DE60031436D1 - Klebemittel, verfahren zum verbinden von verdrahtungsanschlüssen und verdrahtungsstruktur - Google Patents

Klebemittel, verfahren zum verbinden von verdrahtungsanschlüssen und verdrahtungsstruktur

Info

Publication number
DE60031436D1
DE60031436D1 DE60031436T DE60031436T DE60031436D1 DE 60031436 D1 DE60031436 D1 DE 60031436D1 DE 60031436 T DE60031436 T DE 60031436T DE 60031436 T DE60031436 T DE 60031436T DE 60031436 D1 DE60031436 D1 DE 60031436D1
Authority
DE
Germany
Prior art keywords
adhesives
wiring
connections
wiring structure
connecting wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60031436T
Other languages
English (en)
Other versions
DE60031436T2 (de
Inventor
Motohiro Arifuku
Itsuo Watanabe
Kouji Motomura
Kouji Kobayashi
Yasushi Goto
Tohru Fujinawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE60031436D1 publication Critical patent/DE60031436D1/de
Publication of DE60031436T2 publication Critical patent/DE60031436T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/29001—Core members of the layer connector
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    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/2813—Heat or solvent activated or sealable
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/2852—Adhesive compositions

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE60031436T 1999-08-25 2000-08-25 Klebemittel, verfahren zum verbinden von verdrahtungsanschlüssen und verdrahtungsstruktur Expired - Lifetime DE60031436T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP23840899 1999-08-25
JP23840899 1999-08-25
PCT/JP2000/005766 WO2001014484A1 (fr) 1999-08-25 2000-08-25 Agent adhesif, technique de raccordement pour bornes de fil et structure de fils

Publications (2)

Publication Number Publication Date
DE60031436D1 true DE60031436D1 (de) 2006-11-30
DE60031436T2 DE60031436T2 (de) 2007-08-30

Family

ID=17029774

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60031436T Expired - Lifetime DE60031436T2 (de) 1999-08-25 2000-08-25 Klebemittel, verfahren zum verbinden von verdrahtungsanschlüssen und verdrahtungsstruktur

Country Status (9)

Country Link
US (6) US6939913B1 (de)
EP (1) EP1229095B1 (de)
JP (1) JP4499329B2 (de)
KR (3) KR100671312B1 (de)
CN (6) CN101906274B (de)
AU (1) AU6731700A (de)
DE (1) DE60031436T2 (de)
TW (2) TWI291982B (de)
WO (1) WO2001014484A1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998044067A1 (en) * 1997-03-31 1998-10-08 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
US7967943B2 (en) * 1997-03-31 2011-06-28 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
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CN101037573A (zh) 2007-09-19
DE60031436T2 (de) 2007-08-30
TWI291982B (de) 2008-01-01
TWI278501B (en) 2007-04-11
CN1377393A (zh) 2002-10-30
US7777335B2 (en) 2010-08-17
CN101906274B (zh) 2012-05-30
CN101033376A (zh) 2007-09-12
KR100660430B1 (ko) 2006-12-22
US6939913B1 (en) 2005-09-06
CN101037573B (zh) 2012-01-11
US20090101279A1 (en) 2009-04-23
AU6731700A (en) 2001-03-19
US20100330364A1 (en) 2010-12-30
KR100671312B1 (ko) 2007-01-19
US20050178502A1 (en) 2005-08-18
US20100326596A1 (en) 2010-12-30
EP1229095A1 (de) 2002-08-07
CN101037581A (zh) 2007-09-19
EP1229095B1 (de) 2006-10-18
JP4499329B2 (ja) 2010-07-07
US8115322B2 (en) 2012-02-14
US8120189B2 (en) 2012-02-21
US20050176882A1 (en) 2005-08-11
WO2001014484A1 (fr) 2001-03-01
KR20050049452A (ko) 2005-05-25
CN1318530C (zh) 2007-05-30
KR20020042649A (ko) 2002-06-05
US7241644B2 (en) 2007-07-10
KR20060093136A (ko) 2006-08-23
CN101037572A (zh) 2007-09-19
EP1229095A4 (de) 2002-10-30

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