DE69227138T2 - Gestapelte CMOS Halbleitervorrichtung und Verfahren zu ihrer Herstellung - Google Patents

Gestapelte CMOS Halbleitervorrichtung und Verfahren zu ihrer Herstellung

Info

Publication number
DE69227138T2
DE69227138T2 DE69227138T DE69227138T DE69227138T2 DE 69227138 T2 DE69227138 T2 DE 69227138T2 DE 69227138 T DE69227138 T DE 69227138T DE 69227138 T DE69227138 T DE 69227138T DE 69227138 T2 DE69227138 T2 DE 69227138T2
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor device
same
cmos semiconductor
stacked cmos
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69227138T
Other languages
English (en)
Other versions
DE69227138D1 (de
Inventor
Osamu Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE69227138D1 publication Critical patent/DE69227138D1/de
Application granted granted Critical
Publication of DE69227138T2 publication Critical patent/DE69227138T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53271—Conductive materials containing semiconductor material, e.g. polysilicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76889—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances by forming silicides of refractory metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/903—FET configuration adapted for use as static memory cell
DE69227138T 1991-03-15 1992-03-11 Gestapelte CMOS Halbleitervorrichtung und Verfahren zu ihrer Herstellung Expired - Fee Related DE69227138T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5095491 1991-03-15
JP4005222A JPH0541378A (ja) 1991-03-15 1992-01-14 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
DE69227138D1 DE69227138D1 (de) 1998-11-05
DE69227138T2 true DE69227138T2 (de) 1999-04-01

Family

ID=26339127

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69227138T Expired - Fee Related DE69227138T2 (de) 1991-03-15 1992-03-11 Gestapelte CMOS Halbleitervorrichtung und Verfahren zu ihrer Herstellung

Country Status (4)

Country Link
US (3) US5475240A (de)
EP (1) EP0503904B1 (de)
JP (1) JPH0541378A (de)
DE (1) DE69227138T2 (de)

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US5432129A (en) * 1993-04-29 1995-07-11 Sgs-Thomson Microelectronics, Inc. Method of forming low resistance contacts at the junction between regions having different conductivity types
JP3256048B2 (ja) * 1993-09-20 2002-02-12 富士通株式会社 半導体装置及びその製造方法
US5702979A (en) * 1994-05-31 1997-12-30 Sgs-Thomson Microelectronics, Inc. Method of forming a landing pad structure in an integrated circuit
US5945738A (en) * 1994-05-31 1999-08-31 Stmicroelectronics, Inc. Dual landing pad structure in an integrated circuit
US5956615A (en) * 1994-05-31 1999-09-21 Stmicroelectronics, Inc. Method of forming a metal contact to landing pad structure in an integrated circuit
US5796673A (en) * 1994-10-06 1998-08-18 Mosaid Technologies Incorporated Delay locked loop implementation in a synchronous dynamic random access memory
US5705427A (en) * 1994-12-22 1998-01-06 Sgs-Thomson Microelectronics, Inc. Method of forming a landing pad structure in an integrated circuit
JP4156044B2 (ja) * 1994-12-22 2008-09-24 エスティーマイクロエレクトロニクス，インコーポレイテッド 集積回路におけるランディングパッド構成体の製造方法
JPH08181205A (ja) * 1994-12-26 1996-07-12 Mitsubishi Electric Corp 半導体装置の配線構造およびその製造方法
US5973369A (en) * 1997-03-11 1999-10-26 Nec Corporation SRAM having P-channel TFT as load element with less series-connected high resistance
JP3443219B2 (ja) * 1995-11-14 2003-09-02 株式会社日立製作所 半導体集積回路装置およびその製造方法
KR0167274B1 (ko) * 1995-12-07 1998-12-15 문정환 씨모스 아날로그 반도체장치와 그 제조방법
JP3104609B2 (ja) * 1996-02-09 2000-10-30 日本電気株式会社 半導体装置およびその製造方法
US5869391A (en) 1996-08-20 1999-02-09 Micron Technology, Inc. Semiconductor method of making electrical connection between an electrically conductive line and a node location, and integrated circuitry
JPH1070266A (ja) * 1996-08-26 1998-03-10 Nec Corp 半導体装置およびその製造方法
JPH10150198A (ja) * 1996-11-18 1998-06-02 Mitsubishi Electric Corp 薄膜トランジスタおよびその製造方法
JP2988413B2 (ja) * 1997-02-20 1999-12-13 日本電気株式会社 半導体装置及びその製造方法
JPH10242299A (ja) * 1997-02-27 1998-09-11 Nec Corp 半導体記憶装置及びその製造方法
US5854127A (en) * 1997-03-13 1998-12-29 Micron Technology, Inc. Method of forming a contact landing pad
US5998257A (en) 1997-03-13 1999-12-07 Micron Technology, Inc. Semiconductor processing methods of forming integrated circuitry memory devices, methods of forming capacitor containers, methods of making electrical connection to circuit nodes and related integrated circuitry
TW333687B (en) * 1997-04-02 1998-06-11 United Microelectronics Corp The method for forming poly-via in driver transistor
KR100451042B1 (ko) * 1997-06-27 2004-12-03 주식회사 하이닉스반도체 반도체소자의콘택형성방법
KR100418436B1 (ko) * 1997-06-27 2004-05-03 주식회사 하이닉스반도체 반도체 소자의 콘택 형성 방법
US6380026B2 (en) * 1997-08-22 2002-04-30 Micron Technology, Inc. Processing methods of forming integrated circuitry memory devices, methods of forming DRAM arrays, and related semiconductor masks
JP3807836B2 (ja) 1997-11-28 2006-08-09 株式会社ルネサステクノロジ 半導体装置および半導体装置の製造方法
US5888887A (en) * 1997-12-15 1999-03-30 Chartered Semiconductor Manufacturing, Ltd. Trenchless buried contact process technology
JP2002261277A (ja) 2001-03-06 2002-09-13 Toshiba Corp 半導体装置及びその製造方法
KR100455724B1 (ko) * 2001-10-08 2004-11-12 주식회사 하이닉스반도체 반도체소자의 플러그 형성방법
JP4427259B2 (ja) * 2003-02-28 2010-03-03 株式会社東芝 半導体装置及びその製造方法
KR100615085B1 (ko) * 2004-01-12 2006-08-22 삼성전자주식회사 노드 콘택 구조체들, 이를 채택하는 반도체소자들, 이를채택하는 에스램 셀들 및 이를 제조하는 방법들
DE102004024659B4 (de) 2004-05-18 2014-10-02 Infineon Technologies Ag Halbleiterbauteil
KR100595855B1 (ko) * 2004-12-29 2006-06-30 동부일렉트로닉스 주식회사 알루미늄 증착 콘택트 형성 방법
KR100684894B1 (ko) * 2005-04-18 2007-02-20 삼성전자주식회사 적층된 트랜지스터들을 구비하는 반도체 장치의 형성 방법
US8183087B2 (en) * 2008-09-09 2012-05-22 Stats Chippac, Ltd. Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component
JP5068296B2 (ja) * 2009-09-25 2012-11-07 ルネサスエレクトロニクス株式会社 半導体記憶装置の製造方法
KR101169167B1 (ko) * 2010-10-25 2012-07-30 에스케이하이닉스 주식회사 반도체 소자 및 그 형성 방법
JPWO2013190759A1 (ja) * 2012-06-21 2016-02-08 パナソニックＩｐマネジメント株式会社 固体撮像素子及びその製造方法
US20160276156A1 (en) * 2015-03-16 2016-09-22 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and manufacturing process thereof

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US4785341A (en) * 1979-06-29 1988-11-15 International Business Machines Corporation Interconnection of opposite conductivity type semiconductor regions
JPS5640269A (en) * 1979-09-11 1981-04-16 Toshiba Corp Preparation of semiconductor device
JPS5846193B2 (ja) * 1980-07-15 1983-10-14 株式会社東芝 半導体装置
JPS57204171A (en) * 1981-06-10 1982-12-14 Mitsubishi Electric Corp Semiconductor device
JPS60186051A (ja) * 1984-03-05 1985-09-21 Hitachi Ltd Ｃｍｏｓ半導体装置およびその製造方法
DE3565339D1 (en) * 1984-04-19 1988-11-03 Nippon Telegraph & Telephone Semiconductor memory device and method of manufacturing the same
US4710897A (en) * 1984-04-27 1987-12-01 Kabushiki Kaisha Toshiba Semiconductor memory device comprising six-transistor memory cells
JPS616855A (ja) * 1984-06-20 1986-01-13 Nec Corp 相補型ｍｏｓ半導体装置
JPS6140133A (ja) * 1984-07-31 1986-02-26 Shiro Kanao 可撓性ホ−スの製造方法
JPS62132317A (ja) * 1985-12-04 1987-06-15 Mitsubishi Electric Corp 半導体装置の電極形成方法
JPS62274659A (ja) * 1986-05-22 1987-11-28 Mitsubishi Electric Corp 半導体装置
US4829018A (en) * 1986-06-27 1989-05-09 Wahlstrom Sven E Multilevel integrated circuits employing fused oxide layers
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DE3778533D1 (de) * 1987-01-28 1992-05-27 Advanced Micro Devices Inc Statische ram-zellen mit vier transistoren.
US4966865A (en) * 1987-02-05 1990-10-30 Texas Instruments Incorporated Method for planarization of a semiconductor device prior to metallization
JPH0215620A (ja) * 1988-07-01 1990-01-19 Nec Corp 半導体装置の製造方法
JP2753581B2 (ja) * 1988-09-07 1998-05-20 株式会社東芝 ファクシミリ装置
JPH0273666A (ja) * 1988-09-08 1990-03-13 Sony Corp 半導体メモリ装置
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Also Published As

Publication number Publication date
JPH0541378A (ja) 1993-02-19
US5581093A (en) 1996-12-03
EP0503904A3 (en) 1992-11-19
EP0503904A2 (de) 1992-09-16
US5654239A (en) 1997-08-05
US5475240A (en) 1995-12-12
EP0503904B1 (de) 1998-09-30
DE69227138D1 (de) 1998-11-05

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee