JPWO2022102226A5 - - Google Patents
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- Publication number
- JPWO2022102226A5 JPWO2022102226A5 JP2021572906A JP2021572906A JPWO2022102226A5 JP WO2022102226 A5 JPWO2022102226 A5 JP WO2022102226A5 JP 2021572906 A JP2021572906 A JP 2021572906A JP 2021572906 A JP2021572906 A JP 2021572906A JP WO2022102226 A5 JPWO2022102226 A5 JP WO2022102226A5
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- tellurium
- borane
- copper plating
- electroless copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 14
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 6
- 229910001431 copper ion Inorganic materials 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 5
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 4
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 4
- 239000002738 chelating agent Substances 0.000 claims description 4
- 239000008139 complexing agent Substances 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 4
- 229910052714 tellurium Inorganic materials 0.000 claims description 4
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 4
- 150000003498 tellurium compounds Chemical class 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
- 150000001412 amines Chemical group 0.000 claims description 2
- 229910000085 borane Inorganic materials 0.000 claims description 2
- VDTVZBCTOQDZSH-UHFFFAOYSA-N borane N-ethylethanamine Chemical compound B.CCNCC VDTVZBCTOQDZSH-UHFFFAOYSA-N 0.000 claims description 2
- GKFJEDWZQZKYHV-UHFFFAOYSA-N borane;2-methylpropan-2-amine Chemical compound B.CC(C)(C)N GKFJEDWZQZKYHV-UHFFFAOYSA-N 0.000 claims description 2
- WVMHLYQJPRXKLC-UHFFFAOYSA-N borane;n,n-dimethylmethanamine Chemical compound B.CN(C)C WVMHLYQJPRXKLC-UHFFFAOYSA-N 0.000 claims description 2
- VEWFZHAHZPVQES-UHFFFAOYSA-N boron;n,n-diethylethanamine Chemical compound [B].CCN(CC)CC VEWFZHAHZPVQES-UHFFFAOYSA-N 0.000 claims description 2
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 claims description 2
- 150000001879 copper Chemical class 0.000 claims description 2
- YMUZFVVKDBZHGP-UHFFFAOYSA-N dimethyl telluride Chemical compound C[Te]C YMUZFVVKDBZHGP-UHFFFAOYSA-N 0.000 claims description 2
- 230000007935 neutral effect Effects 0.000 claims description 2
- -1 nitrogen-containing aromatic compound Chemical class 0.000 claims description 2
- FXADMRZICBQPQY-UHFFFAOYSA-N orthotelluric acid Chemical compound O[Te](O)(O)(O)(O)O FXADMRZICBQPQY-UHFFFAOYSA-N 0.000 claims description 2
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 claims description 2
- IIXQANVWKBCLEB-UHFFFAOYSA-N tellurium trioxide Chemical compound O=[Te](=O)=O IIXQANVWKBCLEB-UHFFFAOYSA-N 0.000 claims description 2
- SITVSCPRJNYAGV-UHFFFAOYSA-N tellurous acid Chemical compound O[Te](O)=O SITVSCPRJNYAGV-UHFFFAOYSA-N 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 239000003945 anionic surfactant Substances 0.000 claims 1
- 150000001491 aromatic compounds Chemical class 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020187294 | 2020-11-10 | ||
| JP2020187294 | 2020-11-10 | ||
| PCT/JP2021/032487 WO2022102226A1 (ja) | 2020-11-10 | 2021-09-03 | 無電解銅めっき液 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022102226A1 JPWO2022102226A1 (https=) | 2022-05-19 |
| JP7111410B1 JP7111410B1 (ja) | 2022-08-02 |
| JPWO2022102226A5 true JPWO2022102226A5 (https=) | 2022-10-21 |
Family
ID=81601091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021572906A Active JP7111410B1 (ja) | 2020-11-10 | 2021-09-03 | 無電解銅めっき液 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20230323541A1 (https=) |
| JP (1) | JP7111410B1 (https=) |
| KR (1) | KR102587691B1 (https=) |
| CN (1) | CN116194618A (https=) |
| DE (1) | DE112021005992T5 (https=) |
| MY (1) | MY199940A (https=) |
| TW (1) | TW202219320A (https=) |
| WO (1) | WO2022102226A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117448800B (zh) * | 2023-09-11 | 2025-12-26 | 广东利尔化学有限公司 | 一种镀铜液以及稳定剂 |
| TW202518607A (zh) * | 2023-10-30 | 2025-05-01 | 強茂股份有限公司 | 預成型封裝導線架的製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2721567A1 (de) * | 1977-05-13 | 1978-11-16 | Cannings Ltd W | Loesung fuer die stromlose kupferplatierung |
| JPS53142328A (en) * | 1977-05-17 | 1978-12-12 | Canning & Co Ltd W | Solution for nonnelectrolytic copper plating |
| JP3227504B2 (ja) * | 1993-04-19 | 2001-11-12 | 奥野製薬工業株式会社 | 無電解銅めっき液 |
| JP2007092111A (ja) * | 2005-09-28 | 2007-04-12 | Okuno Chem Ind Co Ltd | めっき析出阻害用組成物 |
| EP2034049A1 (en) * | 2007-09-05 | 2009-03-11 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | An electroless process for depositing a metal on a non-catalytic substrate |
| JP6030848B2 (ja) * | 2012-05-07 | 2016-11-24 | 上村工業株式会社 | 無電解銅めっき浴及び無電解銅めっき方法 |
| JP5337276B1 (ja) * | 2012-05-07 | 2013-11-06 | 鹿島建設株式会社 | 逆打ち工法用免震装置支持ユニット及びそれを使用した免震構造物の施工方法 |
| EP2784181B1 (en) * | 2013-03-27 | 2015-12-09 | ATOTECH Deutschland GmbH | Electroless copper plating solution |
| CN107002242B (zh) * | 2014-12-17 | 2020-02-11 | 埃托特克德国有限公司 | 用于化学镀钯的镀浴组合物和方法 |
| KR101660520B1 (ko) * | 2015-04-08 | 2016-09-29 | 한국생산기술연구원 | 구리 및 니켈의 연속 무전해 도금방법 및 이를 이용하여 제조된 도금층 |
| US20170051411A1 (en) * | 2015-08-20 | 2017-02-23 | Macdermid Acumen, Inc. | Electroless Silver Plating Bath and Method of Using the Same |
-
2021
- 2021-09-03 US US18/035,806 patent/US20230323541A1/en not_active Abandoned
- 2021-09-03 CN CN202180060016.XA patent/CN116194618A/zh active Pending
- 2021-09-03 WO PCT/JP2021/032487 patent/WO2022102226A1/ja not_active Ceased
- 2021-09-03 DE DE112021005992.0T patent/DE112021005992T5/de active Pending
- 2021-09-03 KR KR1020227045941A patent/KR102587691B1/ko active Active
- 2021-09-03 JP JP2021572906A patent/JP7111410B1/ja active Active
- 2021-09-03 MY MYPI2023001353A patent/MY199940A/en unknown
- 2021-09-07 TW TW110133195A patent/TW202219320A/zh unknown
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