KR102587691B1 - 포름알데히드 프리 무전해 구리 도금액 - Google Patents

포름알데히드 프리 무전해 구리 도금액 Download PDF

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Publication number
KR102587691B1
KR102587691B1 KR1020227045941A KR20227045941A KR102587691B1 KR 102587691 B1 KR102587691 B1 KR 102587691B1 KR 1020227045941 A KR1020227045941 A KR 1020227045941A KR 20227045941 A KR20227045941 A KR 20227045941A KR 102587691 B1 KR102587691 B1 KR 102587691B1
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South Korea
Prior art keywords
copper plating
electroless copper
plating solution
solution
tellurium
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English (en)
Korean (ko)
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KR20230011434A (ko
Inventor
요시토 츠카하라
유키 나카타
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멜텍스 가부시키가이샤
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
KR1020227045941A 2020-11-10 2021-09-03 포름알데히드 프리 무전해 구리 도금액 Active KR102587691B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-187294 2020-11-10
JP2020187294 2020-11-10
PCT/JP2021/032487 WO2022102226A1 (ja) 2020-11-10 2021-09-03 無電解銅めっき液

Publications (2)

Publication Number Publication Date
KR20230011434A KR20230011434A (ko) 2023-01-20
KR102587691B1 true KR102587691B1 (ko) 2023-10-10

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ID=81601091

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227045941A Active KR102587691B1 (ko) 2020-11-10 2021-09-03 포름알데히드 프리 무전해 구리 도금액

Country Status (8)

Country Link
US (1) US20230323541A1 (https=)
JP (1) JP7111410B1 (https=)
KR (1) KR102587691B1 (https=)
CN (1) CN116194618A (https=)
DE (1) DE112021005992T5 (https=)
MY (1) MY199940A (https=)
TW (1) TW202219320A (https=)
WO (1) WO2022102226A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117448800B (zh) * 2023-09-11 2025-12-26 广东利尔化学有限公司 一种镀铜液以及稳定剂
TW202518607A (zh) * 2023-10-30 2025-05-01 強茂股份有限公司 預成型封裝導線架的製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013234343A (ja) * 2012-05-07 2013-11-21 C Uyemura & Co Ltd 無電解銅めっき浴及び無電解銅めっき方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2721567A1 (de) * 1977-05-13 1978-11-16 Cannings Ltd W Loesung fuer die stromlose kupferplatierung
JPS53142328A (en) * 1977-05-17 1978-12-12 Canning & Co Ltd W Solution for nonnelectrolytic copper plating
JP3227504B2 (ja) * 1993-04-19 2001-11-12 奥野製薬工業株式会社 無電解銅めっき液
JP2007092111A (ja) * 2005-09-28 2007-04-12 Okuno Chem Ind Co Ltd めっき析出阻害用組成物
EP2034049A1 (en) * 2007-09-05 2009-03-11 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO An electroless process for depositing a metal on a non-catalytic substrate
JP5337276B1 (ja) * 2012-05-07 2013-11-06 鹿島建設株式会社 逆打ち工法用免震装置支持ユニット及びそれを使用した免震構造物の施工方法
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
TWI690619B (zh) * 2014-12-17 2020-04-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
KR101660520B1 (ko) * 2015-04-08 2016-09-29 한국생산기술연구원 구리 및 니켈의 연속 무전해 도금방법 및 이를 이용하여 제조된 도금층
US20170051411A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Electroless Silver Plating Bath and Method of Using the Same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013234343A (ja) * 2012-05-07 2013-11-21 C Uyemura & Co Ltd 無電解銅めっき浴及び無電解銅めっき方法

Also Published As

Publication number Publication date
CN116194618A (zh) 2023-05-30
JP7111410B1 (ja) 2022-08-02
WO2022102226A1 (ja) 2022-05-19
KR20230011434A (ko) 2023-01-20
US20230323541A1 (en) 2023-10-12
TW202219320A (zh) 2022-05-16
JPWO2022102226A1 (https=) 2022-05-19
MY199940A (en) 2023-11-30
DE112021005992T5 (de) 2023-08-24

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