DE69326123D1 - Dünnfilmtransistor und verfahren zur herstellung eines dünnfilmtransistors - Google Patents

Dünnfilmtransistor und verfahren zur herstellung eines dünnfilmtransistors

Info

Publication number
DE69326123D1
DE69326123D1 DE69326123T DE69326123T DE69326123D1 DE 69326123 D1 DE69326123 D1 DE 69326123D1 DE 69326123 T DE69326123 T DE 69326123T DE 69326123 T DE69326123 T DE 69326123T DE 69326123 D1 DE69326123 D1 DE 69326123D1
Authority
DE
Germany
Prior art keywords
thin film
film transistor
producing
transistor
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69326123T
Other languages
English (en)
Other versions
DE69326123T2 (de
Inventor
Satoshi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of DE69326123D1 publication Critical patent/DE69326123D1/de
Publication of DE69326123T2 publication Critical patent/DE69326123T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1222Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1251Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1255Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66757Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H01L29/78621Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H01L29/78621Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
    • H01L29/78627Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile with a significant overlap between the lightly doped drain and the gate electrode, e.g. GOLDD

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thin Film Transistor (AREA)
DE69326123T 1992-06-24 1993-06-23 Dünnfilmtransistor und verfahren zur herstellung eines dünnfilmtransistors Expired - Lifetime DE69326123T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP16602192 1992-06-24
JP31533192 1992-11-25
JP32531592 1992-12-04
PCT/JP1993/000849 WO1994000882A1 (en) 1992-06-24 1993-06-23 Thin film transistor, solid-state device, display device, and method for manufacturing thin film transistor

Publications (2)

Publication Number Publication Date
DE69326123D1 true DE69326123D1 (de) 1999-09-30
DE69326123T2 DE69326123T2 (de) 1999-12-23

Family

ID=27322616

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69326123T Expired - Lifetime DE69326123T2 (de) 1992-06-24 1993-06-23 Dünnfilmtransistor und verfahren zur herstellung eines dünnfilmtransistors

Country Status (6)

Country Link
US (2) US5508216A (de)
EP (1) EP0602250B1 (de)
KR (1) KR100309934B1 (de)
DE (1) DE69326123T2 (de)
TW (1) TW268133B (de)
WO (1) WO1994000882A1 (de)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5953582A (en) * 1993-02-10 1999-09-14 Seiko Epson Corporation Active matrix panel manufacturing method including TFTS having variable impurity concentration levels
DE19500380C2 (de) * 1994-05-20 2001-05-17 Mitsubishi Electric Corp Aktivmatrix-Flüssigkristallanzeige und Herstellungsverfahren dafür
JP3403812B2 (ja) * 1994-05-31 2003-05-06 株式会社半導体エネルギー研究所 薄膜トランジスタを用いた半導体装置の作製方法
US6133620A (en) * 1995-05-26 2000-10-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and process for fabricating the same
US5915174A (en) * 1994-09-30 1999-06-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for producing the same
JP3494720B2 (ja) * 1994-11-01 2004-02-09 株式会社半導体エネルギー研究所 半導体装置及びその作製方法、ならびにアクティブマトリクス型の液晶ディスプレー及びイメージセンサー
KR0146899B1 (ko) * 1994-11-28 1998-09-15 김광호 액정 디스플레이 박막트랜지스터소자 및 제조 방법
KR0145900B1 (ko) * 1995-02-11 1998-09-15 김광호 박막 트랜지스터 액정디스플레이 소자 및 그 제조방법
JP3292657B2 (ja) * 1995-04-10 2002-06-17 キヤノン株式会社 薄膜トランジスタ及びそれを用いた液晶表示装置の製造法
US6933182B1 (en) * 1995-04-20 2005-08-23 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device and manufacturing system thereof
KR100218500B1 (ko) 1995-05-17 1999-09-01 윤종용 실리콘막 및 그 제조 방법과 이를 포함하는 박막트랜지스터 및 그 제조방법
JPH0955499A (ja) * 1995-08-11 1997-02-25 Mitsubishi Electric Corp 半導体装置およびその製造方法
KR100192593B1 (ko) * 1996-02-21 1999-07-01 윤종용 폴리 실리콘 박막 트랜지스터의 제조방법
JP3527009B2 (ja) * 1996-03-21 2004-05-17 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JP3525316B2 (ja) * 1996-11-12 2004-05-10 株式会社半導体エネルギー研究所 アクティブマトリクス型表示装置
US6140160A (en) 1997-07-28 2000-10-31 Micron Technology, Inc. Method for fabricating a simplified CMOS polysilicon thin film transistor and resulting structure
KR100269600B1 (ko) * 1997-09-24 2000-10-16 김영환 박막트랜지스터의 제조방법
JPH11112002A (ja) * 1997-10-07 1999-04-23 Semiconductor Energy Lab Co Ltd 半導体装置およびその製造方法
KR19990039940A (ko) * 1997-11-15 1999-06-05 구자홍 박막트랜지스터 제조방법
US6338987B1 (en) * 1998-08-27 2002-01-15 Lg.Philips Lcd Co., Ltd. Method for forming polycrystalline silicon layer and method for fabricating thin film transistor
JP4536186B2 (ja) * 1998-11-16 2010-09-01 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6501098B2 (en) 1998-11-25 2002-12-31 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device
KR20000033832A (ko) * 1998-11-26 2000-06-15 윤종용 액정 표시 장치용 다결정 규소 박막 트랜지스터 기판의 제조 방법
JP4641582B2 (ja) * 1998-12-18 2011-03-02 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6469317B1 (en) 1998-12-18 2002-10-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
JP4372943B2 (ja) * 1999-02-23 2009-11-25 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
KR100654927B1 (ko) * 1999-03-04 2006-12-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그의 제작방법
US6531713B1 (en) 1999-03-19 2003-03-11 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and manufacturing method thereof
TW444257B (en) 1999-04-12 2001-07-01 Semiconductor Energy Lab Semiconductor device and method for fabricating the same
KR100333276B1 (ko) * 1999-05-20 2002-04-24 구본준, 론 위라하디락사 액정표시장치의 tft 및 그 제조방법
US7245018B1 (en) * 1999-06-22 2007-07-17 Semiconductor Energy Laboratory Co., Ltd. Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof
TW515109B (en) * 1999-06-28 2002-12-21 Semiconductor Energy Lab EL display device and electronic device
JP2001015553A (ja) * 1999-06-29 2001-01-19 Rohm Co Ltd 半導体装置の製造方法
US6384427B1 (en) * 1999-10-29 2002-05-07 Semiconductor Energy Laboratory Co., Ltd. Electronic device
JP4727029B2 (ja) * 1999-11-29 2011-07-20 株式会社半導体エネルギー研究所 El表示装置、電気器具及びel表示装置用の半導体素子基板
US7023021B2 (en) 2000-02-22 2006-04-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
SG100658A1 (en) 2000-03-30 2003-12-26 Ibm Dc or ac electric field business anneal
US6274465B1 (en) * 2000-03-30 2001-08-14 International Business Machines Corporataion DC electric field assisted anneal
TWI224806B (en) 2000-05-12 2004-12-01 Semiconductor Energy Lab Semiconductor device and manufacturing method thereof
WO2002095834A1 (en) * 2001-05-18 2002-11-28 Sanyo Electric Co., Ltd. Thin film transistor and active matrix type display unit production methods therefor
JP5038560B2 (ja) 2001-08-01 2012-10-03 ゲットナー・ファンデーション・エルエルシー 電界効果型トランジスタ及びその製造方法並びに該トランジスタを使った液晶表示装置及びその製造方法
JP4256087B2 (ja) * 2001-09-27 2009-04-22 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6638776B2 (en) * 2002-02-15 2003-10-28 Lsi Logic Corporation Thermal characterization compensation
JP4271413B2 (ja) * 2002-06-28 2009-06-03 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR100623230B1 (ko) * 2003-11-29 2006-09-18 삼성에스디아이 주식회사 박막 트랜지스터의 제조 방법
JP4211644B2 (ja) * 2004-03-15 2009-01-21 セイコーエプソン株式会社 電気光学装置の製造方法
TWI267213B (en) * 2006-01-27 2006-11-21 Ind Tech Res Inst Organic light emitting device with integrated color filter and method of manufacturing the same
WO2007118332A1 (en) * 2006-04-19 2007-10-25 Ignis Innovation Inc. Stable driving scheme for active matrix displays
US8896065B2 (en) * 2008-04-14 2014-11-25 Sharp Laboratories Of America, Inc. Top gate thin film transistor with independent field control for off-current suppression
JP5234333B2 (ja) * 2008-05-28 2013-07-10 Nltテクノロジー株式会社 ゲート線駆動回路、アクティブマトリクス基板及び液晶表示装置
JP2015065202A (ja) 2013-09-24 2015-04-09 株式会社東芝 半導体素子、表示装置、半導体素子の製造方法及び表示装置の製造方法
KR102324764B1 (ko) * 2014-11-21 2021-11-10 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
US9508860B2 (en) * 2014-12-31 2016-11-29 Shenzhen China Star Optoelectronics Technology Co., Ltd. Lateral gate electrode TFT switch and liquid crystal display device

