DE69031401D1 - Halbleiterlaser, Halbleiter-Wafer und Verfahren zur Herstellung derselben - Google Patents
Halbleiterlaser, Halbleiter-Wafer und Verfahren zur Herstellung derselbenInfo
- Publication number
- DE69031401D1 DE69031401D1 DE69031401T DE69031401T DE69031401D1 DE 69031401 D1 DE69031401 D1 DE 69031401D1 DE 69031401 T DE69031401 T DE 69031401T DE 69031401 T DE69031401 T DE 69031401T DE 69031401 D1 DE69031401 D1 DE 69031401D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor
- manufacturing
- methods
- same
- lasers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 235000012431 wafers Nutrition 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/24—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a grooved structure, e.g. V-grooved, crescent active layer in groove, VSIS laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32325—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm red laser based on InGaP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/3235—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers
- H01S5/32391—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength longer than 1000 nm, e.g. InP-based 1300 nm and 1500 nm lasers based on In(Ga)(As)P
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1111399A JPH07109926B2 (ja) | 1989-04-28 | 1989-04-28 | 半導体レーザ装置及びその製造方法 |
JP14561989A JPH039592A (ja) | 1989-06-07 | 1989-06-07 | 半導体ウェーハの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69031401D1 true DE69031401D1 (de) | 1997-10-16 |
DE69031401T2 DE69031401T2 (de) | 1998-03-19 |
Family
ID=26450798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69031401T Expired - Fee Related DE69031401T2 (de) | 1989-04-28 | 1990-04-27 | Halbleiterlaser, Halbleiter-Wafer und Verfahren zur Herstellung derselben |
Country Status (3)
Country | Link |
---|---|
US (1) | US5042044A (de) |
EP (1) | EP0395436B1 (de) |
DE (1) | DE69031401T2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2547464B2 (ja) * | 1990-04-13 | 1996-10-23 | シャープ株式会社 | 半導体レーザ素子の製造方法 |
EP0627799B1 (de) * | 1993-06-04 | 1997-10-08 | Sharp Kabushiki Kaisha | Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55124292A (en) * | 1979-03-19 | 1980-09-25 | Matsushita Electric Ind Co Ltd | Semiconductor laser device and method of fabricating the same |
US4317085A (en) * | 1979-09-12 | 1982-02-23 | Xerox Corporation | Channeled mesa laser |
US4461008A (en) * | 1982-04-09 | 1984-07-17 | Rca Corporation | Terraced heterostructure semiconductor laser |
US4523318A (en) * | 1982-10-29 | 1985-06-11 | Rca Corporation | Semiconductor laser having high manufacturing yield |
JPS60214580A (ja) * | 1984-04-10 | 1985-10-26 | Sharp Corp | 半導体レ−ザアレイ装置 |
JPS6146995A (ja) * | 1984-08-11 | 1986-03-07 | 富士通株式会社 | 音声認識システム |
EP0199588B1 (de) * | 1985-04-23 | 1993-09-01 | Sharp Kabushiki Kaisha | Halbleiterlaservorrichtung |
JPS6238875A (ja) * | 1985-08-12 | 1987-02-19 | Hitachi Ltd | 配電器駆動装置 |
JPS6265492A (ja) * | 1985-09-18 | 1987-03-24 | Sharp Corp | 半導体レ−ザ−素子 |
JPS6321358A (ja) * | 1986-07-16 | 1988-01-28 | Diesel Kiki Co Ltd | 分配型燃料噴射ポンプ |
JPS63307792A (ja) * | 1987-06-09 | 1988-12-15 | Sharp Corp | 半導体レ−ザアレイ素子及びその製造方法 |
