-16 日本シイエムケイ株式会社 Printed wiring board
FR2653601B1 (en) * 1989-10-20 1993-10-22 Sgs Thomson Microelectronics Sa PORTABLE ELECTRONICS CONNECTABLE TO CHIPS.
US5523920A (en) * 1994-01-03 1996-06-04 Motorola, Inc. Printed circuit board comprising elevated bond pads
GB2307351A (en) * 1995-11-16 1997-05-21 Marconi Gec Ltd Printed circuit boards and their manufacture
JP3857042B2 (en) * 2000-11-27 2006-12-13 富士通テン株式会社 Board structure
JP3407737B2 (en) * 2000-12-14 2003-05-19 株式会社デンソー Multilayer substrate manufacturing method and multilayer substrate formed by the manufacturing method
DE102016119825A1 (en) * 2016-10-18 2018-04-19 HELLA GmbH & Co. KGaA circuit board

Also Published As

Publication number Publication date
GB8705543D0 (en) 1987-04-15
GB2202094A (en) 1988-09-14
GB8801471D0 (en) 1988-02-24

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20040122