JPWO2022102226A1 - - Google Patents
Info
- Publication number
- JPWO2022102226A1 JPWO2022102226A1 JP2021572906A JP2021572906A JPWO2022102226A1 JP WO2022102226 A1 JPWO2022102226 A1 JP WO2022102226A1 JP 2021572906 A JP2021572906 A JP 2021572906A JP 2021572906 A JP2021572906 A JP 2021572906A JP WO2022102226 A1 JPWO2022102226 A1 JP WO2022102226A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020187294 | 2020-11-10 | ||
| JP2020187294 | 2020-11-10 | ||
| PCT/JP2021/032487 WO2022102226A1 (ja) | 2020-11-10 | 2021-09-03 | 無電解銅めっき液 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022102226A1 true JPWO2022102226A1 (https=) | 2022-05-19 |
| JP7111410B1 JP7111410B1 (ja) | 2022-08-02 |
| JPWO2022102226A5 JPWO2022102226A5 (https=) | 2022-10-21 |
Family
ID=81601091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021572906A Active JP7111410B1 (ja) | 2020-11-10 | 2021-09-03 | 無電解銅めっき液 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20230323541A1 (https=) |
| JP (1) | JP7111410B1 (https=) |
| KR (1) | KR102587691B1 (https=) |
| CN (1) | CN116194618A (https=) |
| DE (1) | DE112021005992T5 (https=) |
| MY (1) | MY199940A (https=) |
| TW (1) | TW202219320A (https=) |
| WO (1) | WO2022102226A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117448800B (zh) * | 2023-09-11 | 2025-12-26 | 广东利尔化学有限公司 | 一种镀铜液以及稳定剂 |
| TW202518607A (zh) * | 2023-10-30 | 2025-05-01 | 強茂股份有限公司 | 預成型封裝導線架的製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2721567A1 (de) * | 1977-05-13 | 1978-11-16 | Cannings Ltd W | Loesung fuer die stromlose kupferplatierung |
| JPS53142328A (en) * | 1977-05-17 | 1978-12-12 | Canning & Co Ltd W | Solution for nonnelectrolytic copper plating |
| JP3227504B2 (ja) * | 1993-04-19 | 2001-11-12 | 奥野製薬工業株式会社 | 無電解銅めっき液 |
| JP2007092111A (ja) * | 2005-09-28 | 2007-04-12 | Okuno Chem Ind Co Ltd | めっき析出阻害用組成物 |
| EP2034049A1 (en) * | 2007-09-05 | 2009-03-11 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | An electroless process for depositing a metal on a non-catalytic substrate |
| JP6030848B2 (ja) * | 2012-05-07 | 2016-11-24 | 上村工業株式会社 | 無電解銅めっき浴及び無電解銅めっき方法 |
| JP5337276B1 (ja) * | 2012-05-07 | 2013-11-06 | 鹿島建設株式会社 | 逆打ち工法用免震装置支持ユニット及びそれを使用した免震構造物の施工方法 |
| EP2784181B1 (en) * | 2013-03-27 | 2015-12-09 | ATOTECH Deutschland GmbH | Electroless copper plating solution |
| TWI690619B (zh) * | 2014-12-17 | 2020-04-11 | 德商德國艾托特克公司 | 鈀之電鍍浴組合物及無電電鍍方法 |
| KR101660520B1 (ko) * | 2015-04-08 | 2016-09-29 | 한국생산기술연구원 | 구리 및 니켈의 연속 무전해 도금방법 및 이를 이용하여 제조된 도금층 |
| US20170051411A1 (en) * | 2015-08-20 | 2017-02-23 | Macdermid Acumen, Inc. | Electroless Silver Plating Bath and Method of Using the Same |
-
2021
- 2021-09-03 WO PCT/JP2021/032487 patent/WO2022102226A1/ja not_active Ceased
- 2021-09-03 CN CN202180060016.XA patent/CN116194618A/zh active Pending
- 2021-09-03 DE DE112021005992.0T patent/DE112021005992T5/de active Pending
- 2021-09-03 KR KR1020227045941A patent/KR102587691B1/ko active Active
- 2021-09-03 JP JP2021572906A patent/JP7111410B1/ja active Active
- 2021-09-03 US US18/035,806 patent/US20230323541A1/en not_active Abandoned
- 2021-09-03 MY MYPI2023001353A patent/MY199940A/en unknown
- 2021-09-07 TW TW110133195A patent/TW202219320A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN116194618A (zh) | 2023-05-30 |
| JP7111410B1 (ja) | 2022-08-02 |
| WO2022102226A1 (ja) | 2022-05-19 |
| KR20230011434A (ko) | 2023-01-20 |
| US20230323541A1 (en) | 2023-10-12 |
| TW202219320A (zh) | 2022-05-16 |
| MY199940A (en) | 2023-11-30 |
| DE112021005992T5 (de) | 2023-08-24 |
| KR102587691B1 (ko) | 2023-10-10 |
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