JPH069275B2 (ja) * | 1987-05-19 | 1994-02-02 | シャープ株式会社 | 半導体レ−ザアレイ装置 |
JP2639933B2 (ja) * | 1987-05-19 | 1997-08-13 | 三洋電機株式会社 | 半導体レーザの製造方法 |
JPS648689A (en) * | 1987-06-30 | 1989-01-12 | Sharp Kk | Semiconductor laser array element and manufacture thereof |
JPH0728098B2 (ja) * | 1987-06-01 | 1995-03-29 | 三洋電機株式会社 | 半導体レ−ザの製造方法 |
JPH0646668B2 (ja) * | 1987-07-28 | 1994-06-15 | シャープ株式会社 | 半導体レ−ザアレイ素子 |
JPH06103775B2 (ja) * | 1987-07-31 | 1994-12-14 | シャープ株式会社 | 半導体レ−ザアレイ装置 |
JPH01259589A (ja) * | 1988-04-09 | 1989-10-17 | Toshiba Corp | 半導体レーザ素子 |
-
1990
- 1990-04-27 DE DE69031401T patent/DE69031401T2/de not_active Expired - Fee Related
- 1990-04-27 US US07/513,508 patent/US5042044A/en not_active Expired - Fee Related
- 1990-04-27 EP EP90304612A patent/EP0395436B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5042044A (en) | 1991-08-20 |
EP0395436A2 (de) | 1990-10-31 |
EP0395436B1 (de) | 1997-09-10 |
DE69031401T2 (de) | 1998-03-19 |
EP0395436A3 (de) | 1991-09-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE68926986D1 (de) | Halbleiterlaser und Verfahren zur Herstellung desselben | |
DE69032451D1 (de) | Halbleiterlaser und Verfahren zur Herstellung desselben | |
DE69027368D1 (de) | Halbleiterlaser und Verfahren zur Herstellung desselben | |
DE69025842D1 (de) | Lichtemittierende Halbleitervorrichtung und Verfahren zu ihrer Herstellung | |
DE69130346T2 (de) | Verfahren zur Herstellung von Halbleiteranordnungen | |
DE3888885D1 (de) | Halbleiteranordnung und verfahren zur herstellung. | |
DE68919408D1 (de) | Verbindungshalbleiter, denselben anwendendes Halbleiter-Bauelement und Herstellungsverfahren des Halbleiter-Bauelementes. | |
DE3650323D1 (de) | VLSI-Chip und Verfahren zur Herstellung. | |
DE69002432D1 (de) | Diamant-halbleiter-bauteil und methode zu seiner herstellung. | |
DE68924132D1 (de) | Halbleiterbauteil und Verfahren zur dessen Herstellung. | |
DE69323827T2 (de) | Diamant-Halbleiter und Verfahren zur Herstellung | |
DE69026353D1 (de) | Feldemissionsvorrichtung und Verfahren zur Herstellung derselben | |
DE69429218D1 (de) | Vorrichtung zur schnellen thermischen behandlung zur herstellung von halbleiterwafers | |
DE69528117T2 (de) | Verfahren zur Herstellung von Halbleiter-Anordnungen | |
DE69431023D1 (de) | Halbleiteraufbau und Verfahren zur Herstellung | |
DE69224819D1 (de) | Methode zur Herstellung von Halbleiterchips | |
DE68912722D1 (de) | Halbleiterlaservorrichtung und Verfahren zu deren Herstellung. | |
DE69304455D1 (de) | Halbleiterlaser und Verfahren zur Herstellung | |
DE69027960D1 (de) | Elektronen emittierendes Element und Verfahren zur Herstellung desselben | |
DE69014454D1 (de) | Hochspannungs-Halbleiteranordnung und Verfahren zur Herstellung. | |
DE69508885D1 (de) | Halbleiterdiode und Verfahren zur Herstellung | |
DE68923686D1 (de) | Halbleiterkarte und verfahren zur herstellung. | |
DE69104300D1 (de) | Ultraviolett-Halbleiterlaser und Verfahren zur Herstellung desselben. | |
DE68914927D1 (de) | Halbleiteranordnung vom mit Plastik umhüllten Typ und Verfahren zur Herstellung derselben. | |
DE3788841D1 (de) | Halbleiterlaservorrichtung und Verfahren zur Herstellung derselben. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |