JP7111410B1 - 無電解銅めっき液 - Google Patents

無電解銅めっき液 Download PDF

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Publication number
JP7111410B1
JP7111410B1 JP2021572906A JP2021572906A JP7111410B1 JP 7111410 B1 JP7111410 B1 JP 7111410B1 JP 2021572906 A JP2021572906 A JP 2021572906A JP 2021572906 A JP2021572906 A JP 2021572906A JP 7111410 B1 JP7111410 B1 JP 7111410B1
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Japan
Prior art keywords
copper plating
electroless copper
plating solution
solution
tellurium
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JP2021572906A
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English (en)
Japanese (ja)
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JPWO2022102226A1 (https=
JPWO2022102226A5 (https=
Inventor
義人 塚原
優希 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meltex Inc
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Meltex Inc
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Publication of JPWO2022102226A5 publication Critical patent/JPWO2022102226A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP2021572906A 2020-11-10 2021-09-03 無電解銅めっき液 Active JP7111410B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020187294 2020-11-10
JP2020187294 2020-11-10
PCT/JP2021/032487 WO2022102226A1 (ja) 2020-11-10 2021-09-03 無電解銅めっき液

Publications (3)

Publication Number Publication Date
JPWO2022102226A1 JPWO2022102226A1 (https=) 2022-05-19
JP7111410B1 true JP7111410B1 (ja) 2022-08-02
JPWO2022102226A5 JPWO2022102226A5 (https=) 2022-10-21

Family

ID=81601091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021572906A Active JP7111410B1 (ja) 2020-11-10 2021-09-03 無電解銅めっき液

Country Status (8)

Country Link
US (1) US20230323541A1 (https=)
JP (1) JP7111410B1 (https=)
KR (1) KR102587691B1 (https=)
CN (1) CN116194618A (https=)
DE (1) DE112021005992T5 (https=)
MY (1) MY199940A (https=)
TW (1) TW202219320A (https=)
WO (1) WO2022102226A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117448800B (zh) * 2023-09-11 2025-12-26 广东利尔化学有限公司 一种镀铜液以及稳定剂
TW202518607A (zh) * 2023-10-30 2025-05-01 強茂股份有限公司 預成型封裝導線架的製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53142328A (en) * 1977-05-17 1978-12-12 Canning & Co Ltd W Solution for nonnelectrolytic copper plating
JPH06306622A (ja) * 1993-04-19 1994-11-01 Okuno Chem Ind Co Ltd 無電解銅めっき液
JP2010538166A (ja) * 2007-09-05 2010-12-09 ネーデルランドセ オルガニサティエ フォール トエゲパストナトールヴェテンシャッペリク オンデルゾエク ティエヌオー 非触媒作用的基体に金属を沈着させるための無電解法
JP2013234343A (ja) * 2012-05-07 2013-11-21 C Uyemura & Co Ltd 無電解銅めっき浴及び無電解銅めっき方法
JP2016517914A (ja) * 2013-03-27 2016-06-20 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 無電解銅めっき溶液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2721567A1 (de) * 1977-05-13 1978-11-16 Cannings Ltd W Loesung fuer die stromlose kupferplatierung
JP2007092111A (ja) * 2005-09-28 2007-04-12 Okuno Chem Ind Co Ltd めっき析出阻害用組成物
JP5337276B1 (ja) * 2012-05-07 2013-11-06 鹿島建設株式会社 逆打ち工法用免震装置支持ユニット及びそれを使用した免震構造物の施工方法
CN107002242B (zh) * 2014-12-17 2020-02-11 埃托特克德国有限公司 用于化学镀钯的镀浴组合物和方法
KR101660520B1 (ko) * 2015-04-08 2016-09-29 한국생산기술연구원 구리 및 니켈의 연속 무전해 도금방법 및 이를 이용하여 제조된 도금층
US20170051411A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Electroless Silver Plating Bath and Method of Using the Same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53142328A (en) * 1977-05-17 1978-12-12 Canning & Co Ltd W Solution for nonnelectrolytic copper plating
JPH06306622A (ja) * 1993-04-19 1994-11-01 Okuno Chem Ind Co Ltd 無電解銅めっき液
JP2010538166A (ja) * 2007-09-05 2010-12-09 ネーデルランドセ オルガニサティエ フォール トエゲパストナトールヴェテンシャッペリク オンデルゾエク ティエヌオー 非触媒作用的基体に金属を沈着させるための無電解法
JP2013234343A (ja) * 2012-05-07 2013-11-21 C Uyemura & Co Ltd 無電解銅めっき浴及び無電解銅めっき方法
JP2016517914A (ja) * 2013-03-27 2016-06-20 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 無電解銅めっき溶液

Also Published As

Publication number Publication date
MY199940A (en) 2023-11-30
JPWO2022102226A1 (https=) 2022-05-19
TW202219320A (zh) 2022-05-16
DE112021005992T5 (de) 2023-08-24
WO2022102226A1 (ja) 2022-05-19
KR20230011434A (ko) 2023-01-20
US20230323541A1 (en) 2023-10-12
KR102587691B1 (ko) 2023-10-10
CN116194618A (zh) 2023-05-30

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