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58142566A (ja) * 1982-02-19 1983-08-24 Seiko Epson Corp 薄膜半導体装置
US6294796B1 (en) * 1982-04-13 2001-09-25 Seiko Epson Corporation Thin film transistors and active matrices including same
JPS58206121A (ja) * 1982-05-27 1983-12-01 Toshiba Corp 薄膜半導体装置の製造方法
JPH0697694B2 (ja) * 1983-08-25 1994-11-30 セイコーエプソン株式会社 相補型薄膜トランジスタ
JPH0740607B2 (ja) * 1984-10-03 1995-05-01 ソニー株式会社 薄膜トランジスタの製造方法
JPS61104371A (ja) * 1984-10-22 1986-05-22 Sony Corp 誤り率測定方法
JPS61104671A (ja) * 1984-10-29 1986-05-22 Sharp Corp 電界効果トランジスタ
JPS61170724A (ja) * 1985-01-25 1986-08-01 Seiko Instr & Electronics Ltd アクテイブマトリクス表示装置用基板
JPH02246277A (ja) * 1989-03-20 1990-10-02 Matsushita Electron Corp Mosトランジスタおよびその製造方法
JPH0783127B2 (ja) * 1989-04-20 1995-09-06 三菱電機株式会社 半導体装置
JP2811786B2 (ja) * 1989-08-22 1998-10-15 セイコーエプソン株式会社 薄膜トランジスタ
JP2979196B2 (ja) * 1990-09-05 1999-11-15 セイコーインスツルメンツ株式会社 光弁用半導体基板装置及びその製造方法
JPH04139764A (ja) * 1990-10-01 1992-05-13 Canon Inc 絶縁ゲート薄膜トランジスタの製造方法
JP2794678B2 (ja) * 1991-08-26 1998-09-10 株式会社 半導体エネルギー研究所 絶縁ゲイト型半導体装置およびその作製方法
JP2650543B2 (ja) * 1991-11-25 1997-09-03 カシオ計算機株式会社 マトリクス回路駆動装置
US5266504A (en) * 1992-03-26 1993-11-30 International Business Machines Corporation Low temperature emitter process for high performance bipolar devices

Also Published As

Publication number Publication date
US5508216A (en) 1996-04-16
TW268133B (de) 1996-01-11
US5757048A (en) 1998-05-26
KR100309934B1 (ko) 2002-06-20
WO1994000882A1 (en) 1994-01-06
DE69326123T2 (de) 1999-12-23
KR940702312A (ko) 1994-07-28
EP0602250A1 (de) 1994-06-22
EP0602250B1 (de) 1999-08-25
EP0602250A4 (de) 1996-01-03

Similar Documents

Publication Publication Date Title
DE69326123T2 (de) Dünnfilmtransistor und verfahren zur herstellung eines dünnfilmtransistors
DE69430230D1 (de) Verfahren und Vorrichtung zur Herstellung eines Einkristallinen dünnen Films
DE69428014D1 (de) Verfahren zur Herstellung eines Dünnschichttransistors
DE69226666T2 (de) Verfahren zur Herstellung eines Mehrfachgate-Dünnfilmtransistors
DE69124009T2 (de) Dünnfilmtransistor und Verfahren zur Herstellung
DE69228868D1 (de) Verfahren zur Herstellung eines Polysilizium-Dünnfilmtransistors
DE69435288D1 (de) Verfahren und Vorrichtung zur Herstellung von Dünnfilmen
DE69321184D1 (de) Verfahren zur Herstellung eines Feldeffekttransistors
DE69324633D1 (de) Verfahren zur Herstellung eines einkristallinen Dünnfilmes
DE69422229D1 (de) Verfahren zum Herstellen einer Halbleiterdünnschicht und Verfahren zur Herstellung einer Hall-Effekt-Anordnung
DE69112791D1 (de) Verfahren und Vorrichtung zur Herstellung eines Bandes.
DE69210590D1 (de) Vorrichtung und verfahren zur herstellung eines gestreckten materialstreifens
DE59406668D1 (de) Verfahren und Vorrichtung zur Herstellung eines Folienverbundes
DE69712684D1 (de) Verfahren zur Herstellung eines Dünnschichttransistors
DE69403275D1 (de) Verfahren und Vorrichtung zur Herstellung eines Silizium-Einkristalles
DE69420721D1 (de) Vorrichtung und verfahren zur herstellung von einem dünnen film
DE69318380D1 (de) Verfahren zur Herstellung eines Orientierungsfilmes
DE69603388D1 (de) Verfahren und Vorrichtung zur Herstellung einer Kunststofffolie
DE3864056D1 (de) Verfahren zur herstellung eines supraleitenden duennen films und vorrichtung hierfuer.
DE69314282T2 (de) Dünnfilmtransistor und Verfahren zur seiner Herstellung
DE69205903D1 (de) Verfahren und Apparatur zur Herstellung eines dünnen Oxidfilmes.
DE59401843D1 (de) Photopolymerisierbares Material und Verfahren zur Herstellung eines farbigen Bildes
DE69622950T2 (de) Verfahren und Vorrichtung zur Herstellung eines photographischen Filmstreifens
DE69413310D1 (de) Verfahren und Vorrichtung zur Herstellung eines dünnen Bandes
DE68910509T2 (de) Feldeffekttransistoren und Verfahren zur Herstellung eines Feldeffekttransistors.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition