DE69824679D1 - Kontaktlose elektronische Karte und Verfahren zur Herstellung einer solchen Karte - Google Patents

Kontaktlose elektronische Karte und Verfahren zur Herstellung einer solchen Karte

Info

Publication number
DE69824679D1
DE69824679D1 DE69824679T DE69824679T DE69824679D1 DE 69824679 D1 DE69824679 D1 DE 69824679D1 DE 69824679 T DE69824679 T DE 69824679T DE 69824679 T DE69824679 T DE 69824679T DE 69824679 D1 DE69824679 D1 DE 69824679D1
Authority
DE
Germany
Prior art keywords
card
making
contactless electronic
electronic card
contactless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69824679T
Other languages
English (en)
Other versions
DE69824679T2 (de
Inventor
Francois Launay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69824679D1 publication Critical patent/DE69824679D1/de
Application granted granted Critical
Publication of DE69824679T2 publication Critical patent/DE69824679T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15157—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
DE69824679T 1997-10-07 1998-09-30 Kontaktlose elektronische Karte und Verfahren zur Herstellung einer solchen Karte Expired - Lifetime DE69824679T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9712475 1997-10-07
FR9712475A FR2769441A1 (fr) 1997-10-07 1997-10-07 Carte electronique sans contact et son procede de fabrication

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DE69824679D1 true DE69824679D1 (de) 2004-07-29
DE69824679T2 DE69824679T2 (de) 2005-07-07

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US (1) US6111303A (de)
EP (1) EP0908843B1 (de)
JP (1) JP4287925B2 (de)
DE (1) DE69824679T2 (de)
FR (1) FR2769441A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6630370B2 (en) * 1998-10-02 2003-10-07 Shinko Electric Industries Co., Ltd. Process for manufacturing IC card
FR2785072B1 (fr) * 1998-10-23 2001-01-19 St Microelectronics Sa Circuit electronique autocollant
FR2790849B1 (fr) * 1999-03-12 2001-04-27 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact
JP3517374B2 (ja) * 1999-05-21 2004-04-12 新光電気工業株式会社 非接触型ｉｃカードの製造方法
FR2796208B1 (fr) * 1999-07-08 2002-10-25 Gemplus Card Int Antenne pour carte a puce sans contact, cartes hybrides et etiquettes electroniques
FR2803413A1 (fr) * 1999-12-30 2001-07-06 Schlumberger Systems & Service Element de carte a circuit integre monte en flip-chip
US6492725B1 (en) * 2000-02-04 2002-12-10 Lumileds Lighting, U.S., Llc Concentrically leaded power semiconductor device package
ATE268923T1 (de) 2000-12-20 2004-06-15 Fraunhofer Ges Forschung Vorrichtung und verfahren zum gleichzeitigen auslesen von passiven induktiven transpondern
GB2372012A (en) * 2001-01-18 2002-08-14 Pioneer Oriental Engineering L Forming a high frequency contact-less smart card with an antenna coil
DE10151940A1 (de) * 2001-10-22 2003-02-13 Infineon Technologies Ag Chipkarte und Inlay für Chipkarte
DE50311245D1 (de) * 2002-07-17 2009-04-16 Oebs Gmbh Sicherheitsdokument
DE10232569A1 (de) * 2002-07-18 2004-02-05 Agfa-Gevaert Ag Identitätskarte
FR2844078A1 (fr) * 2002-08-30 2004-03-05 St Microelectronics Sa Procede de communication par antenne pour carte a puce et appareil associe
KR20090099235A (ko) * 2008-03-17 2009-09-22 삼성전자주식회사 안테나 구조체
FR2932910B1 (fr) * 2008-06-20 2011-02-11 Smart Packaging Solutions Sps Carte sans contact avec logo securitaire
WO2010000806A1 (en) * 2008-07-02 2010-01-07 Imec Rfid device
DE102009012255A1 (de) * 2009-03-07 2010-09-09 Michalk, Manfred, Dr. Schaltungsanordnung
DE102009043587A1 (de) * 2009-09-30 2011-05-19 Smartrac Ip B.V. Funktionelles Laminat
JP5544817B2 (ja) * 2009-10-13 2014-07-09 凸版印刷株式会社 非接触ｉｃカードの製造方法
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
EP2369616A1 (de) * 2010-03-22 2011-09-28 Gemalto SA Herstellungsverfahren eines elektronischen Moduls mit einem elektronischen Chip montiert auf einem Substrat mit einer Antenne
US10320054B2 (en) * 2016-10-28 2019-06-11 Avery Dennison Retail Information Services, Llc RFID tags designed to work on difficult substrates

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69512137T2 (de) * 1994-06-15 2000-05-25 Rue Cartes Et Systemes Paris D Herstellungsverfahren und Montage für IC-Karte.
JP2814477B2 (ja) * 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式ｉｃカード及びその製造方法
FR2736740A1 (fr) * 1995-07-11 1997-01-17 Trt Telecom Radio Electr Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue
DE19543426C1 (de) * 1995-11-21 1997-05-07 Siemens Ag Kontaktlose Chipkarte und Verfahren zur Herstellung derselben
DE19601202A1 (de) * 1996-01-15 1997-03-06 Siemens Ag Datenträgerkarte und Verfahren zu deren Herstellung
FR2744863B1 (fr) * 1996-02-13 1998-03-06 Schlumberger Ind Sa Procede de realisation d'un objet portatif a antenne bobinee

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JPH11195096A (ja) 1999-07-21
EP0908843B1 (de) 2004-06-23
US6111303A (en) 2000-08-29
JP4287925B2 (ja) 2009-07-01
EP0908843A1 (de) 1999-04-14
DE69824679T2 (de) 2005-07-07
FR2769441A1 (fr) 1999-04-09

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