JP5368442B2 - 還元型無電解スズめっき液及びそれを用いたスズ皮膜 - Google Patents
還元型無電解スズめっき液及びそれを用いたスズ皮膜 Download PDFInfo
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- JP5368442B2 JP5368442B2 JP2010517905A JP2010517905A JP5368442B2 JP 5368442 B2 JP5368442 B2 JP 5368442B2 JP 2010517905 A JP2010517905 A JP 2010517905A JP 2010517905 A JP2010517905 A JP 2010517905A JP 5368442 B2 JP5368442 B2 JP 5368442B2
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- JP
- Japan
- Prior art keywords
- acid
- tin
- plating solution
- tin plating
- reduced electroless
- Prior art date
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 127
- 238000007747 plating Methods 0.000 title claims description 109
- 239000011248 coating agent Substances 0.000 title claims description 3
- 238000000576 coating method Methods 0.000 title claims description 3
- -1 inorganic acid salt Chemical class 0.000 claims description 21
- 239000002253 acid Substances 0.000 claims description 18
- 150000003609 titanium compounds Chemical class 0.000 claims description 13
- 239000008139 complexing agent Substances 0.000 claims description 11
- 150000003606 tin compounds Chemical class 0.000 claims description 11
- 150000003568 thioethers Chemical class 0.000 claims description 9
- 125000003277 amino group Chemical group 0.000 claims description 8
- 150000002898 organic sulfur compounds Chemical class 0.000 claims description 8
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 7
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- ONJROLGQWMBXAP-UHFFFAOYSA-N 2-methyl-1-(2-methylpropyldisulfanyl)propane Chemical compound CC(C)CSSCC(C)C ONJROLGQWMBXAP-UHFFFAOYSA-N 0.000 claims description 4
- OGBVRMYSNSKIEF-UHFFFAOYSA-N Benzylphosphonic acid Chemical compound OP(O)(=O)CC1=CC=CC=C1 OGBVRMYSNSKIEF-UHFFFAOYSA-N 0.000 claims description 4
- CETBSQOFQKLHHZ-UHFFFAOYSA-N Diethyl disulfide Chemical compound CCSSCC CETBSQOFQKLHHZ-UHFFFAOYSA-N 0.000 claims description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 4
- QLZHNIAADXEJJP-UHFFFAOYSA-N Phenylphosphonic acid Chemical compound OP(O)(=O)C1=CC=CC=C1 QLZHNIAADXEJJP-UHFFFAOYSA-N 0.000 claims description 4
- AUYOHNUMSAGWQZ-UHFFFAOYSA-L dihydroxy(oxo)tin Chemical compound O[Sn](O)=O AUYOHNUMSAGWQZ-UHFFFAOYSA-L 0.000 claims description 4
- WQOXQRCZOLPYPM-UHFFFAOYSA-N dimethyl disulfide Chemical compound CSSC WQOXQRCZOLPYPM-UHFFFAOYSA-N 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 4
- YMAWOPBAYDPSLA-UHFFFAOYSA-N glycylglycine Chemical compound [NH3+]CC(=O)NCC([O-])=O YMAWOPBAYDPSLA-UHFFFAOYSA-N 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- SUVIGLJNEAMWEG-UHFFFAOYSA-N propane-1-thiol Chemical compound CCCS SUVIGLJNEAMWEG-UHFFFAOYSA-N 0.000 claims description 4
- YONPGGFAJWQGJC-UHFFFAOYSA-K titanium(iii) chloride Chemical group Cl[Ti](Cl)Cl YONPGGFAJWQGJC-UHFFFAOYSA-K 0.000 claims description 4
