NO169570C - Fremgangsmaate ved fremstilling av substrat til anbringelse av elektriske og/eller elektroniske komponenter. - Google Patents

Fremgangsmaate ved fremstilling av substrat til anbringelse av elektriske og/eller elektroniske komponenter.

Info

Publication number
NO169570C
NO169570C NO890377A NO890377A NO169570C NO 169570 C NO169570 C NO 169570C NO 890377 A NO890377 A NO 890377A NO 890377 A NO890377 A NO 890377A NO 169570 C NO169570 C NO 169570C
Authority
NO
Norway
Prior art keywords
procedure
electrical
application
electronic components
manufacturing substrate
Prior art date
Application number
NO890377A
Other languages
English (en)
Other versions
NO890377L (no
NO169570B (no
NO890377D0 (no
Inventor
Svein Hestevik
Tore Storfossene
Original Assignee
Svein Hestevik
Tore Storfossene
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Svein Hestevik, Tore Storfossene filed Critical Svein Hestevik
Priority to NO890377A priority Critical patent/NO169570C/no
Publication of NO890377D0 publication Critical patent/NO890377D0/no
Priority to DE90902852T priority patent/DE69003092T2/de
Priority to PCT/NO1990/000021 priority patent/WO1990009089A1/en
Priority to AT90902852T priority patent/ATE94016T1/de
Priority to CA002046615A priority patent/CA2046615C/en
Priority to JP2503026A priority patent/JPH0758831B2/ja
Priority to EP90902852A priority patent/EP0455714B1/en
Publication of NO890377L publication Critical patent/NO890377L/no
Priority to FI913562A priority patent/FI913562A0/fi
Publication of NO169570B publication Critical patent/NO169570B/no
Publication of NO169570C publication Critical patent/NO169570C/no
Priority to US08/043,597 priority patent/US5290606A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
NO890377A 1989-01-30 1989-01-30 Fremgangsmaate ved fremstilling av substrat til anbringelse av elektriske og/eller elektroniske komponenter. NO169570C (no)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NO890377A NO169570C (no) 1989-01-30 1989-01-30 Fremgangsmaate ved fremstilling av substrat til anbringelse av elektriske og/eller elektroniske komponenter.
EP90902852A EP0455714B1 (en) 1989-01-30 1990-01-30 A method of manufacturing a substrate for placement of electrical and/or electronic components
CA002046615A CA2046615C (en) 1989-01-30 1990-01-30 A method of manufacturing a substrate for placement of electrical and/or electronic components
PCT/NO1990/000021 WO1990009089A1 (en) 1989-01-30 1990-01-30 A method of manufacturing a substrate for placement of electrical and/or electronic components
AT90902852T ATE94016T1 (de) 1989-01-30 1990-01-30 Verfahren zur herstellung eines traegers zur bestueckung mit elektrischen und/oder elektronischen bauelementen.
DE90902852T DE69003092T2 (de) 1989-01-30 1990-01-30 Verfahren zur herstellung eines trägers zur bestückung mit elektrischen und/oder elektronischen bauelementen.
JP2503026A JPH0758831B2 (ja) 1989-01-30 1990-01-30 電気的及び／または電子的構成要素配置用基板の製造方法
FI913562A FI913562A0 (fi) 1989-01-30 1991-07-25 Foerfarande foer framstaellning av underlag foer placering av elektriska- och/eller elektroniska komponenter.
US08/043,597 US5290606A (en) 1989-01-30 1993-04-05 Method for manufacturing a substrate for a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NO890377A NO169570C (no) 1989-01-30 1989-01-30 Fremgangsmaate ved fremstilling av substrat til anbringelse av elektriske og/eller elektroniske komponenter.

Publications (4)

Publication Number Publication Date
NO890377D0 NO890377D0 (no) 1989-01-30
NO890377L NO890377L (no) 1990-07-31
NO169570B NO169570B (no) 1992-03-30
NO169570C true NO169570C (no) 1992-07-08

Family

ID=19891677

Family Applications (1)

Application Number Title Priority Date Filing Date
NO890377A NO169570C (no) 1989-01-30 1989-01-30 Fremgangsmaate ved fremstilling av substrat til anbringelse av elektriske og/eller elektroniske komponenter.

Country Status (7)

Country Link
EP (1) EP0455714B1 (no)
JP (1) JPH0758831B2 (no)
CA (1) CA2046615C (no)
DE (1) DE69003092T2 (no)
FI (1) FI913562A0 (no)
NO (1) NO169570C (no)
WO (1) WO1990009089A1 (no)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO301915B1 (no) * 1996-09-03 1997-12-22 Svein Hestevik Kommutator
DE10331208A1 (de) * 2003-07-10 2005-02-10 Newspray Gmbh Verfahren und Anordnung zur Isolierung eines Kühlkörpers
DE102004058806B4 (de) * 2004-12-07 2013-09-05 Robert Bosch Gmbh Verfahren zur Herstellung von Schaltungsstrukturen auf einem Kühlkörper und Schaltungsstruktur auf einem Kühlkörper
DE102011004171A1 (de) * 2011-02-15 2012-08-16 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Temperierelement und Verfahren zur Befestigung eines Elektrobauteils an dem Temperierelement

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2435883A1 (fr) * 1978-06-29 1980-04-04 Materiel Telephonique Circuit integre hybride et son procede de fabrication
DE3176951D1 (en) * 1980-09-30 1989-01-12 Toshiba Kk Printed circuit board and method for fabricating the same
JPS5835375A (ja) * 1981-08-25 1983-03-02 ホステルト・フオトマタ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツンク 乾燥装置
JPS5835376A (ja) * 1981-08-26 1983-03-02 東海高熱工業株式会社 省エネルギ−形連続熱処理炉
JPS5835374A (ja) * 1981-08-28 1983-03-02 株式会社日立製作所 乾燥装置
DE3335184A1 (de) * 1983-09-28 1985-04-04 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von halbleiterbausteinen
SE437207B (sv) * 1983-12-13 1985-02-11 Rolf Dahlberg Monsterkort med berande stomme i form av vermeavledande metallplatta
DE3527967A1 (de) * 1985-08-03 1987-02-05 Standard Elektrik Lorenz Ag Verfahren zur herstellung von leiterplatten
DE3625087A1 (de) * 1986-07-24 1988-01-28 Ego Elektro Blanc & Fischer Elektro-bauelement
DE3641202A1 (de) * 1986-12-03 1988-06-16 Standard Elektrik Lorenz Ag Metallkernleiterplatte als traeger fuer hf- und mikrowellenschaltkreise

Also Published As

Publication number Publication date
WO1990009089A1 (en) 1990-08-09
JPH04500584A (ja) 1992-01-30
DE69003092D1 (de) 1993-10-07
DE69003092T2 (de) 1994-02-03
FI913562A0 (fi) 1991-07-25
NO890377L (no) 1990-07-31
CA2046615A1 (en) 1990-07-31
JPH0758831B2 (ja) 1995-06-21
NO169570B (no) 1992-03-30
EP0455714A1 (en) 1991-11-13
NO890377D0 (no) 1989-01-30
EP0455714B1 (en) 1993-09-01
CA2046615C (en) 1996-04-02

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