DE69011568D1 - Montagevorrichtung für elektrische Bauteile. - Google Patents

Montagevorrichtung für elektrische Bauteile.

Info

Publication number
DE69011568D1
DE69011568D1 DE69011568T DE69011568T DE69011568D1 DE 69011568 D1 DE69011568 D1 DE 69011568D1 DE 69011568 T DE69011568 T DE 69011568T DE 69011568 T DE69011568 T DE 69011568T DE 69011568 D1 DE69011568 D1 DE 69011568D1
Authority
DE
Germany
Prior art keywords
electrical components
mounting device
mounting
electrical
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69011568T
Other languages
English (en)
Other versions
DE69011568T2 (de
Inventor
Takao Eguchi
Motoshi Shitanda
Makito Seno
Wataru Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69011568D1 publication Critical patent/DE69011568D1/de
Publication of DE69011568T2 publication Critical patent/DE69011568T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
DE69011568T 1989-04-27 1990-04-25 Montagevorrichtung für elektrische Bauteile. Expired - Fee Related DE69011568T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1108802A JPH07100265B2 (ja) 1989-04-27 1989-04-27 部品装着装置

Publications (2)

Publication Number Publication Date
DE69011568D1 true DE69011568D1 (de) 1994-09-22
DE69011568T2 DE69011568T2 (de) 1995-04-13

Family

ID=14493853

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69011568T Expired - Fee Related DE69011568T2 (de) 1989-04-27 1990-04-25 Montagevorrichtung für elektrische Bauteile.

Country Status (5)

Country Link
US (1) US4999909A (de)
EP (1) EP0394981B1 (de)
JP (1) JPH07100265B2 (de)
KR (1) KR920007124B1 (de)
DE (1) DE69011568T2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0821790B2 (ja) * 1990-02-15 1996-03-04 松下電器産業株式会社 ロータリーヘッド式電子部品実装装置
JP2841856B2 (ja) * 1990-11-29 1998-12-24 松下電器産業株式会社 電子部品実装装置
JP2839364B2 (ja) * 1990-11-29 1998-12-16 松下電器産業株式会社 電子部品実装装置
JP2636087B2 (ja) * 1991-03-28 1997-07-30 松下電器産業株式会社 部品供給方法
JP2540673B2 (ja) * 1991-07-10 1996-10-09 株式会社テンリュウテクニックス トレイおよび電子部品の供給装置
GB2262516B (en) * 1991-12-21 1995-03-22 Tdk Corp Electronic component feed system
JPH0846388A (ja) * 1994-08-03 1996-02-16 Matsushita Electric Ind Co Ltd 部品実装装置
JP3301880B2 (ja) * 1995-01-17 2002-07-15 松下電器産業株式会社 部品装着方法及び装置
JP3549327B2 (ja) * 1996-03-11 2004-08-04 松下電器産業株式会社 部品装着方法及び部品装着機
WO1998036629A1 (en) * 1997-02-17 1998-08-20 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic components
JP3369071B2 (ja) * 1997-02-21 2003-01-20 松下電器産業株式会社 電子部品供給方法およびその装置
JPH10313194A (ja) * 1997-05-12 1998-11-24 Fuji Mach Mfg Co Ltd 回路部品供給装置，フィーダおよび回路部品供給方法
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
JP3739218B2 (ja) * 1998-04-02 2006-01-25 松下電器産業株式会社 部品装着方法及び装置
US6629007B1 (en) * 1998-12-25 2003-09-30 Matsushita Electric Industrial Co., Ltd. Apparatus and method for notifying lack of component in advance, component mounting apparatus, and article of manufacture comprising computer usable medium
JP2006049336A (ja) * 2004-07-30 2006-02-16 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
KR100546419B1 (ko) * 2004-09-03 2006-01-26 삼성전자주식회사 다이 어태치 장치, 이를 세정하는 세정 시스템 및 그세정방법
EP2069351B1 (de) 2006-06-20 2015-10-28 AbbVie Inc. Pyrazolochinazolinone als parp-inhibitoren
KR101594083B1 (ko) * 2009-08-04 2016-02-16 한화테크윈 주식회사 전자 부품 제조 장치
CN102975016B (zh) * 2012-11-16 2015-03-11 深圳雷柏科技股份有限公司 伺服夹紧机构和设有机器人的鼠标组装系统
EP3020661B1 (de) * 2013-07-12 2019-06-26 FUJI Corporation Eine steuerungsvorrichtung zur automatischen verteilung von zuführgeräten sowie eine entsprechende methode
WO2017085782A1 (ja) * 2015-11-17 2017-05-26 富士機械製造株式会社 実装処理方法、実装システム、交換制御装置および部品実装機

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2821926C2 (de) * 1978-05-19 1981-09-17 Bernhard 8011 Höhenkirchen Spörer Montageeinrichtung zur Bestückung von Schaltungsträgerplatinen mit elektrischen Bauelementen
DE3119686A1 (de) * 1981-05-18 1982-12-02 Siemens AG, 1000 Berlin und 8000 München Be- und entstueckautomat fuer bauelemente
JPS62140499A (ja) * 1985-12-13 1987-06-24 富士機械製造株式会社 二つの部品供給テ−ブルを備えた電子部品実装装置

Also Published As

Publication number Publication date
EP0394981A2 (de) 1990-10-31
DE69011568T2 (de) 1995-04-13
JPH07100265B2 (ja) 1995-11-01
US4999909A (en) 1991-03-19
EP0394981A3 (de) 1991-02-20
JPH02284825A (ja) 1990-11-22
KR920007124B1 (ko) 1992-08-24
KR900017456A (ko) 1990-11-16
EP0394981B1 (de) 1994-08-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee