JP5415853B2 - 表面処理方法 - Google Patents
表面処理方法 Download PDFInfo
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- JP5415853B2 JP5415853B2 JP2009163418A JP2009163418A JP5415853B2 JP 5415853 B2 JP5415853 B2 JP 5415853B2 JP 2009163418 A JP2009163418 A JP 2009163418A JP 2009163418 A JP2009163418 A JP 2009163418A JP 5415853 B2 JP5415853 B2 JP 5415853B2
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- silicon carbide
- treatment method
- surface treatment
- plasma
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- 238000000034 method Methods 0.000 title claims description 73
- 238000004381 surface treatment Methods 0.000 title claims description 56
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 65
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 62
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 19
- 238000005229 chemical vapour deposition Methods 0.000 claims description 18
- 239000013590 bulk material Substances 0.000 claims description 17
- 238000010894 electron beam technology Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000000137 annealing Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 238000001953 recrystallisation Methods 0.000 claims description 5
- 238000010306 acid treatment Methods 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 description 37
- 239000000463 material Substances 0.000 description 15
- 239000000470 constituent Substances 0.000 description 12
- 239000000843 powder Substances 0.000 description 7
- 239000001307 helium Substances 0.000 description 5
- 229910052734 helium Inorganic materials 0.000 description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- -1 for example Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/80—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/31—Processing objects on a macro-scale
Description
25 フォーカスリング
31 上部電極
40 電子ビーム発生装置
50 プラズマトーチ
60 アニール処理装置
Claims (9)
- CVD法で生成された炭化珪素のバルク材から切り出され、その表面に破砕層を有する前記炭化珪素からなる部材の表面処理方法において、加熱により前記破砕層からなる部材表面を再結晶化させて緻密層に改質し、前記部材をプラズマ処理装置に適用した際の前記部材表面から放出される粒子数を減少させることを特徴とする表面処理方法。
- 前記破砕層を1100℃〜1300℃に加熱して前記部材表面の炭化珪素を再結晶させることを特徴とする請求項1記載の表面処理方法。
- 電子ビームを照射して前記破砕層を加熱し、該破砕層の炭化珪素を再結晶させることを特徴とする請求項2記載の表面処理方法。
- プラズマトーチを用いて前記破砕層を加熱し、該破砕層の炭化珪素を再結晶させることを特徴とする請求項2記載の表面処理方法。
- 前記部材を加熱炉に収容し、炭化珪素の再結晶温度でアニール処理することにより前記破砕層の炭化珪素を再結晶させることを特徴とする請求項2記載の表面処理方法。
- CVD法で生成された炭化珪素のバルク材から切り出され、その表面に破砕層を有する前記炭化珪素からなる部材の表面処理方法において、前記破砕層を加熱することにより前記部材表面をSiOxCy化した後、該SiOxCy化した部材表面をフッ酸処理して溶出させることによって前記部材表面を緻密層として、前記部材をプラズマ処理装置に適用した際の前記部材表面から放出される粒子数を減少させることを特徴とする表面処理方法。
- 前記破砕層を酸素雰囲気中で加熱して、前記部材表面の炭化珪素をSiO x C y 化することを特徴とする請求項6記載の表面処理方法。
- 前記部材表面の炭化珪素をSiOxCy化する処理と、前記SiOxCy化した部材表面に対するフッ酸処理とをそれぞれ複数回繰り返すことを特徴とする請求項6又は7記載の表面処理方法。
- 前記部材は、内部でプラズマを発生させ、被処理基板にプラズマ処理を施す減圧可能な処理室を備えた前記プラズマ処理装置の前記処理室内で使用される構成部材であることを特徴とする請求項1乃至8のいずれか1項に記載の表面処理方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009163418A JP5415853B2 (ja) | 2009-07-10 | 2009-07-10 | 表面処理方法 |
KR1020100066540A KR101708935B1 (ko) | 2009-07-10 | 2010-07-09 | 표면 처리 방법 |
US12/833,406 US8318034B2 (en) | 2009-07-10 | 2010-07-09 | Surface processing method |
CN201010226907.1A CN101950721B (zh) | 2009-07-10 | 2010-07-09 | 表面处理方法 |
CN201210391650.4A CN102931056B (zh) | 2009-07-10 | 2010-07-09 | 表面处理方法、由碳化硅形成的部件和等离子体处理装置 |
TW099122667A TWI622326B (zh) | 2009-07-10 | 2010-07-09 | Surface treatment method |
US13/655,785 US8715782B2 (en) | 2009-07-10 | 2012-10-19 | Surface processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009163418A JP5415853B2 (ja) | 2009-07-10 | 2009-07-10 | 表面処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011018821A JP2011018821A (ja) | 2011-01-27 |
JP5415853B2 true JP5415853B2 (ja) | 2014-02-12 |
Family
ID=43426706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009163418A Active JP5415853B2 (ja) | 2009-07-10 | 2009-07-10 | 表面処理方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8318034B2 (ja) |
JP (1) | JP5415853B2 (ja) |
KR (1) | KR101708935B1 (ja) |
CN (2) | CN102931056B (ja) |
TW (1) | TWI622326B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5415853B2 (ja) * | 2009-07-10 | 2014-02-12 | 東京エレクトロン株式会社 | 表面処理方法 |
KR101598465B1 (ko) | 2014-09-30 | 2016-03-02 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
JP6435247B2 (ja) * | 2015-09-03 | 2018-12-05 | 新光電気工業株式会社 | 静電チャック装置及び静電チャック装置の製造方法 |
US10109464B2 (en) * | 2016-01-11 | 2018-10-23 | Applied Materials, Inc. | Minimization of ring erosion during plasma processes |
CN107393845A (zh) * | 2016-05-17 | 2017-11-24 | 北大方正集团有限公司 | 一种碳化硅晶体晶圆表面析出碳的去除系统及方法 |
US9947558B2 (en) * | 2016-08-12 | 2018-04-17 | Lam Research Corporation | Method for conditioning silicon part |
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