DE69815601D1 - Epoxyharzzusammentsetzung und ein Verfahren zur Herstellung einer mehrschichtigen Leiterplatte - Google Patents

Epoxyharzzusammentsetzung und ein Verfahren zur Herstellung einer mehrschichtigen Leiterplatte

Info

Publication number
DE69815601D1
DE69815601D1 DE69815601T DE69815601T DE69815601D1 DE 69815601 D1 DE69815601 D1 DE 69815601D1 DE 69815601 T DE69815601 T DE 69815601T DE 69815601 T DE69815601 T DE 69815601T DE 69815601 D1 DE69815601 D1 DE 69815601D1
Authority
DE
Germany
Prior art keywords
manufacturing
circuit board
resin composition
printed circuit
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69815601T
Other languages
English (en)
Other versions
DE69815601T2 (de
Inventor
Shigeo Nakamura
Yuki Miyazawa
Tadahiko Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of DE69815601D1 publication Critical patent/DE69815601D1/de
Application granted granted Critical
Publication of DE69815601T2 publication Critical patent/DE69815601T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE1998615601 1997-04-17 1998-04-17 Epoxyharzzusammentsetzung und ein Verfahren zur Herstellung einer mehrschichtigen Leiterplatte Expired - Lifetime DE69815601T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP10005797 1997-04-17
JP10005797 1997-04-17
JP17005297 1997-06-26
JP17005297A JP3785749B2 (ja) 1997-04-17 1997-06-26 エポキシ樹脂組成物並びに該組成物を用いた多層プリント配線板の製造法

Publications (2)

Publication Number Publication Date
DE69815601D1 true DE69815601D1 (de) 2003-07-24
DE69815601T2 DE69815601T2 (de) 2004-04-29

Family

ID=26441147

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1998615601 Expired - Lifetime DE69815601T2 (de) 1997-04-17 1998-04-17 Epoxyharzzusammentsetzung und ein Verfahren zur Herstellung einer mehrschichtigen Leiterplatte

Country Status (6)

Country Link
US (1) US6133377A (de)
EP (1) EP0893474B1 (de)
JP (1) JP3785749B2 (de)
KR (1) KR100541779B1 (de)
DE (1) DE69815601T2 (de)
TW (1) TW416972B (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986006732A1 (en) * 1985-05-16 1986-11-20 Mitsubishi Rayon Co., Ltd. Process for producing maleimide copolymer and thermoplastic resin composition comprising the copolymer
US7519558B2 (en) * 1997-08-27 2009-04-14 Ballard Claudio R Biometrically enabled private secure information repository
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
EP1009206A3 (de) * 1998-12-02 2003-01-15 Ajinomoto Co., Inc. Verfahren zur Vakuumlaminierung eines Klebefilms
JP2000294922A (ja) * 1999-04-01 2000-10-20 Victor Co Of Japan Ltd 多層プリント配線板用の絶縁樹脂組成物
JP4423779B2 (ja) 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
SE523150C2 (sv) * 2000-01-14 2004-03-30 Ericsson Telefon Ab L M Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt
JP2001226464A (ja) * 2000-02-15 2001-08-21 Japan Epoxy Resin Kk 熱硬化性樹脂組成物
EP1307077A4 (de) * 2000-06-15 2003-06-18 Ajinomoto Kk Haftfilm und verfahren zur herstellung einer mehrschichtigen leiterplatte damit
KR100536091B1 (ko) * 2000-07-27 2005-12-12 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
TWI228639B (en) * 2000-11-15 2005-03-01 Vantico Ag Positive type photosensitive epoxy resin composition and printed circuit board using the same
KR100419064B1 (ko) * 2000-12-27 2004-02-18 주식회사 엘지화학 에폭시 수지 조성물
JP2002270974A (ja) * 2001-03-14 2002-09-20 Hitachi Chem Co Ltd 熱硬化性樹脂組成物およびこれを用いたプリント配線板用絶縁樹脂シートの製造方法
KR20020087287A (ko) 2001-05-15 2002-11-22 삼성전기주식회사 시아네이트 에스테르-함유 절연조성물, 이로부터 제조된 절연필름 및 절연필름을 갖는 다층인쇄회로기판
JP3434808B2 (ja) * 2001-05-31 2003-08-11 三井金属鉱業株式会社 樹脂付銅箔及びその樹脂付銅箔を用いたプリント配線板
KR100380722B1 (ko) 2001-06-12 2003-04-18 삼성전기주식회사 접착강도가 개선된 절연필름 및 이를 포함하는 기판
JP4576794B2 (ja) * 2003-02-18 2010-11-10 日立化成工業株式会社 絶縁樹脂組成物及びその使用
KR100619325B1 (ko) * 2004-12-17 2006-09-08 삼성전기주식회사 금속장적층판의 제조장치 및 제조방법
WO2006126621A1 (ja) * 2005-05-23 2006-11-30 Ibiden Co., Ltd. プリント配線板
KR101377810B1 (ko) * 2006-09-21 2014-03-25 스미또모 베이크라이트 가부시키가이샤 수지 조성물, 프리프레그 및 적층판
US8216668B2 (en) 2006-10-06 2012-07-10 Sumitomo Bakelite Company, Ltd. Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device
US8840967B2 (en) 2006-10-11 2014-09-23 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing printed circuit board including flame retardant insulation layer
KR100781582B1 (ko) * 2006-10-11 2007-12-05 삼성전기주식회사 인쇄회로기판용 난연성 수지 조성물 및 이를 이용한인쇄회로기판
WO2008133246A1 (ja) * 2007-04-24 2008-11-06 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、樹脂フィルム、プリプレグ、及び多層プリント配線板
WO2009002125A2 (en) * 2007-06-28 2008-12-31 Lg Chem, Ltd. Method for manufacturing transparent plastic film and transparent plastic film manufactured by the method
KR100877342B1 (ko) * 2007-09-13 2009-01-07 삼성전기주식회사 인쇄회로기판용 난연성 수지 조성물, 이를 이용한 인쇄회로기판 및 그 제조방법
KR100882533B1 (ko) 2007-12-31 2009-02-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물　및 이를 이용한 반도체 소자
JP5776134B2 (ja) * 2009-07-15 2015-09-09 味の素株式会社 樹脂組成物
US8173745B2 (en) * 2009-12-16 2012-05-08 Momentive Specialty Chemicals Inc. Compositions useful for preparing composites and composites produced therewith
EP2716793B1 (de) 2011-05-31 2019-04-10 Hitachi Chemical Co., Ltd. Grundierungsschicht für ein plattierungsverfahren, beschichtung für eine leiterplatte und herstellungsverfahren dafür sowie mehrschichtige leiterplatte und herstellungsverfahren dafür
WO2013005847A1 (ja) 2011-07-07 2013-01-10 日立化成工業株式会社 接着フィルム、該接着フィルムを用いた多層プリント配線板、及び該多層プリント配線板の製造方法
JP6291742B2 (ja) * 2013-08-12 2018-03-14 日立化成株式会社 樹脂組成物、めっきプロセス用接着補助層、支持体付きめっきプロセス用接着補助層、配線板用積層板、配線板用積層板の製造方法、多層配線板、及び多層配線板の製造方法
CN105764907B (zh) * 2013-11-29 2018-05-18 四国化成工业株式会社 巯基烷基甘脲类及其用途
TWI650235B (zh) 2013-12-09 2019-02-11 日商日立化成股份有限公司 附有黏著層的聚醯亞胺脫模薄膜、配置了附有黏著層的聚醯亞胺脫模薄膜之積層板、積層板、配置了附有黏著層的聚醯亞胺脫模薄膜之單層或多層線路板、以及多層線路板的製造方法
JP6191659B2 (ja) * 2015-07-09 2017-09-06 味の素株式会社 樹脂組成物
JP2017088656A (ja) * 2015-11-04 2017-05-25 信越化学工業株式会社 難燃性樹脂組成物、難燃性樹脂フィルム及び半導体装置とその製造方法
TWI808062B (zh) 2016-08-12 2023-07-11 日商力森諾科股份有限公司 層間絕緣膜及其製造方法
US10508179B2 (en) * 2017-02-28 2019-12-17 Exxonmobil Chemical Patents Inc. Thermoplastic vulcanizate prepared with oil-extended, bimodal metallocene-synthesized EPDM

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57120A (en) * 1980-06-04 1982-01-05 Hitachi Ltd Curable resin composition
JPS5738824A (en) * 1980-08-19 1982-03-03 Shin Kobe Electric Mach Co Ltd Production of laminated sheet
JPS61133225A (ja) * 1984-12-03 1986-06-20 Matsushita Electric Works Ltd 半導体封止用エボキシ樹脂成形材料
JPH01165651A (ja) * 1987-12-21 1989-06-29 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂成形材
JPH0232118A (ja) * 1988-07-21 1990-02-01 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物
US4988780A (en) * 1988-08-15 1991-01-29 Allied-Signal Flame resistant article made of phenolic triazine and related method using a pure cyanato novolac
JPH04153252A (ja) * 1990-10-16 1992-05-26 Asahi Chem Ind Co Ltd マトリックス樹脂組成物
JPH04168121A (ja) * 1990-10-31 1992-06-16 Sumitomo Bakelite Co Ltd 電気絶縁用エポキシ樹脂液状組成物
DE69211329T2 (de) * 1992-03-27 1996-11-28 Ibm Verfahren zum Herstellen von pseudo-planaren Dünnschicht PFET-Anordnungen und hierdurch erzeugte Struktur
JP2849004B2 (ja) * 1992-09-04 1999-01-20 住友ベークライト株式会社 半導体封止用樹脂組成物
JP3175338B2 (ja) * 1992-09-04 2001-06-11 エヌオーケー株式会社 加硫接着剤配合物
JPH07268277A (ja) * 1994-04-04 1995-10-17 Toshiba Chem Corp コーティング用樹脂組成物
JPH0867745A (ja) * 1994-08-30 1996-03-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPH08311142A (ja) * 1995-03-15 1996-11-26 Dainippon Ink & Chem Inc フェノ−ル樹脂組成物及びエポキシ樹脂用硬化剤
JP3327038B2 (ja) * 1995-03-16 2002-09-24 大日本インキ化学工業株式会社 エポキシ樹脂組成物
DE69606396T2 (de) * 1995-04-04 2000-07-27 Hitachi Chemical Co., Ltd. Klebstoff, klebstofffilm und metallfolie, die auf ihrer rückseite mit klebstoff vorsehen ist
JPH08302161A (ja) * 1995-05-10 1996-11-19 Hitachi Chem Co Ltd 樹脂組成物及びその樹脂組成物をケミカルエッチングする方法
ID19337A (id) * 1996-12-26 1998-07-02 Ajinomoto Kk Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini

Also Published As

Publication number Publication date
KR100541779B1 (ko) 2006-04-10
KR19980081447A (ko) 1998-11-25
US6133377A (en) 2000-10-17
TW416972B (en) 2001-01-01
EP0893474A2 (de) 1999-01-27
JP3785749B2 (ja) 2006-06-14
EP0893474A3 (de) 2000-10-18
DE69815601T2 (de) 2004-04-29
JPH111547A (ja) 1999-01-06
EP0893474B1 (de) 2003-06-18

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