DE69509678D1 - Epitaktische züchtung von silizium carbidund so hergestellte silizium carbid-strukturen - Google Patents
Epitaktische züchtung von silizium carbidund so hergestellte silizium carbid-strukturenInfo
- Publication number
- DE69509678D1 DE69509678D1 DE69509678T DE69509678T DE69509678D1 DE 69509678 D1 DE69509678 D1 DE 69509678D1 DE 69509678 T DE69509678 T DE 69509678T DE 69509678 T DE69509678 T DE 69509678T DE 69509678 D1 DE69509678 D1 DE 69509678D1
- Authority
- DE
- Germany
- Prior art keywords
- silicon carbide
- epitaxial layer
- micropipe defects
- melt
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title abstract 7
- 229910010271 silicon carbide Inorganic materials 0.000 title abstract 6
- 230000007547 defect Effects 0.000 abstract 4
- 239000000155 melt Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 238000004943 liquid phase epitaxy Methods 0.000 abstract 1
- 230000000644 propagated effect Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/02—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
- C30B19/04—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux the solvent being a component of the crystal composition
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/931—Silicon carbide semiconductor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Farming Of Fish And Shellfish (AREA)
- Artificial Fish Reefs (AREA)
- Recrystallisation Techniques (AREA)
- Carbon And Carbon Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US346618 | 1994-11-30 | ||
US08/346,618 US5679153A (en) | 1994-11-30 | 1994-11-30 | Method for reducing micropipe formation in the epitaxial growth of silicon carbide and resulting silicon carbide structures |
PCT/US1995/015276 WO1996017112A1 (en) | 1994-11-30 | 1995-11-22 | Epitaxial growth of silicon carbide and resulting silicon carbide structures |
Publications (3)
Publication Number | Publication Date |
---|---|
DE69509678D1 true DE69509678D1 (de) | 1999-06-17 |
DE69509678T2 DE69509678T2 (de) | 1999-12-02 |
DE69509678T3 DE69509678T3 (de) | 2008-02-28 |
Family
ID=23360251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69509678T Expired - Lifetime DE69509678T3 (de) | 1994-11-30 | 1995-11-22 | Epitaktische züchtung von siliciumcarbid und so hergestellte siliciumcarbidstrukturen |
Country Status (11)
Country | Link |
---|---|
US (1) | US5679153A (de) |
EP (1) | EP0795049B2 (de) |
JP (2) | JP4065021B2 (de) |
KR (1) | KR100420182B1 (de) |
CN (1) | CN1069935C (de) |
AT (1) | ATE180023T1 (de) |
AU (1) | AU4369196A (de) |
CA (1) | CA2205918C (de) |
DE (1) | DE69509678T3 (de) |
RU (1) | RU2142027C1 (de) |
WO (1) | WO1996017112A1 (de) |
Families Citing this family (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4086936B2 (ja) * | 1996-10-03 | 2008-05-14 | 株式会社ブリヂストン | ダミーウェハ |
CN1142598C (zh) | 1997-07-25 | 2004-03-17 | 日亚化学工业株式会社 | 氮化物半导体发光器件 |
US20020047135A1 (en) * | 1997-11-18 | 2002-04-25 | Nikolaev Audrey E. | P-N junction-based structures utilizing HVPE grown III-V compound layers |
US6559038B2 (en) | 1997-11-18 | 2003-05-06 | Technologies And Devices International, Inc. | Method for growing p-n heterojunction-based structures utilizing HVPE techniques |
US6479839B2 (en) | 1997-11-18 | 2002-11-12 | Technologies & Devices International, Inc. | III-V compounds semiconductor device with an AlxByInzGa1-x-y-zN non continuous quantum dot layer |
US6472300B2 (en) | 1997-11-18 | 2002-10-29 | Technologies And Devices International, Inc. | Method for growing p-n homojunction-based structures utilizing HVPE techniques |
US6559467B2 (en) | 1997-11-18 | 2003-05-06 | Technologies And Devices International, Inc. | P-n heterojunction-based structures utilizing HVPE grown III-V compound layers |
US6555452B2 (en) | 1997-11-18 | 2003-04-29 | Technologies And Devices International, Inc. | Method for growing p-type III-V compound material utilizing HVPE techniques |
US6599133B2 (en) | 1997-11-18 | 2003-07-29 | Technologies And Devices International, Inc. | Method for growing III-V compound semiconductor structures with an integral non-continuous quantum dot layer utilizing HVPE techniques |
US6476420B2 (en) | 1997-11-18 | 2002-11-05 | Technologies And Devices International, Inc. | P-N homojunction-based structures utilizing HVPE growth III-V compound layers |
US6890809B2 (en) * | 1997-11-18 | 2005-05-10 | Technologies And Deviles International, Inc. | Method for fabricating a P-N heterojunction device utilizing HVPE grown III-V compound layers and resultant device |
US6849862B2 (en) * | 1997-11-18 | 2005-02-01 | Technologies And Devices International, Inc. | III-V compound semiconductor device with an AlxByInzGa1-x-y-zN1-a-bPaAsb non-continuous quantum dot layer |
EP0967304B1 (de) * | 1998-05-29 | 2004-04-07 | Denso Corporation | Verfahren zur Herstellung eines Siliziumkarbid-Einkristalls |
JP3770014B2 (ja) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | 窒化物半導体素子 |
US6711191B1 (en) | 1999-03-04 | 2004-03-23 | Nichia Corporation | Nitride semiconductor laser device |
WO2001004390A1 (de) | 1999-07-07 | 2001-01-18 | Siemens Aktiengesellschaft | Keimkristallhalter mit seitlicher einfassung eines sic-keimkristalls |
US6428621B1 (en) | 2000-02-15 | 2002-08-06 | The Fox Group, Inc. | Method for growing low defect density silicon carbide |
US20020163059A1 (en) * | 2000-02-17 | 2002-11-07 | Hamerski Roman J. | Device with epitaxial base |
US6448581B1 (en) * | 2000-08-08 | 2002-09-10 | Agere Systems Guardian Corp. | Mitigation of deleterious effects of micropipes in silicon carbide devices |
JP4716558B2 (ja) * | 2000-12-12 | 2011-07-06 | 株式会社デンソー | 炭化珪素基板 |
JP4275308B2 (ja) * | 2000-12-28 | 2009-06-10 | 株式会社デンソー | 炭化珪素単結晶の製造方法およびその製造装置 |
US6863728B2 (en) * | 2001-02-14 | 2005-03-08 | The Fox Group, Inc. | Apparatus for growing low defect density silicon carbide |
US20020187427A1 (en) * | 2001-05-18 | 2002-12-12 | Ulrich Fiebag | Additive composition for both rinse water recycling in water recycling systems and simultaneous surface treatment of lithographic printing plates |
US7527869B2 (en) * | 2001-06-04 | 2009-05-05 | Kwansei Gakuin Educational Foundation | Single crystal silicon carbide and method for producing the same |
