JP5615576B2 - 基板処理装置用の多孔板の製造方法及び多孔板 - Google Patents
基板処理装置用の多孔板の製造方法及び多孔板 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 45
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- 229910052799 carbon Inorganic materials 0.000 claims description 21
- 238000005229 chemical vapour deposition Methods 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
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- 229910010271 silicon carbide Inorganic materials 0.000 description 64
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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Description
30 シャワーヘッド
31 上部電極板
34 貫通孔
41 孔あき基台
42 第1の貫通孔
43 多孔SiC膜
44 第2の貫通孔
50 CVD装置
Claims (9)
- 表裏両面における表層ほど口径が大きいテーパ形状を有する多数の第1の貫通孔が予め形成されたカーボン基台の表面に、化学蒸着(CVD)法によって所定厚さのSiC膜を形成させた後、前記第1の貫通孔に対応する第2の貫通孔が多数設けられた表層の多孔SiC膜を切り出すことを特徴とする基板処理装置用の多孔板の製造方法。
- 前記カーボン基台の表裏両面に前記多孔SiC膜を形成し、前記カーボン基台の表裏両面に形成された多孔SiC膜をそれぞれ切り出すことを特徴とする請求項1記載の基板処理装置用の多孔板の製造方法。
- 前記切り出された多孔SiC膜に付着しているカーボンを燃焼、除去することを特徴とする請求項1又は2記載の基板処理装置用の多孔板の製造方法。
- 前記第2の貫通孔におけるアスペクト比は、10以下であることを特徴とする請求項1乃至3のいずれか1項に記載の基板処理装置用の多孔板の製造方法。
- 前記多孔SiC膜の膜厚は、5mm以下であり、前記第2の貫通孔の口径は、それぞれ0.5〜1.0mmφであることを特徴とする請求項4記載の基板処理装置用の多孔板の製造方法。
- 前記切り出された多孔SiC膜における前記第2の貫通孔の内壁面に対し、仕上げ加工を施すことを特徴とする請求項1乃至5のいずれか1項に記載の基板処理装置用の多孔板の製造方法。
- 所定厚さのSiC膜からなり、厚さ方向に貫通する多数の貫通孔が形成された多孔板であって、
表裏両面における表層ほど口径が大きいテーパ形状を有する多数の貫通孔部が形成されたカーボン基台の表面に化学蒸着法によって所定厚さのSiC膜を形成させた後、前記テーパ形状を有する多数の貫通孔部に対応する前記多数の貫通孔が形成された表層の多孔SiC膜を切り出すことにより製造され、前記多数の貫通孔の内壁面は、前記化学蒸着法によって蒸着したSiCによって形成されていることを特徴とする基板処理装置用の多孔板。 - 前記貫通孔におけるアスペクト比は、10以下であることを特徴とする請求項7記載の基板処理装置用の多孔板。
- 前記多孔板の板厚は、0.5mm以下であり、前記貫通孔の口径は、それぞれ0.5〜1.0mmであることを特徴とする請求項8記載の基板処理装置用の多孔板。
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JP2010068352A JP5615576B2 (ja) | 2010-03-24 | 2010-03-24 | 基板処理装置用の多孔板の製造方法及び多孔板 |
KR1020110025701A KR101763946B1 (ko) | 2010-03-24 | 2011-03-23 | 기판 처리 장치용 다공판 제조 방법 및 기판 처리 장치용 다공판 |
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JPH03162593A (ja) * | 1989-11-21 | 1991-07-12 | Hitachi Chem Co Ltd | プラズマエツチング用電極板及びその製造法 |
JP3478703B2 (ja) * | 1997-05-15 | 2003-12-15 | 信越化学工業株式会社 | 炭化けい素電極板の製造方法 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |