KR880701784A - 전자. 전기 기기 도전부품용 재료 - Google Patents
전자. 전기 기기 도전부품용 재료Info
- Publication number
- KR880701784A KR880701784A KR1019880700652A KR880700652A KR880701784A KR 880701784 A KR880701784 A KR 880701784A KR 1019880700652 A KR1019880700652 A KR 1019880700652A KR 880700652 A KR880700652 A KR 880700652A KR 880701784 A KR880701784 A KR 880701784A
- Authority
- KR
- South Korea
- Prior art keywords
- electronic
- materials
- electrical parts
- electrical
- parts
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61240713A JPH0674479B2 (ja) | 1986-10-09 | 1986-10-09 | リードフレーム、コネクタもしくはスイッチ用導電圧延材料 |
JP61/240713 | 1986-10-09 | ||
PCT/JP1987/000758 WO1988002788A1 (en) | 1986-10-09 | 1987-10-08 | Material for conductive parts of electronic and electric appliances |
Publications (2)
Publication Number | Publication Date |
---|---|
KR880701784A true KR880701784A (ko) | 1988-11-05 |
KR950013290B1 KR950013290B1 (ko) | 1995-11-02 |
Family
ID=17063600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880700652A KR950013290B1 (ko) | 1986-10-09 | 1987-10-08 | 전자 전기기기 도전부품용 재료 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4908078A (ko) |
JP (1) | JPH0674479B2 (ko) |
KR (1) | KR950013290B1 (ko) |
WO (1) | WO1988002788A1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0230728A (ja) * | 1988-07-20 | 1990-02-01 | Sky Alum Co Ltd | プリント回路基板およびicカード |
US5110545A (en) * | 1989-02-24 | 1992-05-05 | Golden Aluminum Company | Aluminum alloy composition |
AU8851391A (en) * | 1990-09-05 | 1992-03-30 | Golden Aluminum Company | Aluminum alloy composition |
EP0489427A1 (en) * | 1990-12-05 | 1992-06-10 | Sumitomo Metal Industries, Ltd. | Surface-coated aluminum material |
KR100377981B1 (ko) * | 1994-06-07 | 2003-05-27 | 텍사스 인스트루먼츠 인코포레이티드 | 성형화합물큐어링방법 |
US6071759A (en) * | 1996-07-15 | 2000-06-06 | Matsushita Electronics Corporation | Method for manufacturing semiconductor apparatus |
JP2000150652A (ja) * | 1998-09-03 | 2000-05-30 | Seiko Epson Corp | 半導体装置およびその製造方法 |
EP1154471B1 (en) * | 1998-09-30 | 2008-07-16 | Ibiden Co., Ltd. | Semiconductor chip with bump contacts |
JP3528665B2 (ja) | 1998-10-20 | 2004-05-17 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
US6747343B2 (en) * | 2000-03-08 | 2004-06-08 | Texas Instruments Incorporated | Aluminum leadframes with two nickel layers |
TW457674B (en) * | 1999-03-15 | 2001-10-01 | Texas Instruments Inc | Aluminum leadframes for semiconductor devices and method of fabrication |
US6225684B1 (en) | 2000-02-29 | 2001-05-01 | Texas Instruments Tucson Corporation | Low temperature coefficient leadframe |
US20150337413A1 (en) * | 2012-11-30 | 2015-11-26 | Inha-Industry Partnership Institute | High heat-dissipating high strength aluminum alloy |
WO2017066609A1 (en) | 2015-10-14 | 2017-04-20 | NanoAL LLC | Aluminum-iron-zirconium alloys |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50106106A (ko) * | 1973-08-03 | 1975-08-21 | ||
JPS58124235A (ja) * | 1982-01-20 | 1983-07-23 | Hitachi Cable Ltd | 半導体装置用アルミ合金極細線 |
JPS61136653A (ja) * | 1984-12-08 | 1986-06-24 | Nippon Light Metal Co Ltd | アルミニウム極細線の製造方法 |
JPS61166939A (ja) * | 1985-01-16 | 1986-07-28 | Furukawa Electric Co Ltd:The | 半導体素子ボンデイング用アルミニウム線材 |
JPS6296642A (ja) * | 1985-10-22 | 1987-05-06 | Sumitomo Electric Ind Ltd | ボンデイングワイヤ用アルミニウム合金 |
JPS6296644A (ja) * | 1985-10-24 | 1987-05-06 | Nippon Light Metal Co Ltd | リ−ドフレ−ム用アルミニウム合金 |
JPS6296641A (ja) * | 1985-10-24 | 1987-05-06 | Nippon Light Metal Co Ltd | リ−ドフレ−ム用アルミニウム合金 |
JPS6296638A (ja) * | 1985-10-24 | 1987-05-06 | Nippon Light Metal Co Ltd | リ−ドフレ−ム用アルミニウム合金 |
JPS62130254A (ja) * | 1985-11-29 | 1987-06-12 | Sumitomo Electric Ind Ltd | ボンデイングワイヤ用アルミニウム合金 |
-
1986
- 1986-10-09 JP JP61240713A patent/JPH0674479B2/ja not_active Expired - Lifetime
-
1987
- 1987-10-08 WO PCT/JP1987/000758 patent/WO1988002788A1/ja unknown
- 1987-10-08 US US07/207,310 patent/US4908078A/en not_active Expired - Fee Related
- 1987-10-08 KR KR1019880700652A patent/KR950013290B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1988002788A1 (en) | 1988-04-21 |
US4908078A (en) | 1990-03-13 |
JPS6396237A (ja) | 1988-04-27 |
JPH0674479B2 (ja) | 1994-09-21 |
KR950013290B1 (ko) | 1995-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |