DE69120995D1 - Hochgeschwindigkeitsdiode und Verfahren zur Herstellung - Google Patents

Hochgeschwindigkeitsdiode und Verfahren zur Herstellung

Info

Publication number
DE69120995D1
DE69120995D1 DE69120995T DE69120995T DE69120995D1 DE 69120995 D1 DE69120995 D1 DE 69120995D1 DE 69120995 T DE69120995 T DE 69120995T DE 69120995 T DE69120995 T DE 69120995T DE 69120995 D1 DE69120995 D1 DE 69120995D1
Authority
DE
Germany
Prior art keywords
manufacturing
high speed
speed diode
diode
speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69120995T
Other languages
English (en)
Other versions
DE69120995T2 (de
Inventor
Mutsuhiro Mori
Yasumiti Yasuda
Naoki Sakurai
Hidetoshi Arakawa
Hiroshi Owada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Power Semiconductor Device Ltd
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=12719205&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69120995(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69120995D1 publication Critical patent/DE69120995D1/de
Publication of DE69120995T2 publication Critical patent/DE69120995T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/483Converters with outputs that each can have more than two voltages levels
    • H02M7/487Neutral point clamped inverters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/03Manufacturing methods
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    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H03K17/0814Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit
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    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/12032Schottky diode
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    • H01L2924/1306Field-effect transistor [FET]
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    • H01L2924/14Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
DE69120995T 1990-02-28 1991-02-27 Hochgeschwindigkeitsdiode und Verfahren zur Herstellung Expired - Fee Related DE69120995T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2045434A JP2590284B2 (ja) 1990-02-28 1990-02-28 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
DE69120995D1 true DE69120995D1 (de) 1996-08-29
DE69120995T2 DE69120995T2 (de) 1996-12-19

Family

ID=12719205

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Application Number Title Priority Date Filing Date
DE69120995T Expired - Fee Related DE69120995T2 (de) 1990-02-28 1991-02-27 Hochgeschwindigkeitsdiode und Verfahren zur Herstellung

Country Status (4)

Country Link
US (1) US5101244A (de)
EP (1) EP0450306B1 (de)
JP (1) JP2590284B2 (de)
DE (1) DE69120995T2 (de)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5278443A (en) * 1990-02-28 1994-01-11 Hitachi, Ltd. Composite semiconductor device with Schottky and pn junctions
US5731970A (en) * 1989-12-22 1998-03-24 Hitachi, Ltd. Power conversion device and semiconductor module suitable for use in the device
JPH0656885B2 (ja) * 1990-11-28 1994-07-27 工業技術院長 サージ防護デバイス
JP3074736B2 (ja) * 1990-12-28 2000-08-07 富士電機株式会社 半導体装置
US5345100A (en) * 1991-03-29 1994-09-06 Shindengen Electric Manufacturing Co., Ltd. Semiconductor rectifier having high breakdown voltage and high speed operation
DE69226141T2 (de) * 1991-09-20 1998-12-03 Hitachi Ltd Dreiphasiger dreistufiger Wechselrichter
DE4135259C1 (de) * 1991-10-25 1993-01-07 Semikron Elektronik Gmbh, 8500 Nuernberg, De
DE4135258C2 (de) * 1991-10-25 1996-05-02 Semikron Elektronik Gmbh Schnelle Leistungsdiode
DE4201183A1 (de) * 1992-01-17 1993-07-22 Eupec Gmbh & Co Kg Leistungsdiode
JPH06196723A (ja) * 1992-04-28 1994-07-15 Mitsubishi Electric Corp 半導体装置及びその製造方法
US5241195A (en) * 1992-08-13 1993-08-31 North Carolina State University At Raleigh Merged P-I-N/Schottky power rectifier having extended P-I-N junction
JP2809253B2 (ja) * 1992-10-02 1998-10-08 富士電機株式会社 注入制御型ショットキーバリア整流素子
DE4236557C2 (de) * 1992-10-29 2002-08-01 Semikron Elektronik Gmbh Leistungs- Halbleiterbauelement
US5418866A (en) * 1993-10-08 1995-05-23 E. I. Du Pont De Nemours And Company Surface acoustic wave devices for controlling high frequency signals using modified crystalline materials
US5629552A (en) * 1995-01-17 1997-05-13 Ixys Corporation Stable high voltage semiconductor device structure
US5969400A (en) * 1995-03-15 1999-10-19 Kabushiki Kaisha Toshiba High withstand voltage semiconductor device
JP3287269B2 (ja) * 1997-06-02 2002-06-04 富士電機株式会社 ダイオードとその製造方法
DE19740195C2 (de) * 1997-09-12 1999-12-02 Siemens Ag Halbleiterbauelement mit Metall-Halbleiterübergang mit niedrigem Sperrstrom
US6184563B1 (en) * 1998-07-27 2001-02-06 Ho-Yuan Yu Device structure for providing improved Schottky barrier rectifier
EP1225639A1 (de) * 2001-01-22 2002-07-24 STMicroelectronics S.r.l. Schottkydiode aus Silizium
US6462393B2 (en) 2001-03-20 2002-10-08 Fabtech, Inc. Schottky device
JP2003338620A (ja) * 2002-05-22 2003-11-28 Mitsubishi Electric Corp 半導体装置およびその製造方法
US8093652B2 (en) * 2002-08-28 2012-01-10 Ixys Corporation Breakdown voltage for power devices
JP2004127968A (ja) * 2002-09-30 2004-04-22 Sanyo Electric Co Ltd 半導体装置およびその製造方法
DE10326739B3 (de) * 2003-06-13 2005-03-24 Infineon Technologies Ag Halbleiterbauelement mit Schottky-Metallkontakt
JP4686782B2 (ja) * 2003-06-20 2011-05-25 国立大学法人東北大学 静電誘導ダイオード
JP2005243716A (ja) * 2004-02-24 2005-09-08 Sanyo Electric Co Ltd 半導体装置
DE102005023882B3 (de) * 2005-05-24 2007-02-01 Infineon Technologies Ag Hochgeschwindigkeitsdiode
JP4944460B2 (ja) * 2005-03-30 2012-05-30 オンセミコンダクター・トレーディング・リミテッド 半導体装置
CN100454582C (zh) * 2005-03-30 2009-01-21 三洋电机株式会社 半导体装置
US8901699B2 (en) 2005-05-11 2014-12-02 Cree, Inc. Silicon carbide junction barrier Schottky diodes with suppressed minority carrier injection
EP1722423B1 (de) * 2005-05-12 2016-07-06 Ixys Corporation Stabile Dioden für Niedrig- und Hochfrequenzanwendungen
DE102005063332B4 (de) 2005-05-24 2009-04-02 Infineon Technologies Ag Hochschwindigkeitsdiode und Verfahren zu ihrer Herstellung
JP2008085186A (ja) * 2006-09-28 2008-04-10 Sanyo Electric Co Ltd 半導体装置
JP2008085187A (ja) * 2006-09-28 2008-04-10 Sanyo Electric Co Ltd 半導体装置
JP4980126B2 (ja) 2007-04-20 2012-07-18 株式会社日立製作所 フリーホイールダイオードとを有する回路装置
WO2008153142A1 (ja) * 2007-06-15 2008-12-18 Rohm Co., Ltd. 半導体装置
US20090039456A1 (en) * 2007-08-08 2009-02-12 Alpha & Omega Semiconductor, Ltd Structures and methods for forming Schottky diodes on a P-substrate or a bottom anode Schottky diode
JP2009159184A (ja) 2007-12-26 2009-07-16 Hitachi Ltd フリーホイールダイオードとを有する回路装置、及び、ダイオードを用いた回路装置とそれを用いた電力変換器
JP5565895B2 (ja) 2008-03-26 2014-08-06 日産自動車株式会社 半導体装置
US8304829B2 (en) 2008-12-08 2012-11-06 Fairchild Semiconductor Corporation Trench-based power semiconductor devices with increased breakdown voltage characteristics
US8174067B2 (en) * 2008-12-08 2012-05-08 Fairchild Semiconductor Corporation Trench-based power semiconductor devices with increased breakdown voltage characteristics
US8227855B2 (en) * 2009-02-09 2012-07-24 Fairchild Semiconductor Corporation Semiconductor devices with stable and controlled avalanche characteristics and methods of fabricating the same
US8148749B2 (en) * 2009-02-19 2012-04-03 Fairchild Semiconductor Corporation Trench-shielded semiconductor device
US8049276B2 (en) * 2009-06-12 2011-11-01 Fairchild Semiconductor Corporation Reduced process sensitivity of electrode-semiconductor rectifiers
JP5171776B2 (ja) 2009-09-30 2013-03-27 株式会社日立製作所 半導体装置、及びそれを用いた電力変換装置
US8816468B2 (en) 2010-10-21 2014-08-26 Vishay General Semiconductor Llc Schottky rectifier
CN103443925B (zh) * 2010-12-28 2016-03-09 三菱电机株式会社 半导体装置
JP5644536B2 (ja) * 2011-01-21 2014-12-24 三菱電機株式会社 電力用半導体装置
US8461646B2 (en) 2011-02-04 2013-06-11 Vishay General Semiconductor Llc Trench MOS barrier schottky (TMBS) having multiple floating gates
JP2012174878A (ja) * 2011-02-22 2012-09-10 Hitachi Ltd 半導体装置、及びそれを用いた装置
JP5306392B2 (ja) 2011-03-03 2013-10-02 株式会社東芝 半導体整流装置
JP2013243186A (ja) * 2012-05-18 2013-12-05 Origin Electric Co Ltd 半導体素子
JP6082229B2 (ja) * 2012-10-30 2017-02-15 住友化学株式会社 窒化物半導体素子およびその製造方法
JP5865860B2 (ja) * 2013-03-25 2016-02-17 株式会社東芝 半導体装置
WO2015001618A1 (ja) * 2013-07-02 2015-01-08 三菱電機株式会社 逆流防止装置、電力変換装置及び冷凍空気調和装置
CN103346169B (zh) * 2013-07-24 2016-04-20 清华大学 SiC结势垒肖特基二极管及其制造方法
DE102013019851B4 (de) * 2013-11-26 2015-10-22 Infineon Technologies Ag Schottky-Diode mit reduzierter Flussspannung
JP6194812B2 (ja) 2014-02-18 2017-09-13 トヨタ自動車株式会社 半導体モジュール
US9673287B2 (en) * 2014-12-15 2017-06-06 Infineon Technologies Americas Corp. Reliable and robust electrical contact
EP3038162B1 (de) * 2014-12-24 2019-09-04 ABB Schweiz AG Sperrschicht-Schottky-Gleichrichter
JP2020013821A (ja) * 2018-07-13 2020-01-23 トヨタ自動車株式会社 ダイオード構造を有する半導体装置
JP7408941B2 (ja) 2019-07-25 2024-01-09 富士電機株式会社 電力変換装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635473A (en) * 1979-08-29 1981-04-08 Nippon Telegr & Teleph Corp <Ntt> P-n junction type rectifying diode
JPS5860577A (ja) * 1981-10-07 1983-04-11 Hitachi Ltd 半導体装置
JPH0234190B2 (ja) * 1981-12-28 1990-08-01 Toyo Electric Mfg Co Ltd Kosokudaioodo
GB2176339A (en) * 1985-06-10 1986-12-17 Philips Electronic Associated Semiconductor device with schottky junctions
JPH02105465A (ja) * 1988-10-14 1990-04-18 Sanken Electric Co Ltd ショットキバリア半導体装置
JPH08188560A (ja) * 1995-01-06 1996-07-23 Kao Corp 多鎖型アミン誘導体及びその製造方法

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DE69120995T2 (de) 1996-12-19
EP0450306B1 (de) 1996-07-24

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