IT9047969A0 - Procedimento per applicare terminazioni conduttrici su componenti elettronici ceramici. - Google Patents

Procedimento per applicare terminazioni conduttrici su componenti elettronici ceramici.

Info

Publication number
IT9047969A0
IT9047969A0 IT9047969A IT4796990A IT9047969A0 IT 9047969 A0 IT9047969 A0 IT 9047969A0 IT 9047969 A IT9047969 A IT 9047969A IT 4796990 A IT4796990 A IT 4796990A IT 9047969 A0 IT9047969 A0 IT 9047969A0
Authority
IT
Italy
Prior art keywords
procedure
electronic components
ceramic electronic
applying conductive
conductive terminations
Prior art date
Application number
IT9047969A
Other languages
English (en)
Other versions
IT1240452B (it
IT9047969A1 (it
Inventor
Victor Insetta
Richard V Monsorno
John F Dorrian
Original Assignee
American Tech Ceramics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Tech Ceramics filed Critical American Tech Ceramics
Publication of IT9047969A0 publication Critical patent/IT9047969A0/it
Publication of IT9047969A1 publication Critical patent/IT9047969A1/it
Application granted granted Critical
Publication of IT1240452B publication Critical patent/IT1240452B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making
    • Y10T29/435Solid dielectric type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Ceramic Products (AREA)
  • Aftertreatments Of Artificial And Natural Stones (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT47969A 1989-05-25 1990-05-17 Procedimento per applicare terminazioni conduttrici su componenti elettronici ceramici IT1240452B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/356,518 US4953273A (en) 1989-05-25 1989-05-25 Process for applying conductive terminations to ceramic components

Publications (3)

Publication Number Publication Date
IT9047969A0 true IT9047969A0 (it) 1990-05-17
IT9047969A1 IT9047969A1 (it) 1991-11-17
IT1240452B IT1240452B (it) 1993-12-16

Family

ID=23401771

Family Applications (1)

Application Number Title Priority Date Filing Date
IT47969A IT1240452B (it) 1989-05-25 1990-05-17 Procedimento per applicare terminazioni conduttrici su componenti elettronici ceramici

Country Status (7)

Country Link
US (1) US4953273A (it)
JP (1) JPH03148813A (it)
CA (1) CA2014947C (it)
DE (1) DE4015463C2 (it)
FR (1) FR2647587A1 (it)
GB (1) GB2233497A (it)
IT (1) IT1240452B (it)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5430605A (en) * 1992-08-04 1995-07-04 Murata Erie North America, Inc. Composite multilayer capacitive device and method for fabricating the same
US5227951A (en) * 1992-08-04 1993-07-13 Murata Erie North America, Inc. Composite multilayer capacitive device and method for fabricating the same
JP2976262B2 (ja) * 1992-09-25 1999-11-10 株式会社村田製作所 電子部品の製造方法
JPH06236820A (ja) * 1993-01-11 1994-08-23 Boam R & D Co Ltd フェライト磁性体チップビードアレイの製造方法
KR970008754B1 (en) * 1994-12-23 1997-05-28 Korea Inst Sci & Tech Multilayer ceramic capacitor and production thereof
JP3094939B2 (ja) * 1997-03-19 2000-10-03 株式会社村田製作所 電子部品の製造方法
US6678927B1 (en) * 1997-11-24 2004-01-20 Avx Corporation Miniature surface mount capacitor and method of making same
JP2003532284A (ja) * 2000-04-25 2003-10-28 エプコス アクチエンゲゼルシャフト 電気的構造素子、その製造法および該構造素子の使用
US6906909B2 (en) * 2003-10-23 2005-06-14 John E. Stauffer A C capacitor
WO2006126333A1 (ja) * 2005-05-26 2006-11-30 Murata Manufacturing Co., Ltd. 積層セラミック電子部品およびその製造方法
DE102005040685A1 (de) * 2005-08-26 2007-03-01 Epcos Ag Elektrisches Bauelement und Verfahren zur Herstellung von elektrischen Bauelementen
US7832618B2 (en) * 2007-01-31 2010-11-16 Avx Corporation Termination bonding
JP5630603B2 (ja) * 2010-09-15 2014-11-26 Tdk株式会社 サーミスタ素子
US9374901B2 (en) 2012-08-10 2016-06-21 Murata Manufacturing Co., Ltd. Monolithic capacitor mounting structure and monolithic capacitor
JP5724968B2 (ja) * 2012-08-10 2015-05-27 株式会社村田製作所 積層コンデンサおよび回路基板の振動音低減方法
JP7034613B2 (ja) * 2017-06-29 2022-03-14 太陽誘電株式会社 セラミック電子部品及びその製造方法、並びに電子部品実装基板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE26421E (en) * 1968-07-02 Process for manufacturing multilayer ceramic capacitors
US3235939A (en) * 1962-09-06 1966-02-22 Aerovox Corp Process for manufacturing multilayer ceramic capacitors
FR1393294A (fr) * 1963-12-02 1965-03-26 Electro Materials Matériau céramique diélectrique pour condensateurs
US3852877A (en) * 1969-08-06 1974-12-10 Ibm Multilayer circuits
US3851228A (en) * 1972-04-20 1974-11-26 Du Pont Capacitor with copper oxide containing electrode
US4109377A (en) * 1976-02-03 1978-08-29 International Business Machines Corporation Method for preparing a multilayer ceramic
US4325763A (en) * 1978-04-25 1982-04-20 Nippon Electric Company, Ltd. Method of manufacturing ceramic capacitors
US4241378A (en) * 1978-06-12 1980-12-23 Erie Technological Products, Inc. Base metal electrode capacitor and method of making the same
US4353153A (en) * 1978-11-16 1982-10-12 Union Carbide Corporation Method of making capacitor with CO-fired end terminations
US4246625A (en) * 1978-11-16 1981-01-20 Union Carbide Corporation Ceramic capacitor with co-fired end terminations
US4574329A (en) * 1983-10-07 1986-03-04 U.S. Philips Corporation Multilayer ceramic capacitor
JPS61193418A (ja) * 1985-02-21 1986-08-27 株式会社村田製作所 積層セラミツクコンデンサ
FR2585174B1 (fr) * 1985-07-16 1987-11-27 Eurofarad Procede de fabrication d'un composant capacitif multicouche a dielectrique ceramique du type cordierite, et composant ainsi obtenu
JPS62131412A (ja) * 1985-11-30 1987-06-13 太陽誘電株式会社 誘電体磁器組成物
CA1273853A (en) * 1986-12-17 1990-09-11 Hitoshi Suzuki Method for production of ceramic circuit board
US4875136A (en) * 1987-09-03 1989-10-17 Murata Manufacturing Co., Ltd. Ceramic capacitor and method of manufacturing the same

Also Published As

Publication number Publication date
GB9011715D0 (en) 1990-07-18
GB2233497A (en) 1991-01-09
US4953273A (en) 1990-09-04
DE4015463A1 (de) 1990-11-29
FR2647587A1 (fr) 1990-11-30
IT1240452B (it) 1993-12-16
CA2014947A1 (en) 1990-11-25
DE4015463C2 (de) 1997-07-03
CA2014947C (en) 1994-03-08
JPH03148813A (ja) 1991-06-25
IT9047969A1 (it) 1991-11-17

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960419