DE69130346D1 - Verfahren zur Herstellung von Halbleiteranordnungen - Google Patents

Verfahren zur Herstellung von Halbleiteranordnungen

Info

Publication number
DE69130346D1
DE69130346D1 DE69130346T DE69130346T DE69130346D1 DE 69130346 D1 DE69130346 D1 DE 69130346D1 DE 69130346 T DE69130346 T DE 69130346T DE 69130346 T DE69130346 T DE 69130346T DE 69130346 D1 DE69130346 D1 DE 69130346D1
Authority
DE
Germany
Prior art keywords
semiconductor devices
manufacturing semiconductor
manufacturing
devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69130346T
Other languages
English (en)
Other versions
DE69130346T2 (de
Inventor
Yanagisawa Masayuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69130346D1 publication Critical patent/DE69130346D1/de
Publication of DE69130346T2 publication Critical patent/DE69130346T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
DE69130346T 1990-06-12 1991-06-12 Verfahren zur Herstellung von Halbleiteranordnungen Expired - Fee Related DE69130346T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2153777A JPH0444307A (ja) 1990-06-12 1990-06-12 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE69130346D1 true DE69130346D1 (de) 1998-11-19
DE69130346T2 DE69130346T2 (de) 1999-03-11

Family

ID=15569913

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69130346T Expired - Fee Related DE69130346T2 (de) 1990-06-12 1991-06-12 Verfahren zur Herstellung von Halbleiteranordnungen

Country Status (5)

Country Link
US (1) US5262258A (de)
EP (1) EP0466335B1 (de)
JP (1) JPH0444307A (de)
KR (1) KR950003891B1 (de)
DE (1) DE69130346T2 (de)

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KR0168772B1 (ko) * 1994-03-10 1999-02-01 김주용 포토마스크 및 그를 이용한 반도체 장치 제조 방법
KR950029845A (ko) * 1994-04-01 1995-11-24 김주용 레티클 및 이를 이용한 레티클의 회전오차 측정방법
US5928820A (en) * 1994-06-10 1999-07-27 Hyundai Electronics Industries Co., Ltd. Method for measuring pattern line width during manufacture of a semiconductor device
KR0143340B1 (ko) * 1994-09-09 1998-08-17 김주용 위상반전 마스크
US5712707A (en) * 1995-11-20 1998-01-27 International Business Machines Corporation Edge overlay measurement target for sub-0.5 micron ground rules
US5757507A (en) * 1995-11-20 1998-05-26 International Business Machines Corporation Method of measuring bias and edge overlay error for sub-0.5 micron ground rules
JP2682523B2 (ja) * 1995-11-22 1997-11-26 日本電気株式会社 露光方法及びモニタパターン
US5656403A (en) * 1996-01-30 1997-08-12 United Microelectronics Corporation Method and template for focus control in lithography process
US5805290A (en) 1996-05-02 1998-09-08 International Business Machines Corporation Method of optical metrology of unresolved pattern arrays
JP3758258B2 (ja) * 1996-11-29 2006-03-22 富士通株式会社 光結合装置
US5953128A (en) * 1997-08-28 1999-09-14 International Business Machines Corporation Optically measurable serpentine edge tone reversed targets
US5965309A (en) * 1997-08-28 1999-10-12 International Business Machines Corporation Focus or exposure dose parameter control system using tone reversing patterns
US5976740A (en) * 1997-08-28 1999-11-02 International Business Machines Corporation Process for controlling exposure dose or focus parameters using tone reversing pattern
US5914784A (en) * 1997-09-30 1999-06-22 International Business Machines Corporation Measurement method for linewidth metrology
US6137578A (en) * 1998-07-28 2000-10-24 International Business Machines Corporation Segmented bar-in-bar target
US6128089A (en) * 1998-07-28 2000-10-03 International Business Machines Corporation Combined segmented and nonsegmented bar-in-bar targets
US6462818B1 (en) 2000-06-22 2002-10-08 Kla-Tencor Corporation Overlay alignment mark design
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US7068833B1 (en) 2000-08-30 2006-06-27 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
US6486954B1 (en) 2000-09-01 2002-11-26 Kla-Tencor Technologies Corporation Overlay alignment measurement mark
WO2002035288A1 (en) 2000-10-23 2002-05-02 Advanced Micro Devices, Inc. System and method for facilitating wafer alignment by mitigating effects of reticle rotation on overlay
US6552790B1 (en) * 2001-02-20 2003-04-22 Advanced Micro Devices, Inc. System and method for facilitating wafer alignment by mitigating effects of reticle rotation on overlay
JP2002270489A (ja) * 2001-03-12 2002-09-20 Nec Corp ショット形状計測用マーク及びそれを使用した転写の誤差検出方法
US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
US20030160163A1 (en) * 2002-02-25 2003-08-28 Alan Wong Optical metrology target design for simultaneous measurement of multiple periodic structures
KR20030097144A (ko) * 2002-06-19 2003-12-31 엘지.필립스 엘시디 주식회사 액정표시소자
SG123589A1 (en) 2002-12-19 2006-07-26 Asml Netherlands Bv A lithographic projection mask, a device manufacturing method using a lithographic projection mask and a device manufactured thereby
EP1431834B1 (de) * 2002-12-19 2008-07-23 ASML Netherlands B.V. Verfahren zur Herstellung eines Artikels unter Verwendung einer lithographischen Projektionsmaske
US7075639B2 (en) * 2003-04-25 2006-07-11 Kla-Tencor Technologies Corporation Method and mark for metrology of phase errors on phase shift masks
US7608468B1 (en) * 2003-07-02 2009-10-27 Kla-Tencor Technologies, Corp. Apparatus and methods for determining overlay and uses of same
US7346878B1 (en) 2003-07-02 2008-03-18 Kla-Tencor Technologies Corporation Apparatus and methods for providing in-chip microtargets for metrology or inspection
DE10335565A1 (de) * 2003-07-31 2005-05-19 Infineon Technologies Ag Verfahren zur Überprüfung von periodischen Strukturen auf Lithographiemasken
FR2875624A1 (fr) * 2004-09-23 2006-03-24 St Microelectronics Sa Generation deterministe d'un numero d'identifiant d'un circuit integre
KR100663347B1 (ko) * 2004-12-21 2007-01-02 삼성전자주식회사 중첩도 측정마크를 갖는 반도체소자 및 그 형성방법
US7557921B1 (en) 2005-01-14 2009-07-07 Kla-Tencor Technologies Corporation Apparatus and methods for optically monitoring the fidelity of patterns produced by photolitographic tools
US20080036984A1 (en) * 2006-08-08 2008-02-14 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US9927718B2 (en) 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
CN102540732A (zh) * 2010-12-08 2012-07-04 无锡华润上华科技有限公司 一种判断半导体生产中一次光刻结果的方法
US10890436B2 (en) 2011-07-19 2021-01-12 Kla Corporation Overlay targets with orthogonal underlayer dummyfill
JP2015079830A (ja) * 2013-10-16 2015-04-23 三菱電機株式会社 光半導体装置、光半導体装置の製造方法、及び光モジュールの製造方法
CN105140149B (zh) * 2015-08-04 2017-12-12 中国电子科技集团公司第十三研究所 一种高精度测量晶片纵向对准误差的方法
CN105140150B (zh) * 2015-08-04 2017-12-19 中国电子科技集团公司第十三研究所 一种高精度测量晶片横向对准误差的方法
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry
CN107309601A (zh) * 2017-06-28 2017-11-03 上海皮尔博格有色零部件有限公司 一种具有防错装功能的装配体及防错装配方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4388386A (en) * 1982-06-07 1983-06-14 International Business Machines Corporation Mask set mismatch
JPS5948924A (ja) * 1982-09-14 1984-03-21 Nec Corp 電子線露光用位置合せマ−ク
JPS6085523A (ja) * 1983-10-17 1985-05-15 Fujitsu Ltd マスク形成方法
JPS62115165A (ja) * 1985-11-14 1987-05-26 Mitsubishi Electric Corp レチクル
US4806457A (en) * 1986-04-10 1989-02-21 Nec Corporation Method of manufacturing integrated circuit semiconductor device
JPH01193743A (ja) * 1988-01-28 1989-08-03 Nec Kyushu Ltd レチクルマスク
JP2666859B2 (ja) * 1988-11-25 1997-10-22 日本電気株式会社 目合せ用バーニヤパターンを備えた半導体装置
JPH0358408A (ja) * 1989-07-26 1991-03-13 Nec Corp 半導体集積回路の製造方法

Also Published As

Publication number Publication date
EP0466335A3 (en) 1993-03-17
US5262258A (en) 1993-11-16
EP0466335A2 (de) 1992-01-15
JPH0444307A (ja) 1992-02-14
DE69130346T2 (de) 1999-03-11
KR950003891B1 (ko) 1995-04-20
KR920005809A (ko) 1992-04-03
EP0466335B1 (de) 1998-10-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC CORP., TOKIO/TOKYO, JP

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP

8327 Change in the person/name/address of the patent owner

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP

8339 Ceased/non-payment of the annual fee