DE3750205D1 - Substrat für Hochfrequenzschaltung und Verfahren zur Herstellung desselben. - Google Patents

Substrat für Hochfrequenzschaltung und Verfahren zur Herstellung desselben.

Info

Publication number
DE3750205D1
DE3750205D1 DE3750205T DE3750205T DE3750205D1 DE 3750205 D1 DE3750205 D1 DE 3750205D1 DE 3750205 T DE3750205 T DE 3750205T DE 3750205 T DE3750205 T DE 3750205T DE 3750205 D1 DE3750205 D1 DE 3750205D1
Authority
DE
Germany
Prior art keywords
manufacturing
same
high frequency
circuit substrate
frequency circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3750205T
Other languages
English (en)
Other versions
DE3750205T2 (de
Inventor
Masaki Kamiya
Takao Sugawara
Kenji Tsukanishi
Yutaka Yamaguchi
Mitsuo Yokota
Masao Asaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61204062A external-priority patent/JPH07123177B2/ja
Priority claimed from JP61204064A external-priority patent/JPH0767000B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE3750205D1 publication Critical patent/DE3750205D1/de
Publication of DE3750205T2 publication Critical patent/DE3750205T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14—Reflecting surfaces; Equivalent structures
    • H01Q15/141—Apparatus or processes specially adapted for manufacturing reflecting surfaces
    • H01Q15/142—Apparatus or processes specially adapted for manufacturing reflecting surfaces using insulating material for supporting the reflecting surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y10T428/249985—Composition of adhesive or bonding component specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249986—Void-containing component contains also a solid fiber or solid particle
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/24999—Inorganic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
DE3750205T 1986-08-29 1987-08-28 Substrat für Hochfrequenzschaltung und Verfahren zur Herstellung desselben. Expired - Fee Related DE3750205T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61204062A JPH07123177B2 (ja) 1986-08-29 1986-08-29 高周波回路用基板の製造法
JP61204064A JPH0767000B2 (ja) 1986-08-29 1986-08-29 平面アンテナ用基板

Publications (2)

Publication Number Publication Date
DE3750205D1 true DE3750205D1 (de) 1994-08-18
DE3750205T2 DE3750205T2 (de) 1994-12-08

Family

ID=26514260

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3750205T Expired - Fee Related DE3750205T2 (de) 1986-08-29 1987-08-28 Substrat für Hochfrequenzschaltung und Verfahren zur Herstellung desselben.

Country Status (3)

Country Link
US (1) US4751136A (de)
EP (1) EP0257657B1 (de)
DE (1) DE3750205T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235254A (ja) * 1988-03-15 1989-09-20 Nec Corp 半導体装置及びその製造方法
AU680823B2 (en) * 1992-05-29 1997-08-14 M-Rad Electromagnetic Technology Ltd. Printed circuit substrates
JP3396541B2 (ja) * 1993-08-30 2003-04-14 株式会社東芝 混成集積回路装置を搭載した回路基板
FR2711845B1 (fr) * 1993-10-28 1995-11-24 France Telecom Antenne plane et procédé de réalisation d'une telle antenne.
US5449427A (en) * 1994-05-23 1995-09-12 General Electric Company Processing low dielectric constant materials for high speed electronics
US5785787A (en) * 1994-05-23 1998-07-28 General Electric Company Processing low dielectric constant materials for high speed electronics
GB9413828D0 (en) * 1994-07-08 1994-08-24 Mannan Michael Antenna
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same
EP0989172A1 (de) * 1998-09-24 2000-03-29 Hitachi Chemical Co., Ltd. Kleber für metallische Folien, mit diesem Kleber überzogene metallische Folie, mit der metallischen Folie überzogene Schichtplatte und daraus hergestellte Erzeugnisse
EP1194020A3 (de) * 2000-09-27 2004-03-31 Matsushita Electric Industrial Co., Ltd. Harzplatte, Verfahren zur Herstellung einer Harzplatte, Zwischenverbindungskörper, Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
JP4132825B2 (ja) * 2002-01-10 2008-08-13 日東電工株式会社 金属箔積層体及びその製造方法
US6703114B1 (en) * 2002-10-17 2004-03-09 Arlon Laminate structures, methods for production thereof and uses therefor
US9204537B2 (en) * 2012-09-20 2015-12-01 Finisar Corporation High-speed pluggable rigid-end flex circuit
JP2017199803A (ja) 2016-04-27 2017-11-02 日立マクセル株式会社 三次元成形回路部品
JP2019527667A (ja) * 2016-07-27 2019-10-03 コーニング インコーポレイテッド セラミックとポリマーとの複合材、その作製方法および使用
CN112864633B (zh) * 2021-01-08 2022-03-04 中南大学 一种基于超表面的宽带微波吸收体
JP2023013805A (ja) * 2021-07-16 2023-01-26 日立金属株式会社 信号伝送用ケーブル
CN113905507B (zh) * 2021-10-13 2023-09-08 北京华镁钛科技有限公司 低翘曲度pcb过渡结构

