MY199940A - Electroless copper plating solution - Google Patents

Electroless copper plating solution

Info

Publication number
MY199940A
MY199940A MYPI2023001353A MYPI2023001353A MY199940A MY 199940 A MY199940 A MY 199940A MY PI2023001353 A MYPI2023001353 A MY PI2023001353A MY PI2023001353 A MYPI2023001353 A MY PI2023001353A MY 199940 A MY199940 A MY 199940A
Authority
MY
Malaysia
Prior art keywords
plating solution
copper plating
electroless copper
solution
copper
Prior art date
Application number
MYPI2023001353A
Other languages
English (en)
Inventor
Yoshito Tsukahara
Yuki Nakata
Original Assignee
Meltex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meltex Inc filed Critical Meltex Inc
Publication of MY199940A publication Critical patent/MY199940A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
MYPI2023001353A 2020-11-10 2021-09-03 Electroless copper plating solution MY199940A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020187294 2020-11-10
PCT/JP2021/032487 WO2022102226A1 (ja) 2020-11-10 2021-09-03 無電解銅めっき液

Publications (1)

Publication Number Publication Date
MY199940A true MY199940A (en) 2023-11-30

Family

ID=81601091

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2023001353A MY199940A (en) 2020-11-10 2021-09-03 Electroless copper plating solution

Country Status (8)

Country Link
US (1) US20230323541A1 (https=)
JP (1) JP7111410B1 (https=)
KR (1) KR102587691B1 (https=)
CN (1) CN116194618A (https=)
DE (1) DE112021005992T5 (https=)
MY (1) MY199940A (https=)
TW (1) TW202219320A (https=)
WO (1) WO2022102226A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117448800B (zh) * 2023-09-11 2025-12-26 广东利尔化学有限公司 一种镀铜液以及稳定剂
TW202518607A (zh) * 2023-10-30 2025-05-01 強茂股份有限公司 預成型封裝導線架的製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2721567A1 (de) * 1977-05-13 1978-11-16 Cannings Ltd W Loesung fuer die stromlose kupferplatierung
JPS53142328A (en) * 1977-05-17 1978-12-12 Canning & Co Ltd W Solution for nonnelectrolytic copper plating
JP3227504B2 (ja) * 1993-04-19 2001-11-12 奥野製薬工業株式会社 無電解銅めっき液
JP2007092111A (ja) * 2005-09-28 2007-04-12 Okuno Chem Ind Co Ltd めっき析出阻害用組成物
EP2034049A1 (en) * 2007-09-05 2009-03-11 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO An electroless process for depositing a metal on a non-catalytic substrate
JP6030848B2 (ja) * 2012-05-07 2016-11-24 上村工業株式会社 無電解銅めっき浴及び無電解銅めっき方法
JP5337276B1 (ja) * 2012-05-07 2013-11-06 鹿島建設株式会社 逆打ち工法用免震装置支持ユニット及びそれを使用した免震構造物の施工方法
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
TWI690619B (zh) * 2014-12-17 2020-04-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
KR101660520B1 (ko) * 2015-04-08 2016-09-29 한국생산기술연구원 구리 및 니켈의 연속 무전해 도금방법 및 이를 이용하여 제조된 도금층
US20170051411A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Electroless Silver Plating Bath and Method of Using the Same

Also Published As

Publication number Publication date
CN116194618A (zh) 2023-05-30
JP7111410B1 (ja) 2022-08-02
WO2022102226A1 (ja) 2022-05-19
KR20230011434A (ko) 2023-01-20
US20230323541A1 (en) 2023-10-12
TW202219320A (zh) 2022-05-16
JPWO2022102226A1 (https=) 2022-05-19
DE112021005992T5 (de) 2023-08-24
KR102587691B1 (ko) 2023-10-10

Similar Documents

Publication Publication Date Title
MY199940A (en) Electroless copper plating solution
CN103469261B (zh) 一种无氰镀银溶液添加剂
AU2003237637A8 (en) Pyrophosphoric acid bath for use in copper-tin alloy plating
KR20090056577A (ko) 금속제품 전해가공용 전해액
CN104109885B (zh) 一种弱碱性焦磷酸盐电镀光亮锡溶液及工艺
EP2772566B1 (en) Plating bath for the electroless deposition of silver and corresponding method
CN104561961A (zh) 一种化学镀钴镍合金镀液及工艺
CN102758230B (zh) 一种电镀金溶液及电镀金方法
CN103668212A (zh) 一种铝合金抛光工艺
KR100971555B1 (ko) 전기아연도금공정의 냉연강판의 전처리용 고농도 니켈 도금 조성물
MX339242B (es) Proceso para deposicion por via quimica de metales utilizando baño de chapado altamente alcalino.
CN105132917A (zh) 两酸无黄烟抛光添加剂及抛光液
CN104746057B (zh) 一种化学镀锡液及其制备方法和一种化学镀锡方法
CN100476027C (zh) 化学镀镍镀液及工艺
CN108823555B (zh) 一种还原型化学镀金液及其制备方法和使用方法以及应用
CN103556137A (zh) 一种用于塑料表面金属化改性的环保型化学沉镍溶液
JP2009068085A (ja) 三価クロム化成処理剤
WO2011062030A1 (ja) 二価鉄イオン含有水溶液
JPWO2022102226A5 (https=)
CN110904473B (zh) 一种5g天线环保镀铜工艺
US20210198797A1 (en) Trivalent chromium plating solution and trivalent chromium plating method using same
CN104746052A (zh) 一种化学镀锡液及其制备方法和一种化学镀锡方法
JP6270641B2 (ja) スズ−コバルト合金めっき処理剤及びそれを用いたスズ−コバルト合金めっき方法
KR20250098453A (ko) 구리 도금액 및 이를 이용한 구리 전해 도금 방법
KR101264089B1 (ko) 수산화니켈 슬러리 도금 조성물