DE69032451D1 - Halbleiterlaser und Verfahren zur Herstellung desselben - Google Patents
Halbleiterlaser und Verfahren zur Herstellung desselbenInfo
- Publication number
- DE69032451D1 DE69032451D1 DE69032451T DE69032451T DE69032451D1 DE 69032451 D1 DE69032451 D1 DE 69032451D1 DE 69032451 T DE69032451 T DE 69032451T DE 69032451 T DE69032451 T DE 69032451T DE 69032451 D1 DE69032451 D1 DE 69032451D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- same
- semiconductor laser
- laser
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02392—Phosphides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02461—Phosphides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02463—Arsenides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02543—Phosphides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1228—DFB lasers with a complex coupled grating, e.g. gain or loss coupling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2059—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2201—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure in a specific crystallographic orientation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2213—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on polyimide or resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2272—Buried mesa structure ; Striped active layer grown by a mask induced selective growth
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2275—Buried mesa structure ; Striped active layer mesa created by etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/3235—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers
- H01S5/32391—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers based on In(Ga)(As)P
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4037—Edge-emitting structures with active layers in more than one orientation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32329589A JPH0834334B2 (ja) | 1989-12-12 | 1989-12-12 | 半導体レーザ素子及びその製造方法 |
JP1333390A JPH03217068A (ja) | 1990-01-22 | 1990-01-22 | 半導体レーザ素子及びその製造方法 |
JP2022953A JP2547458B2 (ja) | 1990-01-31 | 1990-01-31 | 半導体レーザ素子及びその製造方法 |
JP2295490A JPH0834336B2 (ja) | 1990-01-31 | 1990-01-31 | 半導体レーザ素子及びその製造方法 |
JP2022955A JP2547459B2 (ja) | 1990-01-31 | 1990-01-31 | 半導体レーザ素子及びその製造方法 |
JP8963490A JPH03288489A (ja) | 1990-04-04 | 1990-04-04 | 分布帰還型半導体レーザ装置 |
JP2162334A JP2554192B2 (ja) | 1990-06-20 | 1990-06-20 | 半導体レーザの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69032451D1 true DE69032451D1 (de) | 1998-08-06 |
DE69032451T2 DE69032451T2 (de) | 1999-01-28 |
Family
ID=27563649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69032451T Expired - Fee Related DE69032451T2 (de) | 1989-12-12 | 1990-12-12 | Halbleiterlaser und Verfahren zur Herstellung desselben |
Country Status (3)
Country | Link |
---|---|
US (1) | US5070510A (de) |
EP (1) | EP0433051B1 (de) |
DE (1) | DE69032451T2 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0643461B1 (de) * | 1990-08-24 | 1997-10-29 | Nec Corporation | Verfahren zur Herstellung einer optischen Halbleitervorrichtung |
JP2799372B2 (ja) * | 1991-03-28 | 1998-09-17 | 光技術研究開発株式会社 | 量子細線レーザ及びその製造方法 |
JP3149030B2 (ja) * | 1991-06-13 | 2001-03-26 | 富士通株式会社 | 半導体量子箱装置及びその製造方法 |
JP2754957B2 (ja) * | 1991-07-10 | 1998-05-20 | 日本電気株式会社 | 半導体光制御素子およびその製造方法 |
US5296719A (en) * | 1991-07-22 | 1994-03-22 | Matsushita Electric Industrial Co., Ltd. | Quantum device and fabrication method thereof |
JP2876839B2 (ja) * | 1991-07-31 | 1999-03-31 | 日本電気株式会社 | 光半導体素子の製造方法 |
JP2943510B2 (ja) * | 1991-08-09 | 1999-08-30 | 日本電気株式会社 | 可変波長半導体レーザ装置 |
JP3257034B2 (ja) * | 1992-06-03 | 2002-02-18 | ソニー株式会社 | 化合物半導体装置とその製造方法 |
DE4232860A1 (de) * | 1992-09-30 | 1994-03-31 | Siemens Ag | Halbleiterlaser mit einer zwischen zwei Resonatorspiegeln angeordneten aktiven Schicht und Verfahren zu seiner Herstellung |
JP2746065B2 (ja) * | 1993-07-29 | 1998-04-28 | 日本電気株式会社 | 光半導体素子の製造方法 |
US5656539A (en) * | 1994-07-25 | 1997-08-12 | Mitsubishi Denki Kabushiki Kaisha | Method of fabricating a semiconductor laser |
FR2736473B1 (fr) * | 1995-07-06 | 1997-09-12 | Boumedienne Mersali | Dispositif laser a structure enterree pour circuit photonique integre et procede de fabrication |
JPH1012958A (ja) * | 1996-06-19 | 1998-01-16 | Mitsubishi Electric Corp | 半導体レーザ装置,及びその製造方法 |
CN1227670A (zh) * | 1996-08-07 | 1999-09-01 | 西门子公司 | 制造一种红外发射发光二极管的方法 |
US6853663B2 (en) * | 2000-06-02 | 2005-02-08 | Agilent Technologies, Inc. | Efficiency GaN-based light emitting devices |
JP2002009401A (ja) * | 2000-06-16 | 2002-01-11 | Furukawa Electric Co Ltd:The | 半導体レーザ素子 |
US6977953B2 (en) * | 2001-07-27 | 2005-12-20 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor light-emitting device and method of fabricating the same |
JP3911140B2 (ja) * | 2001-09-05 | 2007-05-09 | シャープ株式会社 | 半導体レーザの製造方法 |
KR100446615B1 (ko) * | 2001-10-09 | 2004-09-04 | 삼성전자주식회사 | 반도체 레이저 다이오드 및 그 제조방법 |
US7217947B2 (en) * | 2004-08-06 | 2007-05-15 | Northrop Grumman Corporation | Semiconductor light source and method of making |
JP2008515201A (ja) * | 2004-09-23 | 2008-05-08 | セミネックス・コーポレーション | 高エネルギー赤外半導体ダイオード発光デバイス |
JP2007103581A (ja) * | 2005-10-03 | 2007-04-19 | Fujitsu Ltd | 埋込型半導体レーザ |
DE102006013442A1 (de) * | 2006-03-17 | 2007-09-20 | Humboldt-Universität Zu Berlin | Halbleiterlaser und Verfahren zu seiner Herstellung |
JP5223439B2 (ja) * | 2007-05-28 | 2013-06-26 | ソニー株式会社 | 半導体発光素子 |
DE102010046793A1 (de) | 2010-09-28 | 2012-03-29 | Osram Opto Semiconductors Gmbh | Kantenemittierende Halbleiterlaserdiode und Verfahren zu dessen Herstellung |
DE102011100175B4 (de) | 2011-05-02 | 2021-12-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Laserlichtquelle mit einer Stegwellenleiterstruktur und einer Modenfilterstruktur |
DE102012111512B4 (de) * | 2012-11-28 | 2021-11-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterstreifenlaser |
US9275820B2 (en) * | 2013-08-27 | 2016-03-01 | Varian Semiconductor Equipment Associates, Inc. | Gas coupled arc chamber cooling |
US10263150B2 (en) * | 2016-05-10 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor light emitting device capable of increasing luminous efficiency under a low applied current |
US10667396B2 (en) * | 2017-08-25 | 2020-05-26 | Tactotek Oy | Multilayer structure for hosting electronics and related method of manufacture |
US11152758B2 (en) * | 2018-09-06 | 2021-10-19 | Nichia Corporation | Light emitting device |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57206082A (en) * | 1981-06-12 | 1982-12-17 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor laser |
JPS58114477A (ja) * | 1981-12-26 | 1983-07-07 | Fujitsu Ltd | 半導体発光装置 |
JPS60161689A (ja) * | 1984-02-02 | 1985-08-23 | Nec Corp | 半導体レーザ素子の製造方法 |
JPH0680855B2 (ja) * | 1984-04-19 | 1994-10-12 | 日本電気株式会社 | 埋め込み構造半導体レーザ |
JPS61104867A (ja) * | 1984-10-29 | 1986-05-23 | Tokyo Electric Co Ltd | インクドツトプリンタ |
JP2716693B2 (ja) * | 1985-02-08 | 1998-02-18 | ソニー株式会社 | 半導体レーザー |
JPS61231789A (ja) * | 1985-04-08 | 1986-10-16 | Matsushita Electric Ind Co Ltd | 半導体レ−ザ装置 |
JPS6255988A (ja) * | 1985-09-05 | 1987-03-11 | Nec Corp | 埋め込み型半導体レ−ザ |
JPS62169388A (ja) * | 1986-01-21 | 1987-07-25 | Oki Electric Ind Co Ltd | 半導体レ−ザ素子 |
US4868838A (en) * | 1986-07-10 | 1989-09-19 | Sharp Kabushiki Kaisha | Semiconductor laser device |
JPS63122187A (ja) * | 1986-11-11 | 1988-05-26 | Omron Tateisi Electronics Co | 半導体レ−ザ |
JPS6455887A (en) * | 1987-08-26 | 1989-03-02 | Nec Corp | Manufacture of semiconductor laser |
JPS6459882A (en) * | 1987-08-31 | 1989-03-07 | Omron Tateisi Electronics Co | Semiconductor laser |
JPH01143285A (ja) * | 1987-11-28 | 1989-06-05 | Mitsubishi Electric Corp | 半導体超格子の無秩序化方法及び半導体レーザ装置 |
JPH01179455A (ja) * | 1988-01-07 | 1989-07-17 | Fuji Xerox Co Ltd | 半導体装置の製法 |
US4935935A (en) * | 1988-08-31 | 1990-06-19 | Carnegie Mellon University | Wavelength tunable electronic and electrooptical semiconductor devices |
-
1990
- 1990-12-10 US US07/625,169 patent/US5070510A/en not_active Expired - Lifetime
- 1990-12-12 EP EP90313536A patent/EP0433051B1/de not_active Expired - Lifetime
- 1990-12-12 DE DE69032451T patent/DE69032451T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0433051A2 (de) | 1991-06-19 |
US5070510A (en) | 1991-12-03 |
DE69032451T2 (de) | 1999-01-28 |
EP0433051A3 (en) | 1992-04-15 |
EP0433051B1 (de) | 1998-07-01 |
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