DE69326123T2 - Dünnfilmtransistor und verfahren zur herstellung eines dünnfilmtransistors - Google Patents
Dünnfilmtransistor und verfahren zur herstellung eines dünnfilmtransistorsInfo
- Publication number
- DE69326123T2 DE69326123T2 DE69326123T DE69326123T DE69326123T2 DE 69326123 T2 DE69326123 T2 DE 69326123T2 DE 69326123 T DE69326123 T DE 69326123T DE 69326123 T DE69326123 T DE 69326123T DE 69326123 T2 DE69326123 T2 DE 69326123T2
- Authority
- DE
- Germany
- Prior art keywords
- thin film
- region
- film transistor
- source
- drain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0314—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
- H10D30/6719—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions having significant overlap between the lightly-doped drains and the gate electrodes, e.g. gate-overlapped LDD [GOLDD] TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/471—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having different architectures, e.g. having both top-gate and bottom-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Thin Film Transistor (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16602192 | 1992-06-24 | ||
| JP31533192 | 1992-11-25 | ||
| JP32531592 | 1992-12-04 | ||
| PCT/JP1993/000849 WO1994000882A1 (fr) | 1992-06-24 | 1993-06-23 | Transistor a couches minces, dispositif a semi-conducteurs, dispositif d'affichage et procede de fabrication d'un transistor a couches minces |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69326123D1 DE69326123D1 (de) | 1999-09-30 |
| DE69326123T2 true DE69326123T2 (de) | 1999-12-23 |
Family
ID=27322616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69326123T Expired - Lifetime DE69326123T2 (de) | 1992-06-24 | 1993-06-23 | Dünnfilmtransistor und verfahren zur herstellung eines dünnfilmtransistors |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US5508216A (enExample) |
| EP (1) | EP0602250B1 (enExample) |
| KR (1) | KR100309934B1 (enExample) |
| DE (1) | DE69326123T2 (enExample) |
| TW (1) | TW268133B (enExample) |
| WO (1) | WO1994000882A1 (enExample) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5953582A (en) * | 1993-02-10 | 1999-09-14 | Seiko Epson Corporation | Active matrix panel manufacturing method including TFTS having variable impurity concentration levels |
| DE19500380C2 (de) * | 1994-05-20 | 2001-05-17 | Mitsubishi Electric Corp | Aktivmatrix-Flüssigkristallanzeige und Herstellungsverfahren dafür |
| JP3403812B2 (ja) * | 1994-05-31 | 2003-05-06 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタを用いた半導体装置の作製方法 |
| US6133620A (en) | 1995-05-26 | 2000-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and process for fabricating the same |
| US5915174A (en) * | 1994-09-30 | 1999-06-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for producing the same |
| JP3494720B2 (ja) * | 1994-11-01 | 2004-02-09 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法、ならびにアクティブマトリクス型の液晶ディスプレー及びイメージセンサー |
| KR0146899B1 (ko) * | 1994-11-28 | 1998-09-15 | 김광호 | 액정 디스플레이 박막트랜지스터소자 및 제조 방법 |
| KR0145900B1 (ko) * | 1995-02-11 | 1998-09-15 | 김광호 | 박막 트랜지스터 액정디스플레이 소자 및 그 제조방법 |
| JP3292657B2 (ja) * | 1995-04-10 | 2002-06-17 | キヤノン株式会社 | 薄膜トランジスタ及びそれを用いた液晶表示装置の製造法 |
| US6933182B1 (en) * | 1995-04-20 | 2005-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device and manufacturing system thereof |
| KR100218500B1 (ko) | 1995-05-17 | 1999-09-01 | 윤종용 | 실리콘막 및 그 제조 방법과 이를 포함하는 박막트랜지스터 및 그 제조방법 |
| JPH0955499A (ja) * | 1995-08-11 | 1997-02-25 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| KR100192593B1 (ko) * | 1996-02-21 | 1999-07-01 | 윤종용 | 폴리 실리콘 박막 트랜지스터의 제조방법 |