US6488767B1 (en) * | 2001-06-08 | 2002-12-03 | Advanced Technology Materials, Inc. | High surface quality GaN wafer and method of fabricating same |
US7061161B2 (en) * | 2002-02-15 | 2006-06-13 | Siemens Technology-To-Business Center Llc | Small piezoelectric air pumps with unobstructed airflow |
KR100984261B1 (ko) | 2002-03-19 | 2010-09-30 | 자이단호징 덴료쿠추오켄큐쇼 | SiC 결정의 제조 방법 및 SiC 결정 |
US7379203B2 (en) * | 2002-03-22 | 2008-05-27 | Laser Substrates, Inc. | Data capture during print process |
JP2003327497A (ja) * | 2002-05-13 | 2003-11-19 | Sumitomo Electric Ind Ltd | GaN単結晶基板、窒化物系半導体エピタキシャル基板、窒化物系半導体素子及びその製造方法 |
US7601441B2 (en) * | 2002-06-24 | 2009-10-13 | Cree, Inc. | One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer |
US7316747B2 (en) * | 2002-06-24 | 2008-01-08 | Cree, Inc. | Seeded single crystal silicon carbide growth and resulting crystals |
US6814801B2 (en) * | 2002-06-24 | 2004-11-09 | Cree, Inc. | Method for producing semi-insulating resistivity in high purity silicon carbide crystals |
US7175704B2 (en) * | 2002-06-27 | 2007-02-13 | Diamond Innovations, Inc. | Method for reducing defect concentrations in crystals |
JP5122817B2 (ja) * | 2003-05-09 | 2013-01-16 | クリー インコーポレイテッド | イオン・インプラント・アイソレーションによるled製作 |
US7018554B2 (en) * | 2003-09-22 | 2006-03-28 | Cree, Inc. | Method to reduce stacking fault nucleation sites and reduce forward voltage drift in bipolar devices |
US20050194584A1 (en) * | 2003-11-12 | 2005-09-08 | Slater David B.Jr. | LED fabrication via ion implant isolation |
US7109521B2 (en) * | 2004-03-18 | 2006-09-19 | Cree, Inc. | Silicon carbide semiconductor structures including multiple epitaxial layers having sidewalls |
US7173285B2 (en) | 2004-03-18 | 2007-02-06 | Cree, Inc. | Lithographic methods to reduce stacking fault nucleation sites |
US7592634B2 (en) * | 2004-05-06 | 2009-09-22 | Cree, Inc. | LED fabrication via ion implant isolation |
US7314521B2 (en) | 2004-10-04 | 2008-01-01 | Cree, Inc. | Low micropipe 100 mm silicon carbide wafer |
US9708735B2 (en) | 2005-06-23 | 2017-07-18 | Sumitomo Electric Industries, Ltd. | Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same |
US8771552B2 (en) | 2005-06-23 | 2014-07-08 | Sumitomo Electric Industries, Ltd. | Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same |
JP4277826B2 (ja) * | 2005-06-23 | 2009-06-10 | 住友電気工業株式会社 | 窒化物結晶、窒化物結晶基板、エピ層付窒化物結晶基板、ならびに半導体デバイスおよびその製造方法 |
JP5141072B2 (ja) | 2006-04-25 | 2013-02-13 | 日本精工株式会社 | 軸受ユニット用外輪の製造方法 |
US9099377B2 (en) * | 2006-09-14 | 2015-08-04 | Cree, Inc. | Micropipe-free silicon carbide and related method of manufacture |
JP4811354B2 (ja) * | 2007-06-11 | 2011-11-09 | トヨタ自動車株式会社 | SiC単結晶の製造方法 |
US8585821B2 (en) * | 2007-07-26 | 2013-11-19 | Ecotron Co., Ltd. | SiC epitaxial substrate and method for producing the same |
JP5000424B2 (ja) * | 2007-08-10 | 2012-08-15 | 一般財団法人電力中央研究所 | 炭化珪素単結晶ウェハの欠陥検出方法、及び炭化珪素半導体素子の製造方法 |
US8163086B2 (en) * | 2007-08-29 | 2012-04-24 | Cree, Inc. | Halogen assisted physical vapor transport method for silicon carbide growth |
JP2009256193A (ja) * | 2008-03-21 | 2009-11-05 | Bridgestone Corp | 炭化ケイ素単結晶の製造方法 |
TWI362769B (en) | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
US8536582B2 (en) | 2008-12-01 | 2013-09-17 | Cree, Inc. | Stable power devices on low-angle off-cut silicon carbide crystals |
CN102245813B (zh) * | 2008-12-08 | 2014-08-06 | Ii-Vi有限公司 | 改进的轴向梯度传输(agt)生长工艺和利用电阻加热的装置 |
JP5415853B2 (ja) * | 2009-07-10 | 2014-02-12 | 東京エレクトロン株式会社 | 表面処理方法 |
US9464366B2 (en) * | 2009-08-20 | 2016-10-11 | The United States Of America, As Represented By The Secretary Of The Navy | Reduction of basal plane dislocations in epitaxial SiC |
JP5875143B2 (ja) | 2011-08-26 | 2016-03-02 | 学校法人関西学院 | 半導体ウエハの製造方法 |
DE112013002107B4 (de) * | 2012-04-20 | 2019-04-04 | Toyota Jidosha Kabushiki Kaisha | SiC-Einkristall-Herstellungsverfahren |
US8860040B2 (en) | 2012-09-11 | 2014-10-14 | Dow Corning Corporation | High voltage power semiconductor devices on SiC |
US9018639B2 (en) * | 2012-10-26 | 2015-04-28 | Dow Corning Corporation | Flat SiC semiconductor substrate |
US9797064B2 (en) | 2013-02-05 | 2017-10-24 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion |
US9738991B2 (en) | 2013-02-05 | 2017-08-22 | Dow Corning Corporation | Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion |
US9017804B2 (en) | 2013-02-05 | 2015-04-28 | Dow Corning Corporation | Method to reduce dislocations in SiC crystal growth |
US8940614B2 (en) | 2013-03-15 | 2015-01-27 | Dow Corning Corporation | SiC substrate with SiC epitaxial film |
WO2015005064A1 (ja) * | 2013-07-09 | 2015-01-15 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法および炭化珪素半導体装置 |
CN105453242B (zh) * | 2013-08-14 | 2017-09-22 | 株式会社日立制作所 | 半导体检查方法、半导体检查装置以及半导体元件的制造方法 |
JP5741652B2 (ja) * | 2013-08-30 | 2015-07-01 | トヨタ自動車株式会社 | n型SiC単結晶及びその製造方法 |
JP5854013B2 (ja) | 2013-09-13 | 2016-02-09 | トヨタ自動車株式会社 | SiC単結晶の製造方法 |
JP2015061001A (ja) * | 2013-09-20 | 2015-03-30 | 株式会社東芝 | 半導体装置の製造方法 |
CN103590101B (zh) * | 2013-11-06 | 2016-02-24 | 山东大学 | 一种降低大尺寸高质量SiC单晶中微管密度的生长方法 |
JP2015151278A (ja) * | 2014-02-10 | 2015-08-24 | 新日鐵住金株式会社 | 単結晶の製造方法、シードシャフト、および単結晶の製造装置 |
JP6028754B2 (ja) * | 2014-03-11 | 2016-11-16 | トヨタ自動車株式会社 | SiC単結晶基板の製造方法 |
US9279192B2 (en) | 2014-07-29 | 2016-03-08 | Dow Corning Corporation | Method for manufacturing SiC wafer fit for integration with power device manufacturing technology |
CN105140111A (zh) * | 2015-08-11 | 2015-12-09 | 中国科学院半导体研究所 | 消除碳化硅外延面穿通缺陷的方法 |
CN108138360B (zh) * | 2015-10-07 | 2020-12-08 | 住友电气工业株式会社 | 碳化硅外延基板及用于制造碳化硅半导体装置的方法 |
WO2017188381A1 (ja) | 2016-04-28 | 2017-11-02 | 学校法人関西学院 | 気相エピタキシャル成長方法及びエピタキシャル層付き基板の製造方法 |
CN106012021B (zh) * | 2016-06-30 | 2019-04-12 | 山东天岳先进材料科技有限公司 | 一种液相生长碳化硅的籽晶轴及方法 |
CN106048716A (zh) * | 2016-06-30 | 2016-10-26 | 山东天岳先进材料科技有限公司 | 一种碳化硅衬底的优化方法 |
WO2018043171A1 (ja) * | 2016-08-31 | 2018-03-08 | 昭和電工株式会社 | SiCエピタキシャルウェハ及びその製造方法、並びに、欠陥識別方法 |
CN111235633A (zh) * | 2020-01-16 | 2020-06-05 | 中国科学院半导体研究所 | 一种在硅熔体表面通过cvd制备自支撑碳化硅晶圆的方法 |
CN112048769B (zh) * | 2020-07-24 | 2021-08-31 | 山东天岳先进科技股份有限公司 | 一种碳化硅晶体微管愈合用装置及应用 |
CN111962157B (zh) * | 2020-07-24 | 2021-09-28 | 山东天岳先进科技股份有限公司 | 一种碳化硅晶体微管的愈合方法及碳化硅产品和应用 |
CN115910755A (zh) * | 2023-01-09 | 2023-04-04 | 宁波合盛新材料有限公司 | 一种碳化硅外延片及其制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4123571A (en) * | 1977-09-08 | 1978-10-31 | International Business Machines Corporation | Method for forming smooth self limiting and pin hole free SiC films on Si |
US4419336A (en) * | 1982-03-29 | 1983-12-06 | Norton Company | Silicon carbide production and furnace |
JPS63156095A (ja) * | 1986-12-19 | 1988-06-29 | Sanyo Electric Co Ltd | SiC単結晶の液相エピタキシヤル成長方法 |
US4866005A (en) * | 1987-10-26 | 1989-09-12 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
US5319220A (en) * | 1988-01-20 | 1994-06-07 | Sharp Kabushiki Kaisha | Silicon carbide semiconductor device |
US5027168A (en) * | 1988-12-14 | 1991-06-25 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
SU1726571A1 (ru) * | 1990-06-12 | 1992-04-15 | Физико-технический институт им.А.Ф.Иоффе АН СССР | Способ выращивани карбидкремниевых р-п-структур политипа 6Н |
JP2579561B2 (ja) * | 1991-03-22 | 1997-02-05 | 東海カーボン株式会社 | SiCウイスカーの製造装置 |
JP3214868B2 (ja) * | 1991-07-19 | 2001-10-02 | ローム株式会社 | ヘテロ接合バイポーラトランジスタの製造方法 |
DE4135076A1 (de) * | 1991-10-24 | 1993-04-29 | Daimler Benz Ag | Mehrschichtige, monokristallines siliziumkarbid enthaltende zusammensetzung |
-
1994
- 1994-11-30 US US08/346,618 patent/US5679153A/en not_active Expired - Lifetime
-
1995
- 1995-11-22 KR KR1019970703628A patent/KR100420182B1/ko not_active IP Right Cessation
- 1995-11-22 WO PCT/US1995/015276 patent/WO1996017112A1/en active IP Right Grant
- 1995-11-22 CN CN95196526A patent/CN1069935C/zh not_active Expired - Lifetime
- 1995-11-22 AU AU43691/96A patent/AU4369196A/en not_active Abandoned
- 1995-11-22 JP JP51893396A patent/JP4065021B2/ja not_active Expired - Lifetime
- 1995-11-22 DE DE69509678T patent/DE69509678T3/de not_active Expired - Lifetime
- 1995-11-22 EP EP95942476A patent/EP0795049B2/de not_active Expired - Lifetime
- 1995-11-22 AT AT95942476T patent/ATE180023T1/de not_active IP Right Cessation
- 1995-11-22 RU RU97110653A patent/RU2142027C1/ru active
- 1995-11-22 CA CA002205918A patent/CA2205918C/en not_active Expired - Fee Related
-
2006
- 2006-10-04 JP JP2006272779A patent/JP4414992B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2007091589A (ja) | 2007-04-12 |
CN1167511A (zh) | 1997-12-10 |
CN1069935C (zh) | 2001-08-22 |
ATE180023T1 (de) | 1999-05-15 |
JP4414992B2 (ja) | 2010-02-17 |
EP0795049A1 (de) | 1997-09-17 |
WO1996017112A1 (en) | 1996-06-06 |
JPH10509943A (ja) | 1998-09-29 |
EP0795049B1 (de) | 1999-05-12 |
RU2142027C1 (ru) | 1999-11-27 |
DE69509678T3 (de) | 2008-02-28 |
CA2205918A1 (en) | 1996-06-06 |
KR100420182B1 (ko) | 2004-05-27 |
CA2205918C (en) | 2002-01-29 |
JP4065021B2 (ja) | 2008-03-19 |
AU4369196A (en) | 1996-06-19 |
DE69509678T2 (de) | 1999-12-02 |
EP0795049B2 (de) | 2007-09-12 |
US5679153A (en) | 1997-10-21 |
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