TW202219320A - 無電解銅鍍液 - Google Patents

無電解銅鍍液 Download PDF

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Publication number
TW202219320A
TW202219320A TW110133195A TW110133195A TW202219320A TW 202219320 A TW202219320 A TW 202219320A TW 110133195 A TW110133195 A TW 110133195A TW 110133195 A TW110133195 A TW 110133195A TW 202219320 A TW202219320 A TW 202219320A
Authority
TW
Taiwan
Prior art keywords
copper plating
electroless copper
plating solution
solution
precipitation
Prior art date
Application number
TW110133195A
Other languages
English (en)
Chinese (zh)
Inventor
原義人
中田優希
Original Assignee
日商梅爾帝克斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商梅爾帝克斯股份有限公司 filed Critical 日商梅爾帝克斯股份有限公司
Publication of TW202219320A publication Critical patent/TW202219320A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
TW110133195A 2020-11-10 2021-09-07 無電解銅鍍液 TW202219320A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020187294 2020-11-10
JP2020-187294 2020-11-10

Publications (1)

Publication Number Publication Date
TW202219320A true TW202219320A (zh) 2022-05-16

Family

ID=81601091

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110133195A TW202219320A (zh) 2020-11-10 2021-09-07 無電解銅鍍液

Country Status (8)

Country Link
US (1) US20230323541A1 (https=)
JP (1) JP7111410B1 (https=)
KR (1) KR102587691B1 (https=)
CN (1) CN116194618A (https=)
DE (1) DE112021005992T5 (https=)
MY (1) MY199940A (https=)
TW (1) TW202219320A (https=)
WO (1) WO2022102226A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117448800B (zh) * 2023-09-11 2025-12-26 广东利尔化学有限公司 一种镀铜液以及稳定剂
TW202518607A (zh) * 2023-10-30 2025-05-01 強茂股份有限公司 預成型封裝導線架的製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2721567A1 (de) * 1977-05-13 1978-11-16 Cannings Ltd W Loesung fuer die stromlose kupferplatierung
JPS53142328A (en) * 1977-05-17 1978-12-12 Canning & Co Ltd W Solution for nonnelectrolytic copper plating
JP3227504B2 (ja) * 1993-04-19 2001-11-12 奥野製薬工業株式会社 無電解銅めっき液
JP2007092111A (ja) * 2005-09-28 2007-04-12 Okuno Chem Ind Co Ltd めっき析出阻害用組成物
EP2034049A1 (en) * 2007-09-05 2009-03-11 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO An electroless process for depositing a metal on a non-catalytic substrate
JP6030848B2 (ja) * 2012-05-07 2016-11-24 上村工業株式会社 無電解銅めっき浴及び無電解銅めっき方法
JP5337276B1 (ja) * 2012-05-07 2013-11-06 鹿島建設株式会社 逆打ち工法用免震装置支持ユニット及びそれを使用した免震構造物の施工方法
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
TWI690619B (zh) * 2014-12-17 2020-04-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
KR101660520B1 (ko) * 2015-04-08 2016-09-29 한국생산기술연구원 구리 및 니켈의 연속 무전해 도금방법 및 이를 이용하여 제조된 도금층
US20170051411A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Electroless Silver Plating Bath and Method of Using the Same

Also Published As

Publication number Publication date
CN116194618A (zh) 2023-05-30
JP7111410B1 (ja) 2022-08-02
WO2022102226A1 (ja) 2022-05-19
KR20230011434A (ko) 2023-01-20
US20230323541A1 (en) 2023-10-12
JPWO2022102226A1 (https=) 2022-05-19
MY199940A (en) 2023-11-30
DE112021005992T5 (de) 2023-08-24
KR102587691B1 (ko) 2023-10-10

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