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3150030A (en) * 1960-04-06 1964-09-22 Raytheon Co Laminated plastic structure
FR1394200A (fr) * 1964-02-19 1965-04-02 Entpr S Generales Et Electroni Réflecteur d'aérien
JPS5278069A (en) * 1975-12-24 1977-07-01 Fuji Kinzoku Kakou Kk Printed circuit board
JPS52135243A (en) * 1976-03-12 1977-11-12 Ball Corp Radio frequency antenna device
US4219602A (en) * 1976-04-29 1980-08-26 Herculite Protective Fabrics Corporation Electrically conductive/antistatic sheeting
US4212733A (en) * 1977-12-27 1980-07-15 Somar Manufacturing Co., Ltd. Oil-water separation filters
US4221835A (en) * 1979-01-02 1980-09-09 Swiss Aluminium Ltd. Composite panels which are not easily combustible
DE2901623A1 (de) * 1979-01-17 1980-07-24 Hoechst Ag Verfahren zur herstellung eines flaechigen verbundes
GB2131232B (en) * 1982-09-27 1986-05-08 Rogers Corp Microstrip antenna and method of manufacture thereof
FR2551587B1 (fr) * 1983-09-07 1988-04-29 Labo Electronique Physique Procede de realisation d'un corps moule en matiere plastique revetu d'une couche metallique, et antenne plane ainsi realisee
JPS60167394A (ja) * 1984-02-09 1985-08-30 東レ株式会社 回路基板
US4647500A (en) * 1984-03-02 1987-03-03 Subtex, Inc. High temperature flame and heat resistant foamed plastics
JPS60214941A (ja) * 1984-04-10 1985-10-28 株式会社　潤工社 プリント基板
JPS6269580A (ja) * 1985-09-21 1987-03-30 松下電工株式会社 プリント配線板材料

Also Published As

Publication number Publication date
DE3750205T2 (de) 1994-12-08
EP0257657A3 (en) 1990-03-14
EP0257657A2 (de) 1988-03-02
EP0257657B1 (de) 1994-07-13
US4751136A (en) 1988-06-14

Similar Documents

Publication Publication Date Title
DE3750205D1 (de) Substrat für Hochfrequenzschaltung und Verfahren zur Herstellung desselben.
DE3685647D1 (de) Verbindungskontakte zwischen substraten und verfahren zur herstellung derselben.
DE69130346D1 (de) Verfahren zur Herstellung von Halbleiteranordnungen
DE3888885D1 (de) Halbleiteranordnung und verfahren zur herstellung.
DE3650323D1 (de) VLSI-Chip und Verfahren zur Herstellung.
DE68926986D1 (de) Halbleiterlaser und Verfahren zur Herstellung desselben
DE69032451D1 (de) Halbleiterlaser und Verfahren zur Herstellung desselben
DE69132117D1 (de) Verfahren zur Herstellung von Isolationszonen für Halbleiteranordnungen
DE3788015D1 (de) Lautsprecherabdeckung und Verfahren zur Herstellung derselben.
DE3675554D1 (de) Lotverbindungsstruktur zum verbinden von halbleiteranordnungen mit substraten und verfahren zur herstellung derselben.
DE3587780D1 (de) Elektronisches Bauelement und Verfahren zur Herstellung.
DE69110961D1 (de) Optischer Schaltkreis für Oberflächenmontage, Substrat dafür und seine Herstellungsmethode.
DE69529185D1 (de) Prozess zur Herstellung von metallbondiertem Keramikmaterial oder Komponente und dessen Verwendung als Substrat für eine elektronische Schaltung
DE69132118D1 (de) Verfahren zur Herstellung von Isolationszonen für Halbleiteranordnungen
DE69528117D1 (de) Verfahren zur Herstellung von Halbleiter-Anordnungen
DE3750019D1 (de) Selbstklebender Polysiloxanelastomer und Verfahren zur Herstellung.
DE69027368D1 (de) Halbleiterlaser und Verfahren zur Herstellung desselben
DE3751206D1 (de) Dünnschicht-Elektrolumineszentenvorrichtung und Verfahren zur Herstellung derselben.
DE3684679D1 (de) Keramische substrate und verfahren zur herstellung derselben.
DE3889438D1 (de) Verfahren zur Herstellung von Flüssigkristallvorrichtungen.
DE69020708D1 (de) Verfahren zur Herstellung von biMOS-Halbleiterbauelementen mit verbesserter Schnelligkeit und Zuverlässigkeit.
DE69208298D1 (de) Hydrophiles Substrat und Verfahren zur Herstellung desselben
DE69027960D1 (de) Elektronen emittierendes Element und Verfahren zur Herstellung desselben
DE68922732D1 (de) Metalloxydschäume hocher spezifischer oberfläche und verfahren zur herstellung.
DE3887480D1 (de) Chipkondensator und Verfahren zur Herstellung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee