DE69910464D1 - Verfahren zum Verbinden von unterschiedlichen Elementen - Google Patents

Verfahren zum Verbinden von unterschiedlichen Elementen

Info

Publication number
DE69910464D1
DE69910464D1 DE69910464T DE69910464T DE69910464D1 DE 69910464 D1 DE69910464 D1 DE 69910464D1 DE 69910464 T DE69910464 T DE 69910464T DE 69910464 T DE69910464 T DE 69910464T DE 69910464 D1 DE69910464 D1 DE 69910464D1
Authority
DE
Germany
Prior art keywords
different elements
connecting different
elements
different
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69910464T
Other languages
English (en)
Other versions
DE69910464T2 (de
Inventor
Takuma Makino
Masayuki Shinkai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE69910464D1 publication Critical patent/DE69910464D1/de
Publication of DE69910464T2 publication Critical patent/DE69910464T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
DE69910464T 1998-02-18 1999-02-17 Verfahren zum Verbinden von unterschiedlichen Elementen Expired - Lifetime DE69910464T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP05297198A JP3315919B2 (ja) 1998-02-18 1998-02-18 ２種類以上の異種部材よりなる複合部材を製造する方法
JP5297198 1998-02-18

Publications (2)

Publication Number Publication Date
DE69910464D1 true DE69910464D1 (de) 2003-09-25
DE69910464T2 DE69910464T2 (de) 2004-07-08

Family

ID=12929787

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69910464T Expired - Lifetime DE69910464T2 (de) 1998-02-18 1999-02-17 Verfahren zum Verbinden von unterschiedlichen Elementen

Country Status (4)

Country Link
US (2) US6390354B1 (de)
EP (1) EP0937536B1 (de)
JP (1) JP3315919B2 (de)
DE (1) DE69910464T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3792440B2 (ja) * 1999-06-25 2006-07-05 日本碍子株式会社 異種部材の接合方法、および同接合方法により接合された複合部材
US6605316B1 (en) 1999-07-31 2003-08-12 The Regents Of The University Of California Structures and fabrication techniques for solid state electrochemical devices
JP4367675B2 (ja) 1999-10-21 2009-11-18 日本碍子株式会社 セラミック製部材と金属製部材の接合用接着剤組成物、同組成物を用いた複合部材の製造方法、および同製造方法により得られた複合部材
EP1122780A3 (de) 2000-01-31 2004-01-02 Ngk Insulators, Ltd. Laminatkühler, Leistungshalbleiter und seine Herstellung
DE10233530A1 (de) * 2002-07-23 2004-02-12 Komet Präzisionswerkzeuge Robert Breuning Gmbh Maschinenwerkzeug mit einem Werkzeugschaft und einem Schneidkopf
JP3967278B2 (ja) 2003-03-07 2007-08-29 日本碍子株式会社 接合部材及び静電チャック
US7347354B2 (en) * 2004-03-23 2008-03-25 Intel Corporation Metallic solder thermal interface material layer and application of the same
US7179558B2 (en) * 2004-07-15 2007-02-20 Delphi Technologies, Inc. Braze alloy containing particulate material
EP1825541A4 (de) * 2004-11-30 2010-01-13 Univ California Abgedichtete gelenkstruktur für elektrochemische vorrichtung
EP1824630A4 (de) * 2004-11-30 2009-11-25 Univ California Hartlötsystem mit angepassten wärmeausdehnungskoeffizienten
EP1829112A4 (de) * 2004-11-30 2009-11-18 Univ California Verbinden von verschiedenartigen materialien
US7185545B2 (en) * 2004-12-29 2007-03-06 General Electric Company Instrumentation and method for monitoring change in electric potential to detect crack growth
US7559202B2 (en) * 2005-11-15 2009-07-14 Pratt & Whitney Canada Corp. Reduced thermal stress fuel nozzle assembly
JP4162094B2 (ja) * 2006-05-30 2008-10-08 三菱重工業株式会社 常温接合によるデバイス、デバイス製造方法ならびに常温接合装置
JP2008044009A (ja) * 2006-07-19 2008-02-28 Honda Motor Co Ltd 熱膨張係数が異なる部材の接合方法
BRPI0621912A2 (pt) * 2006-07-28 2011-12-20 Univ California método de unir estruturas tubulares concêntricas para formar uma estrutura tubular compósita e estrutura tubular compósita
US20080217382A1 (en) * 2007-03-07 2008-09-11 Battelle Memorial Institute Metal-ceramic composite air braze with ceramic particulate
US7691488B2 (en) * 2007-06-11 2010-04-06 Battelle Memorial Institute Diffusion barriers in modified air brazes
RU2480864C9 (ru) * 2007-07-25 2013-08-27 Члены Правления Университета Калифорнии Высокотемпературное электрохимическое устройство со структурой с взаимосцеплением
CN101983250A (zh) * 2008-02-04 2011-03-02 加州大学评议会 用于高温燃料电池的Cu基金属陶瓷
WO2009128849A1 (en) 2008-04-18 2009-10-22 The Regents Of The University Of California Integrated seal for high-temperature electrochemical device
KR102399753B1 (ko) * 2014-03-07 2022-05-20 엔지케이 인슐레이터 엘티디 접합체의 제조 방법 및 접합체
JP6715762B2 (ja) 2014-03-07 2020-07-01 日本碍子株式会社 接合体の製造方法
KR101477077B1 (ko) * 2014-05-09 2014-12-29 국방과학연구소 몰리브덴과 티타늄 합금의 브레이징 방법
KR102259717B1 (ko) * 2016-08-26 2021-06-02 엔지케이 인슐레이터 엘티디 웨이퍼 배치대

Family Cites Families (25)

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Publication number Priority date Publication date Assignee Title
GB1590695A (en) 1977-08-08 1981-06-10 Fusion Inc Method of brazing
CA1202768A (en) 1981-11-05 1986-04-08 Kenneth R. Cross Method for forming braze-bonded abrasive turbine blade tip
US4729504A (en) * 1985-06-01 1988-03-08 Mizuo Edamura Method of bonding ceramics and metal, or bonding similar ceramics among themselves; or bonding dissimilar ceramics
JPS62179889A (ja) 1986-01-31 1987-08-07 Senjiyu Kinzoku Kogyo Kk クリ−ムはんだ
JPS638273A (ja) 1986-06-28 1988-01-14 日本碍子株式会社 セラミツクス部材と金属部材の結合方法
JPH0657622B2 (ja) 1988-03-30 1994-08-03 松下電器産業株式会社 ろう付けペースト
JPH025541A (ja) 1988-06-24 1990-01-10 Asahi Daiyamondo Kogyo Kk ボンディングツールの製造方法
JPH0238376A (ja) 1988-07-28 1990-02-07 Ngk Insulators Ltd セラミック部材間のガラス接合方法
US5161728A (en) * 1988-11-29 1992-11-10 Li Chou H Ceramic-metal bonding
US6413589B1 (en) * 1988-11-29 2002-07-02 Chou H. Li Ceramic coating method
US4919974A (en) * 1989-01-12 1990-04-24 Ford Motor Company Making diamond composite coated cutting tools
JP2764990B2 (ja) 1989-01-31 1998-06-11 旭硝子株式会社 複合型回路装置及び接合用ペースト
US5127969A (en) 1990-03-22 1992-07-07 University Of Cincinnati Reinforced solder, brazing and welding compositions and methods for preparation thereof
JPH05246769A (ja) 1991-03-15 1993-09-24 Toshiba Corp セラミックス−金属接合用組成物およびそれを用いたセラミックス−金属接合体
US5614320A (en) * 1991-07-17 1997-03-25 Beane; Alan F. Particles having engineered properties
JPH0531994A (ja) 1991-07-31 1993-02-09 Toshiba Corp プリンタ
JPH05163078A (ja) 1991-12-18 1993-06-29 Nippon Steel Corp セラミックスと金属の接合体
JPH05319944A (ja) 1992-05-15 1993-12-03 Toshiba Corp セラミックス回路基板および回路基板用接合剤
US5561321A (en) * 1992-07-03 1996-10-01 Noritake Co., Ltd. Ceramic-metal composite structure and process of producing same
FR2706139B1 (fr) 1993-06-08 1995-07-21 Thomson Csf Matériau pour brasure.
JPH0769749A (ja) 1993-09-03 1995-03-14 Tanaka Kikinzoku Kogyo Kk セラミックス用ろう材
WO1995008654A1 (fr) * 1993-09-24 1995-03-30 The Ishizuka Research Institute, Ltd. Materiau composite et procede pour sa production
US6264882B1 (en) * 1994-05-20 2001-07-24 The Regents Of The University Of California Process for fabricating composite material having high thermal conductivity
JPH1180160A (ja) 1997-09-04 1999-03-26 Dong Kook Pharmaceut Co ベンゾジアゼピン誘導体の調製プロセス
JP3190300B2 (ja) 1998-01-19 2001-07-23 日本電信電話株式会社 パケット中継制御方法

Also Published As

Publication number Publication date
EP0937536B1 (de) 2003-08-20
JP3315919B2 (ja) 2002-08-19
EP0937536A1 (de) 1999-08-25
DE69910464T2 (de) 2004-07-08
JPH11228245A (ja) 1999-08-24
US6390354B1 (en) 2002-05-21
US6742700B2 (en) 2004-06-01
US20020092896A1 (en) 2002-07-18

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Legal Events

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8364 No opposition during term of opposition