DE112021005992T5 - Lösung für die stromlose kupferplattierung - Google Patents

Lösung für die stromlose kupferplattierung Download PDF

Info

Publication number
DE112021005992T5
DE112021005992T5 DE112021005992.0T DE112021005992T DE112021005992T5 DE 112021005992 T5 DE112021005992 T5 DE 112021005992T5 DE 112021005992 T DE112021005992 T DE 112021005992T DE 112021005992 T5 DE112021005992 T5 DE 112021005992T5
Authority
DE
Germany
Prior art keywords
solution
copper plating
electroless copper
plating
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021005992.0T
Other languages
German (de)
English (en)
Inventor
Yoshito Tsukahara
Yuki Nakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meltex Inc
Original Assignee
Meltex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meltex Inc filed Critical Meltex Inc
Publication of DE112021005992T5 publication Critical patent/DE112021005992T5/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE112021005992.0T 2020-11-10 2021-09-03 Lösung für die stromlose kupferplattierung Pending DE112021005992T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020187294 2020-11-10
JP2020-187294 2020-11-10
PCT/JP2021/032487 WO2022102226A1 (ja) 2020-11-10 2021-09-03 無電解銅めっき液

Publications (1)

Publication Number Publication Date
DE112021005992T5 true DE112021005992T5 (de) 2023-08-24

Family

ID=81601091

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021005992.0T Pending DE112021005992T5 (de) 2020-11-10 2021-09-03 Lösung für die stromlose kupferplattierung

Country Status (8)

Country Link
US (1) US20230323541A1 (https=)
JP (1) JP7111410B1 (https=)
KR (1) KR102587691B1 (https=)
CN (1) CN116194618A (https=)
DE (1) DE112021005992T5 (https=)
MY (1) MY199940A (https=)
TW (1) TW202219320A (https=)
WO (1) WO2022102226A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117448800B (zh) * 2023-09-11 2025-12-26 广东利尔化学有限公司 一种镀铜液以及稳定剂
TW202518607A (zh) * 2023-10-30 2025-05-01 強茂股份有限公司 預成型封裝導線架的製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013234343A (ja) 2012-05-07 2013-11-21 C Uyemura & Co Ltd 無電解銅めっき浴及び無電解銅めっき方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2721567A1 (de) * 1977-05-13 1978-11-16 Cannings Ltd W Loesung fuer die stromlose kupferplatierung
JPS53142328A (en) * 1977-05-17 1978-12-12 Canning & Co Ltd W Solution for nonnelectrolytic copper plating
JP3227504B2 (ja) * 1993-04-19 2001-11-12 奥野製薬工業株式会社 無電解銅めっき液
JP2007092111A (ja) * 2005-09-28 2007-04-12 Okuno Chem Ind Co Ltd めっき析出阻害用組成物
EP2034049A1 (en) * 2007-09-05 2009-03-11 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO An electroless process for depositing a metal on a non-catalytic substrate
JP5337276B1 (ja) * 2012-05-07 2013-11-06 鹿島建設株式会社 逆打ち工法用免震装置支持ユニット及びそれを使用した免震構造物の施工方法
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
TWI690619B (zh) * 2014-12-17 2020-04-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
KR101660520B1 (ko) * 2015-04-08 2016-09-29 한국생산기술연구원 구리 및 니켈의 연속 무전해 도금방법 및 이를 이용하여 제조된 도금층
US20170051411A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Electroless Silver Plating Bath and Method of Using the Same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013234343A (ja) 2012-05-07 2013-11-21 C Uyemura & Co Ltd 無電解銅めっき浴及び無電解銅めっき方法

Also Published As

Publication number Publication date
CN116194618A (zh) 2023-05-30
JP7111410B1 (ja) 2022-08-02
WO2022102226A1 (ja) 2022-05-19
KR20230011434A (ko) 2023-01-20
US20230323541A1 (en) 2023-10-12
TW202219320A (zh) 2022-05-16
JPWO2022102226A1 (https=) 2022-05-19
MY199940A (en) 2023-11-30
KR102587691B1 (ko) 2023-10-10

Similar Documents

Publication Publication Date Title
DE10313517B4 (de) Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens
DE2937297C2 (de) Verfahren zum Beschleunigen der Kupferabscheidung aus einer stromlos Kupfer abscheidenden Badlösung
KR102092929B1 (ko) 무전해 동 도금욕 및 무전해 동 도금 방법
DE69215014T2 (de) Bad und Verfahren zur stromlosen Beschichtung mit Zinn oder Zinn-Blei-Legierung
DE112021005992T5 (de) Lösung für die stromlose kupferplattierung
JP6980017B2 (ja) 錫めっき浴および錫もしくは錫合金を基材の表面に析出させる方法
DE2518559A1 (de) Stromloses plattierungsverfahren und plattierungsbad
WO2008043528A2 (de) Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten
US6383269B1 (en) Electroless gold plating solution and process
DE3307174A1 (de) Galvanisches palladiumbad
DE10006128B4 (de) Plattierungsbad zum Abscheiden einer Sn-Bi-Legierung und dessen Verwendung
EP1330558B1 (de) Bleifreie chemisch-nickel-legierung
KR20040019967A (ko) 도금 방법
DE2222941A1 (de) Verfahren zum Vorbehandeln eines Substrates aus einem Acrylnitril/Butadien/Styrol-Harz
DE3238921C2 (de) Bad zur stromlosen Abscheidung von Kupfer auf einem Substrat und Verfahren zur stromlosen Abscheidung
DE102005038208A1 (de) Herstellung von Silberschichten
DE112019006704T5 (de) LÖSUNG ZUR STROMLOSEN ABSCHEIDUNG EINER Ni-Fe LEGIERUNG
DE68909984T2 (de) Elektroplattierte Legierungsbeschichtungen, die eine stabile Legierungszusammensetzung aufweisen.
EP1763594B1 (de) Verfahren zur verbesserung der lötbarkeit von nickelüberzügen
DE3914180C2 (https=)
DE1521490C3 (https=)
DE2005032C3 (de) Bad zur stromlosen Verkupferung geeigneter Oberflächen
DE3504150C2 (https=)
DE102004046258A1 (de) Bad und Verfahren zur stromlosen Abscheidung von Palladium
DD222347A1 (de) Loesung zur autokatalytischen abscheidung von palladium

Legal Events

Date Code Title Description
R012 Request for examination validly filed