- BJDDAXVXMQYXHL-UHFFFAOYSA-J tris(ethylsulfonyloxy)stannyl ethanesulfonate Chemical compound [Sn+4].CCS([O-])(=O)=O.CCS([O-])(=O)=O.CCS([O-])(=O)=O.CCS([O-])(=O)=O BJDDAXVXMQYXHL-UHFFFAOYSA-J 0.000 claims description 4
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 claims description 3
- QJDRJTFSPVQEDV-UHFFFAOYSA-N 2-methylbutanethioic s-acid Chemical compound CCC(C)C(O)=S QJDRJTFSPVQEDV-UHFFFAOYSA-N 0.000 claims description 3
- YWHLKYXPLRWGSE-UHFFFAOYSA-N Dimethyl trisulfide Chemical compound CSSSC YWHLKYXPLRWGSE-UHFFFAOYSA-N 0.000 claims description 3
- 150000007513 acids Chemical class 0.000 claims description 3
- 150000007942 carboxylates Chemical class 0.000 claims description 3
- 150000001735 carboxylic acids Chemical class 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 claims description 3
- GPWILPBSXYXSMN-UHFFFAOYSA-J propane-1-sulfonate;tin(4+) Chemical compound [Sn+4].CCCS([O-])(=O)=O.CCCS([O-])(=O)=O.CCCS([O-])(=O)=O.CCCS([O-])(=O)=O GPWILPBSXYXSMN-UHFFFAOYSA-J 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 239000001119 stannous chloride Substances 0.000 claims description 3
- 235000011150 stannous chloride Nutrition 0.000 claims description 3
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 claims description 3
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 3
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims description 3
- VCVKIIDXVWEWSZ-YFKPBYRVSA-N (2s)-2-[bis(carboxymethyl)amino]pentanedioic acid Chemical compound OC(=O)CC[C@@H](C(O)=O)N(CC(O)=O)CC(O)=O VCVKIIDXVWEWSZ-YFKPBYRVSA-N 0.000 claims description 2
- HPQZCEPKZPFYLA-UHFFFAOYSA-N (3-methoxyphenyl)phosphonic acid Chemical compound COC1=CC=CC(P(O)(O)=O)=C1 HPQZCEPKZPFYLA-UHFFFAOYSA-N 0.000 claims description 2
- YSZXYVIDVAUMLH-UHFFFAOYSA-N (3-methylphenyl)methylphosphonic acid Chemical compound CC1=CC=CC(CP(O)(O)=O)=C1 YSZXYVIDVAUMLH-UHFFFAOYSA-N 0.000 claims description 2
- BWOBUEFDJCJUMO-UHFFFAOYSA-N (4-cyanophenyl)methylphosphonic acid Chemical compound OP(O)(=O)CC1=CC=C(C#N)C=C1 BWOBUEFDJCJUMO-UHFFFAOYSA-N 0.000 claims description 2
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 claims description 2
- YGKHJWTVMIMEPQ-UHFFFAOYSA-N 1,2-propanedithiol Chemical compound CC(S)CS YGKHJWTVMIMEPQ-UHFFFAOYSA-N 0.000 claims description 2
- OQBLGYCUQGDOOR-UHFFFAOYSA-L 1,3,2$l^{2}-dioxastannolane-4,5-dione Chemical compound O=C1O[Sn]OC1=O OQBLGYCUQGDOOR-UHFFFAOYSA-L 0.000 claims description 2
- VHJLVAABSRFDPM-UHFFFAOYSA-N 1,4-dithiothreitol Chemical compound SCC(O)C(O)CS VHJLVAABSRFDPM-UHFFFAOYSA-N 0.000 claims description 2
- SRZXCOWFGPICGA-UHFFFAOYSA-N 1,6-Hexanedithiol Chemical compound SCCCCCCS SRZXCOWFGPICGA-UHFFFAOYSA-N 0.000 claims description 2
- XJIRSLHMKBUGMR-UHFFFAOYSA-N 1-ethylsulfanylbutane Chemical compound CCCCSCC XJIRSLHMKBUGMR-UHFFFAOYSA-N 0.000 claims description 2
- AMNLXDDJGGTIPL-UHFFFAOYSA-N 2,4-dimethylbenzenethiol Chemical compound CC1=CC=C(S)C(C)=C1 AMNLXDDJGGTIPL-UHFFFAOYSA-N 0.000 claims description 2
- RFCQDOVPMUSZMN-UHFFFAOYSA-N 2-Naphthalenethiol Chemical compound C1=CC=CC2=CC(S)=CC=C21 RFCQDOVPMUSZMN-UHFFFAOYSA-N 0.000 claims description 2
- GEZAUFNYMZVOFV-UHFFFAOYSA-J 2-[(2-oxo-1,3,2$l^{5},4$l^{2}-dioxaphosphastannetan-2-yl)oxy]-1,3,2$l^{5},4$l^{2}-dioxaphosphastannetane 2-oxide Chemical compound [Sn+2].[Sn+2].[O-]P([O-])(=O)OP([O-])([O-])=O GEZAUFNYMZVOFV-UHFFFAOYSA-J 0.000 claims description 2
- DMQQXDPCRUGSQB-UHFFFAOYSA-N 2-[3-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)CCCN(CC(O)=O)CC(O)=O DMQQXDPCRUGSQB-UHFFFAOYSA-N 0.000 claims description 2
- VRVRGVPWCUEOGV-UHFFFAOYSA-N 2-aminothiophenol Chemical compound NC1=CC=CC=C1S VRVRGVPWCUEOGV-UHFFFAOYSA-N 0.000 claims description 2
- TZJOZPSXXJFEGN-UHFFFAOYSA-N 2-hydroxyethanesulfonic acid;tin Chemical compound [Sn].OCCS(O)(=O)=O TZJOZPSXXJFEGN-UHFFFAOYSA-N 0.000 claims description 2
- DGBISJKLNVVJGD-UHFFFAOYSA-N 2-phenylsulfanylaniline Chemical compound NC1=CC=CC=C1SC1=CC=CC=C1 DGBISJKLNVVJGD-UHFFFAOYSA-N 0.000 claims description 2
- IWTIBPIVCKUAHK-UHFFFAOYSA-N 3-[bis(2-carboxyethyl)amino]propanoic acid Chemical compound OC(=O)CCN(CCC(O)=O)CCC(O)=O IWTIBPIVCKUAHK-UHFFFAOYSA-N 0.000 claims description 2
- USYAMXSCYLGBPT-UHFFFAOYSA-L 3-carboxy-3-hydroxypentanedioate;tin(2+) Chemical compound [Sn+2].OC(=O)CC(O)(C([O-])=O)CC([O-])=O USYAMXSCYLGBPT-UHFFFAOYSA-L 0.000 claims description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 2
- HTIRHQRTDBPHNZ-UHFFFAOYSA-N Dibutyl sulfide Chemical compound CCCCSCCCC HTIRHQRTDBPHNZ-UHFFFAOYSA-N 0.000 claims description 2
- 229940120146 EDTMP Drugs 0.000 claims description 2
- CJQWLNNCQIHKHP-UHFFFAOYSA-N Ethyl 3-mercaptopropanoic acid Chemical compound CCOC(=O)CCS CJQWLNNCQIHKHP-UHFFFAOYSA-N 0.000 claims description 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 2
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004471 Glycine Substances 0.000 claims description 2
- 108010008488 Glycylglycine Proteins 0.000 claims description 2
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 claims description 2
- FFEARJCKVFRZRR-BYPYZUCNSA-N L-methionine Chemical compound CSCC[C@H](N)C(O)=O FFEARJCKVFRZRR-BYPYZUCNSA-N 0.000 claims description 2
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 claims description 2
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims description 2
- JYXGIOKAKDAARW-UHFFFAOYSA-N N-(2-hydroxyethyl)iminodiacetic acid Chemical compound OCCN(CC(O)=O)CC(O)=O JYXGIOKAKDAARW-UHFFFAOYSA-N 0.000 claims description 2
- CUENHRAPIDGBGB-UHFFFAOYSA-N OC(C)S(=O)(=O)O.[Sn] Chemical compound OC(C)S(=O)(=O)O.[Sn] CUENHRAPIDGBGB-UHFFFAOYSA-N 0.000 claims description 2
- APTGPWJUOYMUCE-UHFFFAOYSA-N S-Ethyl thioacetate Chemical compound CCSC(C)=O APTGPWJUOYMUCE-UHFFFAOYSA-N 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 claims description 2
- KIDJHPQACZGFTI-UHFFFAOYSA-N [6-[bis(phosphonomethyl)amino]hexyl-(phosphonomethyl)amino]methylphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCCCCCN(CP(O)(O)=O)CP(O)(O)=O KIDJHPQACZGFTI-UHFFFAOYSA-N 0.000 claims description 2
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims description 2
- KCRVWSQOWCAOND-UHFFFAOYSA-N [Sn].OC(CC)S(=O)(=O)O Chemical compound [Sn].OC(CC)S(=O)(=O)O KCRVWSQOWCAOND-UHFFFAOYSA-N 0.000 claims description 2
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 2
- PPQNMKIMOCEJIR-UHFFFAOYSA-N benzene-1,2,3-trithiol Chemical compound SC1=CC=CC(S)=C1S PPQNMKIMOCEJIR-UHFFFAOYSA-N 0.000 claims description 2
- SMTOKHQOVJRXLK-UHFFFAOYSA-N butane-1,4-dithiol Chemical compound SCCCCS SMTOKHQOVJRXLK-UHFFFAOYSA-N 0.000 claims description 2
- WQAQPCDUOCURKW-UHFFFAOYSA-N butanethiol Chemical compound CCCCS WQAQPCDUOCURKW-UHFFFAOYSA-N 0.000 claims description 2
- UFULAYFCSOUIOV-UHFFFAOYSA-N cysteamine Chemical compound NCCS UFULAYFCSOUIOV-UHFFFAOYSA-N 0.000 claims description 2
- 229940090960 diethylenetriamine pentamethylene phosphonic acid Drugs 0.000 claims description 2
- DUYCTCQXNHFCSJ-UHFFFAOYSA-N dtpmp Chemical compound OP(=O)(O)CN(CP(O)(O)=O)CCN(CP(O)(=O)O)CCN(CP(O)(O)=O)CP(O)(O)=O DUYCTCQXNHFCSJ-UHFFFAOYSA-N 0.000 claims description 2
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 claims description 2
- 229960002989 glutamic acid Drugs 0.000 claims description 2
- 235000013922 glutamic acid Nutrition 0.000 claims description 2
- 239000004220 glutamic acid Substances 0.000 claims description 2
- 229940043257 glycylglycine Drugs 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 2
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 2
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 claims description 2
- 229930182817 methionine Natural products 0.000 claims description 2
- PJUIMOJAAPLTRJ-UHFFFAOYSA-N monothioglycerol Chemical compound OCC(O)CS PJUIMOJAAPLTRJ-UHFFFAOYSA-N 0.000 claims description 2
- DCKVFVYPWDKYDN-UHFFFAOYSA-L oxygen(2-);titanium(4+);sulfate Chemical compound [O-2].[Ti+4].[O-]S([O-])(=O)=O DCKVFVYPWDKYDN-UHFFFAOYSA-L 0.000 claims description 2
- KMTUBAIXCBHPIZ-UHFFFAOYSA-N pentane-1,5-dithiol Chemical compound SCCCCCS KMTUBAIXCBHPIZ-UHFFFAOYSA-N 0.000 claims description 2
- 229960003330 pentetic acid Drugs 0.000 claims description 2
- WHMDPDGBKYUEMW-UHFFFAOYSA-N pyridine-2-thiol Chemical compound SC1=CC=CC=N1 WHMDPDGBKYUEMW-UHFFFAOYSA-N 0.000 claims description 2
- DPCQJLQPDJPRCM-UHFFFAOYSA-N s-acetyl ethanethioate Chemical compound CC(=O)SC(C)=O DPCQJLQPDJPRCM-UHFFFAOYSA-N 0.000 claims description 2
- 150000003573 thiols Chemical class 0.000 claims description 2
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 claims description 2
- CVNKFOIOZXAFBO-UHFFFAOYSA-J tin(4+);tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Sn+4] CVNKFOIOZXAFBO-UHFFFAOYSA-J 0.000 claims description 2
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 2
- ALHBQZRUBQFZQV-UHFFFAOYSA-N tin;tetrahydrate Chemical compound O.O.O.O.[Sn] ALHBQZRUBQFZQV-UHFFFAOYSA-N 0.000 claims description 2
- 229910000348 titanium sulfate Inorganic materials 0.000 claims description 2
- MTAYDNKNMILFOK-UHFFFAOYSA-K titanium(3+);tribromide Chemical compound Br[Ti](Br)Br MTAYDNKNMILFOK-UHFFFAOYSA-K 0.000 claims description 2
- HUYLAMJIPCOVOM-UHFFFAOYSA-K triiodotitanium Chemical compound [Ti+3].[I-].[I-].[I-] HUYLAMJIPCOVOM-UHFFFAOYSA-K 0.000 claims description 2
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 claims 3
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims 2
- OATSQCXMYKYFQO-UHFFFAOYSA-N S-methyl thioacetate Chemical compound CSC(C)=O OATSQCXMYKYFQO-UHFFFAOYSA-N 0.000 claims 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- WJNDFCWJGSZCFD-UHFFFAOYSA-N [Sn].OCCCS(=O)(=O)O Chemical compound [Sn].OCCCS(=O)(=O)O WJNDFCWJGSZCFD-UHFFFAOYSA-N 0.000 claims 1
- RUSUZAGBORAKPY-UHFFFAOYSA-N acetic acid;n'-[2-(2-aminoethylamino)ethyl]ethane-1,2-diamine Chemical compound CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O.NCCNCCNCCN RUSUZAGBORAKPY-UHFFFAOYSA-N 0.000 claims 1
- 229940008075 allyl sulfide Drugs 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 30
- 229910052802 copper Inorganic materials 0.000 description 30
- 239000010949 copper Substances 0.000 description 30
- 230000008021 deposition Effects 0.000 description 15
- 229910000881 Cu alloy Inorganic materials 0.000 description 14
- 239000002585 base Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 238000010828 elution Methods 0.000 description 11
- 238000005259 measurement Methods 0.000 description 7
- 238000006467 substitution reaction Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000002736 nonionic surfactant Substances 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 230000004913 activation Effects 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 235000006708 antioxidants Nutrition 0.000 description 4
- 239000000872 buffer Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000002280 amphoteric surfactant Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000006722 reduction reaction Methods 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
- UBJVUCKUDDKUJF-UHFFFAOYSA-N Diallyl sulfide Chemical compound C=CCSCC=C UBJVUCKUDDKUJF-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
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- BXRFQSNOROATLV-UHFFFAOYSA-N 4-nitrobenzaldehyde Chemical compound [O-][N+](=O)C1=CC=C(C=O)C=C1 BXRFQSNOROATLV-UHFFFAOYSA-N 0.000 description 1
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- MQAAVJSLMCQBIX-UHFFFAOYSA-N C(CCC)C=1C(=C(C2=CC=CC=C2C=1)CCCC)O Chemical compound C(CCC)C=1C(=C(C2=CC=CC=C2C=1)CCCC)O MQAAVJSLMCQBIX-UHFFFAOYSA-N 0.000 description 1
- RRGWLHMMDIOLAD-UHFFFAOYSA-N CCCCCCCCCCCCC(CC([O-])=O)([N+]1=CNC=C1)O Chemical compound CCCCCCCCCCCCC(CC([O-])=O)([N+]1=CNC=C1)O RRGWLHMMDIOLAD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- 150000008051 alkyl sulfates Chemical class 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- SYELZBGXAIXKHU-UHFFFAOYSA-N dodecyldimethylamine N-oxide Chemical compound CCCCCCCCCCCC[N+](C)(C)[O-] SYELZBGXAIXKHU-UHFFFAOYSA-N 0.000 description 1
- VICYBMUVWHJEFT-UHFFFAOYSA-N dodecyltrimethylammonium ion Chemical class CCCCCCCCCCCC[N+](C)(C)C VICYBMUVWHJEFT-UHFFFAOYSA-N 0.000 description 1
- 125000004705 ethylthio group Chemical group C(C)S* 0.000 description 1
- NHEPKQDGPJQVOO-UHFFFAOYSA-N hex-1-yn-1-amine Chemical compound CCCCC#CN NHEPKQDGPJQVOO-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- YWFWDNVOPHGWMX-UHFFFAOYSA-N n,n-dimethyldodecan-1-amine Chemical compound CCCCCCCCCCCCN(C)C YWFWDNVOPHGWMX-UHFFFAOYSA-N 0.000 description 1
- UPHWVVKYDQHTCF-UHFFFAOYSA-N octadecylazanium;acetate Chemical compound CC(O)=O.CCCCCCCCCCCCCCCCCCN UPHWVVKYDQHTCF-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- KOODSCBKXPPKHE-UHFFFAOYSA-N propanethioic s-acid Chemical compound CCC(S)=O KOODSCBKXPPKHE-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- BWHOZHOGCMHOBV-BQYQJAHWSA-N trans-benzylideneacetone Chemical compound CC(=O)\C=C\C1=CC=CC=C1 BWHOZHOGCMHOBV-BQYQJAHWSA-N 0.000 description 1
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 1
Images
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-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
カチオン界面活性剤としては、ラウリルトリメチルアンモニウム塩、ラウリルジメチルアンモニウムベタイン、ラウリルピリジニウム塩、オレイルイミダゾリウム塩又はステアリルアミンアセテート等が挙げられる。
0.1dm2の純銅板5枚を同時に、PAC200(ムラタ株式会社製 商品名)を使用して、50℃で5分間脱脂処理を行い、その後水洗した。次いで、MEOX(ムラタ株式会社製 商品名)を使用して、30℃で2分間エッチング処理を行い、その後水洗した。次いで、10容量%の希硫酸を使用して、25℃で30秒間酸洗浄を行い、その後水洗した。次いで、JPCAT(日本高純度化学株式会社製 商品名)を使用して、65℃で2分間活性化処理を行って、その後水洗した。
下地の銅溶出量の測定により、置換反応の有無を確認した。上記のめっき処理後に、めっき液をICPプラズマ発行分光分析装置SPS 3000(セイコーインスツルメンツ株式会社製)を使用し、常法に従って、めっき液中の銅溶出量(銅検出濃度)を測定した。測定の結果、銅が検出される場合には、銅の溶解が起こりファインパターンにめっき処理すると断線する可能性があることから「不良」とし、銅の検出が見られないものは「良」と判定し、測定結果を表3に、判定結果を表4に示す。
「はみ出しの有無」と「析出速度」は、図1に概略を示す基板(以下、「BGAテスト用基板」という)に無電解スズめっきを行って測定した。BGAテスト用基板1枚を、PAC200(ムラタ株式会社製 商品名)を使用して、50℃で5分間脱脂処理を行い、その後水洗した。次いで、MEOX(ムラタ株式会社製 商品名)を使用して、30℃で2分間エッチング処理を行い、その後水洗した。次いで、10容量%の希硫酸を使用して、25℃で30秒間酸洗浄を行い、その後水洗した。次いで、JPCAT(日本高純度化学株式会社製 商品名)を使用して、65℃で2分間活性化処理を行って、その後水洗した。