| JP3527009B2 (ja) * | 1996-03-21 | 2004-05-17 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| JP3525316B2 (ja) * | 1996-11-12 | 2004-05-10 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置 |
| US6140160A (en) | 1997-07-28 | 2000-10-31 | Micron Technology, Inc. | Method for fabricating a simplified CMOS polysilicon thin film transistor and resulting structure |
| KR100269600B1 (ko) * | 1997-09-24 | 2000-10-16 | 김영환 | 박막트랜지스터의 제조방법 |
| JPH11112002A (ja) * | 1997-10-07 | 1999-04-23 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその製造方法 |
| KR19990039940A (ko) * | 1997-11-15 | 1999-06-05 | 구자홍 | 박막트랜지스터 제조방법 |
| US6338987B1 (en) | 1998-08-27 | 2002-01-15 | Lg.Philips Lcd Co., Ltd. | Method for forming polycrystalline silicon layer and method for fabricating thin film transistor |
| JP4536186B2 (ja) * | 1998-11-16 | 2010-09-01 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6501098B2 (en) | 1998-11-25 | 2002-12-31 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device |
| KR20000033832A (ko) * | 1998-11-26 | 2000-06-15 | 윤종용 | 액정 표시 장치용 다결정 규소 박막 트랜지스터 기판의 제조 방법 |
| JP4641582B2 (ja) * | 1998-12-18 | 2011-03-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6469317B1 (en) | 1998-12-18 | 2002-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
| JP4372943B2 (ja) | 1999-02-23 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| US6674136B1 (en) * | 1999-03-04 | 2004-01-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having driver circuit and pixel section provided over same substrate |
| US6531713B1 (en) | 1999-03-19 | 2003-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and manufacturing method thereof |
| TW444257B (en) | 1999-04-12 | 2001-07-01 | Semiconductor Energy Lab | Semiconductor device and method for fabricating the same |
| KR100333276B1 (ko) * | 1999-05-20 | 2002-04-24 | 구본준, 론 위라하디락사 | 액정표시장치의 tft 및 그 제조방법 |
| US7245018B1 (en) * | 1999-06-22 | 2007-07-17 | Semiconductor Energy Laboratory Co., Ltd. | Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof |
| TW515109B (en) * | 1999-06-28 | 2002-12-21 | Semiconductor Energy Lab | EL display device and electronic device |
| JP2001015553A (ja) * | 1999-06-29 | 2001-01-19 | Rohm Co Ltd | 半導体装置の製造方法 |
| US6384427B1 (en) * | 1999-10-29 | 2002-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
| JP4727029B2 (ja) * | 1999-11-29 | 2011-07-20 | 株式会社半導体エネルギー研究所 | El表示装置、電気器具及びel表示装置用の半導体素子基板 |
| US7023021B2 (en) | 2000-02-22 | 2006-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| US6274465B1 (en) * | 2000-03-30 | 2001-08-14 | International Business Machines Corporataion | DC electric field assisted anneal |
| EP1139394A3 (en) | 2000-03-30 | 2006-02-15 | International Business Machines Corporation | Method and device for electric field assisted anneal |
| TWI286338B (en) | 2000-05-12 | 2007-09-01 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| KR100503581B1 (ko) * | 2001-05-18 | 2005-07-25 | 산요덴키가부시키가이샤 | 박막 트랜지스터 및 액티브 매트릭스형 표시 장치 및이들의 제조 방법 |
| JP5038560B2 (ja) | 2001-08-01 | 2012-10-03 | ゲットナー・ファンデーション・エルエルシー | 電界効果型トランジスタ及びその製造方法並びに該トランジスタを使った液晶表示装置及びその製造方法 |
| JP4256087B2 (ja) * | 2001-09-27 | 2009-04-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6638776B2 (en) * | 2002-02-15 | 2003-10-28 | Lsi Logic Corporation | Thermal characterization compensation |
| JP4271413B2 (ja) * | 2002-06-28 | 2009-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| KR100623230B1 (ko) * | 2003-11-29 | 2006-09-18 | 삼성에스디아이 주식회사 | 박막 트랜지스터의 제조 방법 |
| JP4211644B2 (ja) * | 2004-03-15 | 2009-01-21 | セイコーエプソン株式会社 | 電気光学装置の製造方法 |
| TWI267213B (en) * | 2006-01-27 | 2006-11-21 | Ind Tech Res Inst | Organic light emitting device with integrated color filter and method of manufacturing the same |
| EP2008264B1 (en) * | 2006-04-19 | 2016-11-16 | Ignis Innovation Inc. | Stable driving scheme for active matrix displays |
| US8896065B2 (en) * | 2008-04-14 | 2014-11-25 | Sharp Laboratories Of America, Inc. | Top gate thin film transistor with independent field control for off-current suppression |
| JP5234333B2 (ja) | 2008-05-28 | 2013-07-10 | Nltテクノロジー株式会社 | ゲート線駆動回路、アクティブマトリクス基板及び液晶表示装置 |
| JP2015065202A (ja) | 2013-09-24 | 2015-04-09 | 株式会社東芝 | 半導体素子、表示装置、半導体素子の製造方法及び表示装置の製造方法 |
| KR102324764B1 (ko) * | 2014-11-21 | 2021-11-10 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| US9508860B2 (en) * | 2014-12-31 | 2016-11-29 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Lateral gate electrode TFT switch and liquid crystal display device |
| KR20240011902A (ko) * | 2022-07-19 | 2024-01-29 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58142566A (ja) | 1982-02-19 | 1983-08-24 | Seiko Epson Corp | 薄膜半導体装置 |
| US6294796B1 (en) * | 1982-04-13 | 2001-09-25 | Seiko Epson Corporation | Thin film transistors and active matrices including same |
| JPS58206121A (ja) * | 1982-05-27 | 1983-12-01 | Toshiba Corp | 薄膜半導体装置の製造方法 |
| JPH0697694B2 (ja) * | 1983-08-25 | 1994-11-30 | セイコーエプソン株式会社 | 相補型薄膜トランジスタ |
| JPH0740607B2 (ja) * | 1984-10-03 | 1995-05-01 | ソニー株式会社 | 薄膜トランジスタの製造方法 |
| JPS61104371A (ja) * | 1984-10-22 | 1986-05-22 | Sony Corp | 誤り率測定方法 |
| JPS61104671A (ja) * | 1984-10-29 | 1986-05-22 | Sharp Corp | 電界効果トランジスタ |
| JPS61170724A (ja) * | 1985-01-25 | 1986-08-01 | Seiko Instr & Electronics Ltd | アクテイブマトリクス表示装置用基板 |
| JPH02246277A (ja) * | 1989-03-20 | 1990-10-02 | Matsushita Electron Corp | Mosトランジスタおよびその製造方法 |
| JPH0783127B2 (ja) * | 1989-04-20 | 1995-09-06 | 三菱電機株式会社 | 半導体装置 |
| JP2811786B2 (ja) * | 1989-08-22 | 1998-10-15 | セイコーエプソン株式会社 | 薄膜トランジスタ |
| JP2979196B2 (ja) * | 1990-09-05 | 1999-11-15 | セイコーインスツルメンツ株式会社 | 光弁用半導体基板装置及びその製造方法 |
| JPH04139764A (ja) * | 1990-10-01 | 1992-05-13 | Canon Inc | 絶縁ゲート薄膜トランジスタの製造方法 |
| JP2794678B2 (ja) * | 1991-08-26 | 1998-09-10 | 株式会社 半導体エネルギー研究所 | 絶縁ゲイト型半導体装置およびその作製方法 |
| JP2650543B2 (ja) | 1991-11-25 | 1997-09-03 | カシオ計算機株式会社 | マトリクス回路駆動装置 |
| US5266504A (en) * | 1992-03-26 | 1993-11-30 | International Business Machines Corporation | Low temperature emitter process for high performance bipolar devices |
-
1993
- 1993-06-23 US US08/199,185 patent/US5508216A/en not_active Expired - Lifetime
- 1993-06-23 WO PCT/JP1993/000849 patent/WO1994000882A1/ja not_active Ceased
- 1993-06-23 KR KR1019940700563A patent/KR100309934B1/ko not_active Expired - Lifetime
- 1993-06-23 EP EP93913567A patent/EP0602250B1/en not_active Expired - Lifetime
- 1993-06-23 DE DE69326123T patent/DE69326123T2/de not_active Expired - Lifetime
- 1993-07-21 TW TW082105812A patent/TW268133B/zh not_active IP Right Cessation
-
1997
- 1997-06-24 US US08/881,097 patent/US5757048A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5508216A (en) | 1996-04-16 |
| US5757048A (en) | 1998-05-26 |
| EP0602250A1 (en) | 1994-06-22 |
| KR940702312A (ko) | 1994-07-28 |
| TW268133B (enExample) | 1996-01-11 |
| KR100309934B1 (ko) | 2002-06-20 |
| EP0602250B1 (en) | 1999-08-25 |
| DE69326123D1 (de) | 1999-09-30 |
| EP0602250A4 (en) | 1996-01-03 |
| WO1994000882A1 (fr) | 1994-01-06 |
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