IT1181918B - Scheda a circuiti stampati - Google Patents

Scheda a circuiti stampati

Info

Publication number
IT1181918B
IT1181918B IT23985/84A IT2398584A IT1181918B IT 1181918 B IT1181918 B IT 1181918B IT 23985/84 A IT23985/84 A IT 23985/84A IT 2398584 A IT2398584 A IT 2398584A IT 1181918 B IT1181918 B IT 1181918B
Authority
IT
Italy
Prior art keywords
circuit board
printed circuit
printed
board
circuit
Prior art date
Application number
IT23985/84A
Other languages
English (en)
Other versions
IT8423985A0 (it
IT8423985A1 (it
Inventor
Rolf Dahlberg
Tomas Dahlberg
Original Assignee
Rolf Dahlberg
Tomas Dahlberg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rolf Dahlberg, Tomas Dahlberg filed Critical Rolf Dahlberg
Publication of IT8423985A0 publication Critical patent/IT8423985A0/it
Publication of IT8423985A1 publication Critical patent/IT8423985A1/it
Application granted granted Critical
Publication of IT1181918B publication Critical patent/IT1181918B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
IT23985/84A 1983-12-13 1984-12-11 Scheda a circuiti stampati IT1181918B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8306874A SE437207B (sv) 1983-12-13 1983-12-13 Monsterkort med berande stomme i form av vermeavledande metallplatta

Publications (3)

Publication Number Publication Date
IT8423985A0 IT8423985A0 (it) 1984-12-11
IT8423985A1 IT8423985A1 (it) 1986-06-11
IT1181918B true IT1181918B (it) 1987-09-30

Family

ID=20353703

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23985/84A IT1181918B (it) 1983-12-13 1984-12-11 Scheda a circuiti stampati

Country Status (6)

Country Link
US (1) US4675784A (it)
EP (1) EP0164392B1 (it)
DE (1) DE3475592D1 (it)
IT (1) IT1181918B (it)
SE (1) SE437207B (it)
WO (1) WO1985002750A1 (it)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985002466A1 (en) * 1983-12-02 1985-06-06 Vertrik Bioteknik Ab A device for chemical analyses and use thereof
DE3527208A1 (de) * 1985-07-30 1987-02-12 Bosch Gmbh Robert Elektrisches schaltgeraet
ES292827Y (es) * 1986-03-07 1987-03-01 Circuitgraph, S.L. Placa base para la realizacion de circuitos electronicos
GB2190795B (en) * 1986-05-09 1990-01-10 Hella Kg Hueck & Co Circuit arrangement
DE3837206C2 (de) * 1988-11-02 1998-07-23 Bosch Gmbh Robert Elektrisches Schaltgerät
US5290606A (en) * 1989-01-30 1994-03-01 Svein Hestevik Method for manufacturing a substrate for a printed circuit board
NO169570C (no) * 1989-01-30 1992-07-08 Svein Hestevik Fremgangsmaate ved fremstilling av substrat til anbringelse av elektriske og/eller elektroniske komponenter.
US4965699A (en) * 1989-04-18 1990-10-23 Magnavox Government And Industrial Electronics Company Circuit card assembly cold plate
US5297007A (en) * 1990-09-19 1994-03-22 Rockwell International Corporation E/M shielded RF circuit board
JP2529780B2 (ja) * 1991-02-06 1996-09-04 スカイアルミニウム株式会社 金属基板
JPH0621595A (ja) * 1992-07-03 1994-01-28 Cmk Corp プリント配線板用素材
US5687062A (en) * 1996-02-20 1997-11-11 Heat Technology, Inc. High-thermal conductivity circuit board
US5774336A (en) * 1996-02-20 1998-06-30 Heat Technology, Inc. High-terminal conductivity circuit board
DE19649454B4 (de) * 1996-11-28 2005-11-17 Alcan Deutschland Gmbh Platine für integrierte elektronische Schaltungen und Verfahren zur Herstellung einer Platine
DE19654606C2 (de) * 1996-12-20 1998-10-22 Siemens Ag Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung
DE10012781A1 (de) * 2000-03-16 2001-09-27 Boellhoff Gmbh Verbindungsanordnung zum Anbringen eines Befestigungselementes an einem Bauteil
ES2381658T3 (es) * 2002-05-16 2012-05-30 Abb Schweiz Ag Elemento de refrigeración
US6778398B2 (en) * 2002-10-24 2004-08-17 Koninklijke Philips Electronics N.V. Thermal-conductive substrate package
JP2005151617A (ja) * 2003-11-11 2005-06-09 Sumitomo Wiring Syst Ltd 回路構成体及び回路構成体の製造方法
CN102036472A (zh) * 2011-01-05 2011-04-27 倪新军 一种微波高频金属基电路板
CN102076164B (zh) * 2011-01-17 2012-07-04 倪新军 一种微波高频电路板
US8705237B2 (en) 2011-06-01 2014-04-22 Honeywell International Inc. Thermally conductive and electrically insulative card guide
FR3036918B1 (fr) * 2015-05-29 2018-08-10 Thales Carte electronique et procede de fabrication associe
WO2018060231A1 (en) * 2016-09-27 2018-04-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Highly thermally conductive dielectric structure for heat spreading in component carrier

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3165672A (en) * 1959-06-15 1965-01-12 Burroughs Corp Printed circuit baseboard
US3469017A (en) * 1967-12-12 1969-09-23 Rca Corp Encapsulated semiconductor device having internal shielding
US3912849A (en) * 1973-03-28 1975-10-14 Rca Corp Composite printed circuit board
JPS5335163A (en) * 1976-09-14 1978-04-01 Hitachi Chemical Co Ltd Method of producing printed circuit board substrate having through hole from metallic material
DE2743647C3 (de) * 1977-09-28 1980-04-10 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zur Kühlung von Bauelementen der elektrischen Nachrichten- und Meßtechnik
US4413298A (en) * 1981-05-05 1983-11-01 Minnesota Mining And Manufacturing Company Diskette jacket
FR2524250A1 (fr) * 1982-03-26 1983-09-30 Socapex Carte imprimee electrique et thermique, procede de fabrication d'une telle carte et systeme d'interconnexion thermique et electrique utilisant une telle carte

Also Published As

Publication number Publication date
IT8423985A0 (it) 1984-12-11
DE3475592D1 (en) 1989-01-12
EP0164392A1 (en) 1985-12-18
IT8423985A1 (it) 1986-06-11
EP0164392B1 (en) 1988-12-07
SE8306874D0 (sv) 1983-12-13
SE437207B (sv) 1985-02-11
WO1985002750A1 (en) 1985-06-20
US4675784A (en) 1987-06-23

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