GB2290171B - Inductor chip device - Google Patents

Inductor chip device

Info

Publication number
GB2290171B
GB2290171B GB9411107A GB9411107A GB2290171B GB 2290171 B GB2290171 B GB 2290171B GB 9411107 A GB9411107 A GB 9411107A GB 9411107 A GB9411107 A GB 9411107A GB 2290171 B GB2290171 B GB 2290171B
Authority
GB
United Kingdom
Prior art keywords
chip
substrate
multilayer
solder bumps
major surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9411107A
Other versions
GB2290171A (en
GB9411107D0 (en
Inventor
David John Pedder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Semiconductors Ltd
Original Assignee
Plessey Semiconductors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Semiconductors Ltd filed Critical Plessey Semiconductors Ltd
Priority to GB9411107A priority Critical patent/GB2290171B/en
Publication of GB9411107D0 publication Critical patent/GB9411107D0/en
Priority to ES95303410T priority patent/ES2139841T3/en
Priority to EP95303410A priority patent/EP0685857B1/en
Priority to DE69511940T priority patent/DE69511940T2/en
Priority to AT95303410T priority patent/ATE184419T1/en
Priority to JP7148222A priority patent/JPH07335439A/en
Publication of GB2290171A publication Critical patent/GB2290171A/en
Application granted granted Critical
Publication of GB2290171B publication Critical patent/GB2290171B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances

Abstract

An inductor chip device for mounting on multichip-module, direct-chip-attach or surface-mount assemblies comprises a dielectric substrate (12), a spiral metallisation structure (14) defined on one major surface of the substrate, and a plurality of solder bumps (18, 19) defined on the other major surface of the substrate, the spiral structure being electrically connected to the plurality of solder bumps by means of metal-filled vias. Single or multilayer inductors may be defined, the latter providing higher inductance values in the same chip area. The multilayer inductors are constructed using a multilayer metal-polyimide or similar dielectric structure. The chip inductor provides a very small, accurate, discrete device with high inductance, high Q-factor and high self-resonant frequency. <IMAGE>
GB9411107A 1994-06-03 1994-06-03 Inductor chip device Expired - Fee Related GB2290171B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB9411107A GB2290171B (en) 1994-06-03 1994-06-03 Inductor chip device
AT95303410T ATE184419T1 (en) 1994-06-03 1995-05-22 CHIP INDUCTIVITY ARRANGEMENT
EP95303410A EP0685857B1 (en) 1994-06-03 1995-05-22 Inductor chip device
DE69511940T DE69511940T2 (en) 1994-06-03 1995-05-22 Chip inductance arrangement
ES95303410T ES2139841T3 (en) 1994-06-03 1995-05-22 PLATE DEVICE WITH INDUCTOR.
JP7148222A JPH07335439A (en) 1994-06-03 1995-05-23 Inductor chip device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9411107A GB2290171B (en) 1994-06-03 1994-06-03 Inductor chip device

Publications (3)

Publication Number Publication Date
GB9411107D0 GB9411107D0 (en) 1994-07-27
GB2290171A GB2290171A (en) 1995-12-13
GB2290171B true GB2290171B (en) 1998-01-21

Family

ID=10756121

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9411107A Expired - Fee Related GB2290171B (en) 1994-06-03 1994-06-03 Inductor chip device

Country Status (6)

Country Link
EP (1) EP0685857B1 (en)
JP (1) JPH07335439A (en)
AT (1) ATE184419T1 (en)
DE (1) DE69511940T2 (en)
ES (1) ES2139841T3 (en)
GB (1) GB2290171B (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2292016B (en) * 1994-07-29 1998-07-22 Plessey Semiconductors Ltd Inductor device
WO1999033108A1 (en) * 1997-12-22 1999-07-01 Conexant Systems, Inc. Wireless inter-chip communication system and method
US6303423B1 (en) 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
JP2001358551A (en) 2000-06-15 2001-12-26 Matsushita Electric Ind Co Ltd Filter
DE10144464C2 (en) * 2001-09-10 2003-07-17 Infineon Technologies Ag Electronic component with an induction coil for high-frequency applications and method for producing the same
FR2830683A1 (en) * 2001-10-10 2003-04-11 St Microelectronics Sa Integrated circuit with inductance comprises spiral channel in which metal deposit forms inductance winding
KR20030048691A (en) * 2001-12-12 2003-06-25 삼성전자주식회사 low value, low variation high frequency inductor and method for manufacturing the same
US8384189B2 (en) 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
DE102006057332B4 (en) 2006-12-05 2018-01-25 Infineon Technologies Ag Assembly comprising a substrate and a chip mounted on the substrate
NL1036092C (en) * 2008-10-21 2010-04-22 Tetradon B V METHOD AND DEVICE FOR A MODULAR BUILT-IN TRANSFORMER
JP6574207B2 (en) 2014-05-05 2019-09-11 スリーディー グラス ソリューションズ，インク３Ｄ Ｇｌａｓｓ Ｓｏｌｕｔｉｏｎｓ，Ｉｎｃ 2D and 3D inductors, antennas, and transformers for manufacturing photoactive substrates
JP7071609B2 (en) 2016-02-25 2022-05-19 スリーディー グラス ソリューションズ，インク Capacitor array for manufacturing 3D capacitors and photoactive substrates
WO2017177171A1 (en) 2016-04-08 2017-10-12 3D Glass Solutions, Inc. Methods of fabricating photosensitive substrates suitable for optical coupler
CN209747274U (en) 2017-03-01 2019-12-06 株式会社村田制作所 Mounting substrate, electric element, vibration plate and electric component
AU2018297035B2 (en) 2017-07-07 2021-02-25 3D Glass Solutions, Inc. 2D and 3D RF lumped element devices for RF system in a package photoactive glass substrates
KR102614826B1 (en) 2017-12-15 2023-12-19 3디 글래스 솔루션즈 인코포레이티드 Coupled transmission line resonate rf filter
WO2019136024A1 (en) 2018-01-04 2019-07-11 3D Glass Solutions, Inc. Impedance matching conductive structure for high efficiency rf circuits
KR102322938B1 (en) 2018-09-17 2021-11-09 3디 글래스 솔루션즈 인코포레이티드 High Efficiency Compact Slot Antenna with Ground Plane
JP7257707B2 (en) 2018-12-28 2023-04-14 スリーディー グラス ソリューションズ，インク Annular capacitor RF, microwave and MM wave systems
JP7241433B2 (en) 2018-12-28 2023-03-17 スリーディー グラス ソリューションズ，インク Heterogeneous Integration for RF, Microwave and MM Wave Systems on Photoactive Glass Substrates
US11373908B2 (en) 2019-04-18 2022-06-28 3D Glass Solutions, Inc. High efficiency die dicing and release
US11908617B2 (en) 2020-04-17 2024-02-20 3D Glass Solutions, Inc. Broadband induction

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0078480A2 (en) * 1981-10-28 1983-05-11 Hitachi, Ltd. Method for fusing and connecting solder of IC chip
EP0189781A1 (en) * 1985-01-28 1986-08-06 Siemens Aktiengesellschaft Method for making a flat coil, and a flat coil for a shock wave tube
GB2226707A (en) * 1988-11-03 1990-07-04 Micro Strates Inc Ceramic substrate for hybrid microcircuits and method of making the same
EP0512718A1 (en) * 1991-05-02 1992-11-11 AT&T Corp. Process for making a ferrite multistructure
GB2263582A (en) * 1992-01-21 1993-07-28 Dale Electronics Electrical component conductive pattern formed by laser ablation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6215850A (en) * 1985-07-13 1987-01-24 Oki Electric Ind Co Ltd Multi-chip package substrate
JP2615151B2 (en) * 1988-08-19 1997-05-28 株式会社村田製作所 Chip coil and method of manufacturing the same
EP0398485B1 (en) * 1989-05-16 1995-08-09 Gec-Marconi Limited A method of making a Flip Chip Solder bond structure for devices with gold based metallisation
JPH04245410A (en) * 1991-01-30 1992-09-02 Sharp Corp Printed coil for double-tuned circuit use

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0078480A2 (en) * 1981-10-28 1983-05-11 Hitachi, Ltd. Method for fusing and connecting solder of IC chip
EP0189781A1 (en) * 1985-01-28 1986-08-06 Siemens Aktiengesellschaft Method for making a flat coil, and a flat coil for a shock wave tube
GB2226707A (en) * 1988-11-03 1990-07-04 Micro Strates Inc Ceramic substrate for hybrid microcircuits and method of making the same
EP0512718A1 (en) * 1991-05-02 1992-11-11 AT&T Corp. Process for making a ferrite multistructure
GB2263582A (en) * 1992-01-21 1993-07-28 Dale Electronics Electrical component conductive pattern formed by laser ablation

Also Published As

Publication number Publication date
DE69511940D1 (en) 1999-10-14
EP0685857A1 (en) 1995-12-06
GB2290171A (en) 1995-12-13
DE69511940T2 (en) 2000-05-04
JPH07335439A (en) 1995-12-22
ATE184419T1 (en) 1999-09-15
ES2139841T3 (en) 2000-02-16
GB9411107D0 (en) 1994-07-27
EP0685857B1 (en) 1999-09-08

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20040603