DE69120995D1 - Hochgeschwindigkeitsdiode und Verfahren zur Herstellung - Google Patents
Hochgeschwindigkeitsdiode und Verfahren zur HerstellungInfo
- Publication number
- DE69120995D1 DE69120995D1 DE69120995T DE69120995T DE69120995D1 DE 69120995 D1 DE69120995 D1 DE 69120995D1 DE 69120995 T DE69120995 T DE 69120995T DE 69120995 T DE69120995 T DE 69120995T DE 69120995 D1 DE69120995 D1 DE 69120995D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- high speed
- speed diode
- diode
- speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/483—Converters with outputs that each can have more than two voltages levels
- H02M7/487—Neutral point clamped inverters
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
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- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
- H03K17/0814—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit
- H03K17/08148—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the output circuit in composite switches
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- H01L2224/0554—External layer
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- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
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- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2045434A JP2590284B2 (ja) | 1990-02-28 | 1990-02-28 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69120995D1 true DE69120995D1 (de) | 1996-08-29 |
DE69120995T2 DE69120995T2 (de) | 1996-12-19 |
Family
ID=12719205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69120995T Expired - Fee Related DE69120995T2 (de) | 1990-02-28 | 1991-02-27 | Hochgeschwindigkeitsdiode und Verfahren zur Herstellung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5101244A (de) |
EP (1) | EP0450306B1 (de) |
JP (1) | JP2590284B2 (de) |
DE (1) | DE69120995T2 (de) |
Families Citing this family (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5278443A (en) * | 1990-02-28 | 1994-01-11 | Hitachi, Ltd. | Composite semiconductor device with Schottky and pn junctions |
US5731970A (en) * | 1989-12-22 | 1998-03-24 | Hitachi, Ltd. | Power conversion device and semiconductor module suitable for use in the device |
JPH0656885B2 (ja) * | 1990-11-28 | 1994-07-27 | 工業技術院長 | サージ防護デバイス |
JP3074736B2 (ja) * | 1990-12-28 | 2000-08-07 | 富士電機株式会社 | 半導体装置 |
US5345100A (en) * | 1991-03-29 | 1994-09-06 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor rectifier having high breakdown voltage and high speed operation |
DE69226141T2 (de) * | 1991-09-20 | 1998-12-03 | Hitachi Ltd | Dreiphasiger dreistufiger Wechselrichter |
DE4135259C1 (de) * | 1991-10-25 | 1993-01-07 | Semikron Elektronik Gmbh, 8500 Nuernberg, De | |
DE4135258C2 (de) * | 1991-10-25 | 1996-05-02 | Semikron Elektronik Gmbh | Schnelle Leistungsdiode |
DE4201183A1 (de) * | 1992-01-17 | 1993-07-22 | Eupec Gmbh & Co Kg | Leistungsdiode |
JPH06196723A (ja) * | 1992-04-28 | 1994-07-15 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
US5241195A (en) * | 1992-08-13 | 1993-08-31 | North Carolina State University At Raleigh | Merged P-I-N/Schottky power rectifier having extended P-I-N junction |
JP2809253B2 (ja) * | 1992-10-02 | 1998-10-08 | 富士電機株式会社 | 注入制御型ショットキーバリア整流素子 |
DE4236557C2 (de) * | 1992-10-29 | 2002-08-01 | Semikron Elektronik Gmbh | Leistungs- Halbleiterbauelement |
US5418866A (en) * | 1993-10-08 | 1995-05-23 | E. I. Du Pont De Nemours And Company | Surface acoustic wave devices for controlling high frequency signals using modified crystalline materials |
US5629552A (en) * | 1995-01-17 | 1997-05-13 | Ixys Corporation | Stable high voltage semiconductor device structure |
US5969400A (en) * | 1995-03-15 | 1999-10-19 | Kabushiki Kaisha Toshiba | High withstand voltage semiconductor device |
JP3287269B2 (ja) * | 1997-06-02 | 2002-06-04 | 富士電機株式会社 | ダイオードとその製造方法 |
DE19740195C2 (de) * | 1997-09-12 | 1999-12-02 | Siemens Ag | Halbleiterbauelement mit Metall-Halbleiterübergang mit niedrigem Sperrstrom |
US6184563B1 (en) * | 1998-07-27 | 2001-02-06 | Ho-Yuan Yu | Device structure for providing improved Schottky barrier rectifier |
EP1225639A1 (de) * | 2001-01-22 | 2002-07-24 | STMicroelectronics S.r.l. | Schottkydiode aus Silizium |
US6462393B2 (en) | 2001-03-20 | 2002-10-08 | Fabtech, Inc. | Schottky device |
JP2003338620A (ja) * | 2002-05-22 | 2003-11-28 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US8093652B2 (en) * | 2002-08-28 | 2012-01-10 | Ixys Corporation | Breakdown voltage for power devices |
JP2004127968A (ja) * | 2002-09-30 | 2004-04-22 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
DE10326739B3 (de) * | 2003-06-13 | 2005-03-24 | Infineon Technologies Ag | Halbleiterbauelement mit Schottky-Metallkontakt |
JP4686782B2 (ja) * | 2003-06-20 | 2011-05-25 | 国立大学法人東北大学 | 静電誘導ダイオード |
JP2005243716A (ja) * | 2004-02-24 | 2005-09-08 | Sanyo Electric Co Ltd | 半導体装置 |
DE102005023882B3 (de) * | 2005-05-24 | 2007-02-01 | Infineon Technologies Ag | Hochgeschwindigkeitsdiode |
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JP5171776B2 (ja) | 2009-09-30 | 2013-03-27 | 株式会社日立製作所 | 半導体装置、及びそれを用いた電力変換装置 |
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US8461646B2 (en) | 2011-02-04 | 2013-06-11 | Vishay General Semiconductor Llc | Trench MOS barrier schottky (TMBS) having multiple floating gates |
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JP5306392B2 (ja) | 2011-03-03 | 2013-10-02 | 株式会社東芝 | 半導体整流装置 |
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JP6082229B2 (ja) * | 2012-10-30 | 2017-02-15 | 住友化学株式会社 | 窒化物半導体素子およびその製造方法 |
JP5865860B2 (ja) * | 2013-03-25 | 2016-02-17 | 株式会社東芝 | 半導体装置 |
WO2015001618A1 (ja) * | 2013-07-02 | 2015-01-08 | 三菱電機株式会社 | 逆流防止装置、電力変換装置及び冷凍空気調和装置 |
CN103346169B (zh) * | 2013-07-24 | 2016-04-20 | 清华大学 | SiC结势垒肖特基二极管及其制造方法 |
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JP6194812B2 (ja) | 2014-02-18 | 2017-09-13 | トヨタ自動車株式会社 | 半導体モジュール |
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EP3038162B1 (de) * | 2014-12-24 | 2019-09-04 | ABB Schweiz AG | Sperrschicht-Schottky-Gleichrichter |
JP2020013821A (ja) * | 2018-07-13 | 2020-01-23 | トヨタ自動車株式会社 | ダイオード構造を有する半導体装置 |
JP7408941B2 (ja) | 2019-07-25 | 2024-01-09 | 富士電機株式会社 | 電力変換装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5635473A (en) * | 1979-08-29 | 1981-04-08 | Nippon Telegr & Teleph Corp <Ntt> | P-n junction type rectifying diode |
JPS5860577A (ja) * | 1981-10-07 | 1983-04-11 | Hitachi Ltd | 半導体装置 |
JPH0234190B2 (ja) * | 1981-12-28 | 1990-08-01 | Toyo Electric Mfg Co Ltd | Kosokudaioodo |
GB2176339A (en) * | 1985-06-10 | 1986-12-17 | Philips Electronic Associated | Semiconductor device with schottky junctions |
JPH02105465A (ja) * | 1988-10-14 | 1990-04-18 | Sanken Electric Co Ltd | ショットキバリア半導体装置 |
JPH08188560A (ja) * | 1995-01-06 | 1996-07-23 | Kao Corp | 多鎖型アミン誘導体及びその製造方法 |
-
1990
- 1990-02-28 JP JP2045434A patent/JP2590284B2/ja not_active Expired - Fee Related
-
1991
- 1991-02-26 US US07/660,872 patent/US5101244A/en not_active Expired - Lifetime
- 1991-02-27 EP EP91102925A patent/EP0450306B1/de not_active Expired - Lifetime
- 1991-02-27 DE DE69120995T patent/DE69120995T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH03250670A (ja) | 1991-11-08 |
EP0450306A1 (de) | 1991-10-09 |
JP2590284B2 (ja) | 1997-03-12 |
US5101244A (en) | 1992-03-31 |
DE69120995T2 (de) | 1996-12-19 |
EP0450306B1 (de) | 1996-07-24 |
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