BGAテスト用基板へのめっきテストにより、100μmピッチパターンでのスズのはみ出しの有無を測定した。「はみ出しの有無」は、光学顕微鏡を用いて目視で行った。はみ出しの見られるものを不良、はみ出しの見られないものを良と判定し、測定結果を表3に、判定結果を表4に示す。
「析出速度」は、スズ皮膜が形成されたBGAテスト用基板の膜厚測定用パッドについて、蛍光X線分析装置SFT9255(セイコーインスツルメンツ株式会社製)を使用して、常法に従ってスズ皮膜の厚さを測定し、スズの析出速度が5μm/1時間以上の析出速度が出るものを産業上非常に有用であるとして良とし、スズの析出速度が5μm/1時間未満のものは析出速度が遅く産業上有用でないものとして不良として、測定結果を表3に、判定結果を表4に示す。
Claims (14)
- 少なくとも、水溶性のスズ化合物、還元剤としての3価の水溶性のチタン化合物、有機錯化剤、並びに、メルカプタン類及びスルフィド類からなる群より選ばれる有機イオウ化合物を構成成分とすることを特徴とする還元型無電解スズめっき液。
- 該水溶性のスズ化合物が、スズの、無機酸塩、カルボン酸塩、アルカンスルホン酸塩、アルカノールスルホン酸塩、水酸化物及びメタスズ酸からなる群より選ばれる1種又は2種以上である請求項1に記載の還元型無電解スズめっき液。
- 該水溶性スズ化合物が、塩化第一スズ、塩化第二スズ、硫酸第一スズ、硫酸第二スズ、ピロリン酸スズ、クエン酸第一スズ、クエン酸第二スズ、シュウ酸第一スズ、シュウ酸第二スズ、メタンスルホン酸スズ、1−エタンスルホン酸スズ、2−エタンスルホン酸スズ、1−プロパンスルホン酸スズ、3−プロパンスルホン酸スズ、メタノールスルホン酸スズ、ヒドロキシエタン−1−スルホン酸スズ、1−ヒドロキシプロパン−1−スルホン酸スズ、ヒドロキシエタン−2−スルホン酸スズ、1−ヒドロキシプロパン−3−スルホン酸スズ、水酸化第一スズ、水酸化第二スズ又はメタスズ酸である請求項1又は請求項2に記載の還元型無電解スズめっき液。
- 該水溶性のチタン化合物が、ハロゲン化チタン又は硫酸チタンである請求項1ないし請求項3の何れかの請求項に記載の還元型無電解スズめっき液。
- 該ハロゲン化チタンが、三塩化チタン、三ヨウ化チタン又は三臭化チタンである請求項4に記載の還元型無電解スズめっき液。
- 該有機錯化剤が、アミノ基含有カルボン酸類、アミノ基含有メチレンホスホン酸類、水酸基含有ホスホン酸類、ベンゼンホスホン酸類、ベンジルホスホン酸類、それらのアルカリ金属塩、それらのアルカリ土類金属塩及びそれらのアンモニウム塩からなる群より選ばれる1種又は2種以上である請求項1ないし請求項5の何れかの請求項に記載の還元型無電解スズめっき液。
- 該アミノ基含有カルボン酸類が、トリエチレンテトラミンヘキサ酢酸、ジエチレントリアミンペンタ酢酸、エチレンジアミンテトラ酢酸、プロパンジアミンテトラ酢酸、ヒドロキシエチレンジアミントリ酢酸、ニトリロトリ酢酸、ニトリロトリプロピオン酸、イミノジ酢酸、ヒドロキシエチルイミノジ酢酸、グリシン、グリシルグリシン、ジヒドロキシエチルグリシン、グルタミン酸又はL−グルタミン酸ジ酢酸である請求項6に記載の還元型無電解スズめっき液。
- 該アミノ基含有メチレンホスホン酸類が、ニトリロトリメチレンホスホン酸、エチレンジアミンテトラメチレンホスホン酸、ジエチレントリアミンペンタメチレンホスホン酸、ヘキサメチレンジアミンテトラメチレンホスホン酸又はヘキサメチレントリアミンペンタメチレンホスホン酸である請求項6に記載の還元型無電解スズめっき液。
- 該水酸基含有ホスホン酸類が、1−ヒドロキシエチリデン−1、1−ジホスホン酸である請求項6に記載の還元型無電解スズめっき液。
- 該ベンゼンホスホン酸類が、3−メトキシベンゼンホスホン酸である請求項6に記載の還元型無電解スズめっき液。
- 該ベンジルホスホン酸類が、3−メチルベンジルホスホン酸又は4−シアノベンジルホスホン酸である請求項6に記載の還元型無電解スズめっき液。
- 該メルカプタン類が、1−プロパンチオール、1−ブタンチオール、1,2−エタンジチオール、1,2−プロパンジチオール、1,4−ブタンジチオール、1,5−ペンタンジチオール、1,6−ヘキサンジチオール、2−アミノエタンチオール、3−メルカプト−1,2−プロパンジオール、1,4−ジメルカプト−2,3−ブタンジオール、3−メルカプトプロピオン酸エチル、ベンゼンチオール、ベンゼントリチオール、2,3−ジクロロベンゼンチオール、2,4−ジメチルベンゼンチオール、2−アミノベンゼンチオール、2−ナフタレンチオール、メルカプト安息香酸、メルカプトピリジンである請求項1ないし請求項11の何れかの請求項に記載の還元型無電解スズめっき液。
- 該スルフィド類が、メチルチオ酢酸、メチルチオプロピオン酸、メチルチオ酪酸、エチルチオ酢酸、エチルチオプロピオン酸、プロピルチオプロピオン酸、ブチルチオプロピオン酸、メチオニン、アセチルスルフィド、2−アミノフェニルフェニルスルフィド、ジアリルスルフィド、ジブチルスルフィド、ブチルエチルスルフィド、ジエチルジスルフィド、ジイソブチルジスルフィド、ジメチルジスルフィド、ジメチルトリスルフィドである請求項1ないし請求項12の何れかの請求項に記載の還元型無電解スズめっき液。
- 請求項1ないし請求項13の何れかの請求項に記載の還元型無電解スズめっき液を用いて無電解めっきを行うことを特徴とするスズ皮膜の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2010517905A JP5368442B2 (ja) | 2008-06-26 | 2009-06-15 | 還元型無電解スズめっき液及びそれを用いたスズ皮膜 |
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JP2008167997 | 2008-06-26 | ||
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PCT/JP2009/060865 WO2009157334A1 (ja) | 2008-06-26 | 2009-06-15 | 還元型無電解スズめっき液及びそれを用いたスズ皮膜 |
JP2010517905A JP5368442B2 (ja) | 2008-06-26 | 2009-06-15 | 還元型無電解スズめっき液及びそれを用いたスズ皮膜 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US11274375B2 (en) * | 2016-12-28 | 2022-03-15 | Atotech Deutschland Gmbh | Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate |
Families Citing this family (11)
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KR20120004776A (ko) * | 2010-07-07 | 2012-01-13 | 삼성전기주식회사 | 무전해 주석 환원 도금액 및 이를 이용한 무전해 주석 환원 도금방법 |
KR101197987B1 (ko) | 2010-08-18 | 2012-11-05 | 삼성전기주식회사 | 주석 합금 형성용 도금액 및 이를 이용한 주석 합금 피막의 형성방법 |
EP2481835B1 (en) | 2011-01-28 | 2013-09-11 | Atotech Deutschland GmbH | Autocatalytic plating bath composition for deposition of tin and tin alloys |
JP6089164B2 (ja) * | 2012-03-30 | 2017-03-08 | 石原ケミカル株式会社 | スズ系メッキ液への補給方法 |
DE102013021502A1 (de) * | 2013-12-19 | 2015-06-25 | Schlenk Metallfolien Gmbh & Co. Kg | Elektrisch leitende Flüssigkeiten auf der Basis von Metall-Diphosphonat-Komplexen |
JP6803502B2 (ja) * | 2016-12-22 | 2020-12-23 | 石原ケミカル株式会社 | アルミニウム基材へのアルカリ性置換スズメッキ浴 |
CN111755247B (zh) * | 2019-03-28 | 2022-01-07 | 株式会社村田制作所 | 层叠陶瓷电容器以及层叠陶瓷电容器的制造方法 |
TW202106928A (zh) | 2019-05-28 | 2021-02-16 | 德商德國艾托特克公司 | 錫電鍍浴及於基板表面上沉積錫或錫合金之方法 |
EP3770298A1 (en) | 2019-07-24 | 2021-01-27 | ATOTECH Deutschland GmbH | Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate |
US20220396881A1 (en) * | 2021-06-10 | 2022-12-15 | C. Uyemura & Co., Ltd. | Method for fabricating electronic component |
CN115404471B (zh) * | 2022-08-30 | 2023-07-04 | 江西住井新材料有限公司 | 一种无电解镀锡溶液及应用 |
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JP2000026977A (ja) * | 1998-07-13 | 2000-01-25 | Daiwa Kasei Kenkyusho:Kk | 貴金属を化学的還元析出によって得るための水溶液 |
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JP2593867B2 (ja) | 1987-03-18 | 1997-03-26 | 新光電気工業 株式会社 | 無電解スズめつき浴 |
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JPH0361380A (ja) * | 1989-07-28 | 1991-03-18 | Metsuku Kk | 無電解すずめっき浴 |
JPH0860376A (ja) * | 1994-08-12 | 1996-03-05 | Murata Mfg Co Ltd | 無電解めっき方法 |
JP2000026977A (ja) * | 1998-07-13 | 2000-01-25 | Daiwa Kasei Kenkyusho:Kk | 貴金属を化学的還元析出によって得るための水溶液 |
JP2002088481A (ja) * | 2000-09-14 | 2002-03-27 | Ishihara Chem Co Ltd | 無電解スズ−銀合金メッキ浴 |
JP2003268558A (ja) * | 2002-03-18 | 2003-09-25 | Daiwa Fine Chemicals Co Ltd (Laboratory) | 無電解めっき浴及び該めっき浴を用いて得られた金属被覆物 |
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US11274375B2 (en) * | 2016-12-28 | 2022-03-15 | Atotech Deutschland Gmbh | Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate |
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TW201009115A (en) | 2010-03-01 |
KR101579334B1 (ko) | 2015-12-21 |
TWI448579B (zh) | 2014-08-11 |
WO2009157334A1 (ja) | 2009-12-30 |
JPWO2009157334A1 (ja) | 2011-12-08 |
KR20110028252A (ko) | 2011-03-17 |
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