DE102012204420B4 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

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Publication number
DE102012204420B4
DE102012204420B4 DE102012204420.5A DE102012204420A DE102012204420B4 DE 102012204420 B4 DE102012204420 B4 DE 102012204420B4 DE 102012204420 A DE102012204420 A DE 102012204420A DE 102012204420 B4 DE102012204420 B4 DE 102012204420B4
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DE
Germany
Prior art keywords
region
trench
main surface
stabilizing plate
effect transistor
Prior art date
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Active
Application number
DE102012204420.5A
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German (de)
English (en)
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DE102012204420A1 (de
Inventor
Daisuke Oya
Katsumi Nakamura
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Publication of DE102012204420A1 publication Critical patent/DE102012204420A1/de
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Publication of DE102012204420B4 publication Critical patent/DE102012204420B4/de
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H10D12/441—Vertical IGBTs
    • H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/111—Field plates
    • H10D64/112—Field plates comprising multiple field plate segments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311—Gate electrodes for field-effect devices
    • H10D64/411—Gate electrodes for field-effect devices for FETs
    • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/512—Disposition of the gate electrodes, e.g. buried gates
    • H10D64/513—Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths

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  • Electrodes Of Semiconductors (AREA)
DE102012204420.5A 2011-04-19 2012-03-20 Halbleitervorrichtung Active DE102012204420B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-093121 2011-04-19
JP2011093121A JP5634318B2 (ja) 2011-04-19 2011-04-19 半導体装置

Publications (2)

Publication Number Publication Date
DE102012204420A1 DE102012204420A1 (de) 2012-10-25
DE102012204420B4 true DE102012204420B4 (de) 2020-01-30

Family

ID=46967530

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012204420.5A Active DE102012204420B4 (de) 2011-04-19 2012-03-20 Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US8698195B2 (enExample)
JP (1) JP5634318B2 (enExample)
KR (1) KR101440397B1 (enExample)
CN (1) CN102751329B (enExample)
DE (1) DE102012204420B4 (enExample)

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JP5488691B2 (ja) * 2010-03-09 2014-05-14 富士電機株式会社 半導体装置
JP5884557B2 (ja) * 2012-03-02 2016-03-15 トヨタ自動車株式会社 半導体装置
JP5932623B2 (ja) * 2012-12-05 2016-06-08 株式会社 日立パワーデバイス 半導体装置およびそれを用いた電力変換装置
CN104078497B (zh) * 2013-03-28 2019-03-15 南京励盛半导体科技有限公司 一种功率场效应晶体管器件的结构
GB201313126D0 (en) * 2013-07-23 2013-09-04 Eco Semiconductors Ltd MOS-Bipolar Device
DE112014006158T5 (de) * 2014-01-14 2016-11-03 Mitsubishi Electric Corporation Leistungshalbleitervorrichtung
JP6194812B2 (ja) * 2014-02-18 2017-09-13 トヨタ自動車株式会社 半導体モジュール
JP6566512B2 (ja) * 2014-04-15 2019-08-28 ローム株式会社 半導体装置および半導体装置の製造方法
JP2016039170A (ja) * 2014-08-05 2016-03-22 株式会社東芝 半導体装置
JP6304445B2 (ja) * 2015-03-16 2018-04-04 富士電機株式会社 半導体装置の製造方法
JP6495751B2 (ja) * 2015-06-10 2019-04-03 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法
CN107210322B (zh) * 2015-07-07 2020-11-06 富士电机株式会社 半导体装置
JP6668798B2 (ja) * 2015-07-15 2020-03-18 富士電機株式会社 半導体装置
US10332990B2 (en) 2015-07-15 2019-06-25 Fuji Electric Co., Ltd. Semiconductor device
DE112016000210T5 (de) * 2015-07-16 2017-09-07 Fuji Electric Co., Ltd. Halbleitervorrichtung und Verfahren zum Herstellen der Halbleitervorrichtung
WO2017033315A1 (ja) * 2015-08-26 2017-03-02 三菱電機株式会社 半導体素子
EP3192080B1 (en) * 2015-09-30 2018-04-18 Koninklijke Philips N.V. Focussing of gratings for differential phase contrast imaging by means of electro-mechanic transducer foils
CN105226090B (zh) * 2015-11-10 2018-07-13 株洲中车时代电气股份有限公司 一种绝缘栅双极晶体管及其制作方法
JP6634860B2 (ja) * 2016-02-10 2020-01-22 株式会社デンソー 半導体装置
CN107851666B (zh) 2016-02-15 2021-11-23 富士电机株式会社 半导体装置
CN109075211B (zh) * 2016-04-25 2023-04-18 三菱电机株式会社 半导体装置
JP6574744B2 (ja) * 2016-09-16 2019-09-11 株式会社東芝 半導体装置
CN109314141B (zh) * 2016-12-08 2021-09-14 富士电机株式会社 半导体装置
JP6820738B2 (ja) 2016-12-27 2021-01-27 三菱電機株式会社 半導体装置、電力変換装置および半導体装置の製造方法
JP7325931B2 (ja) * 2017-05-16 2023-08-15 富士電機株式会社 半導体装置
US10396189B2 (en) * 2017-05-30 2019-08-27 Fuji Electric Co., Ltd. Semiconductor device
JP6964566B2 (ja) 2018-08-17 2021-11-10 三菱電機株式会社 半導体装置およびその製造方法
CN109473475A (zh) * 2018-12-26 2019-03-15 江苏中科君芯科技有限公司 能提高加工良率的igbt器件
JP7272004B2 (ja) * 2019-02-25 2023-05-12 富士電機株式会社 絶縁ゲート型半導体装置及びその製造方法
US11545543B2 (en) * 2020-10-27 2023-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Trench pattern for trench capacitor yield improvement
JP7580245B2 (ja) 2020-11-02 2024-11-11 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP7515428B2 (ja) 2021-02-16 2024-07-12 三菱電機株式会社 半導体装置およびその製造方法
JP7630398B2 (ja) * 2021-09-17 2025-02-17 株式会社東芝 半導体装置
JP2024046362A (ja) * 2022-09-22 2024-04-03 株式会社 日立パワーデバイス 半導体装置
CN117352554B (zh) * 2023-12-04 2024-02-27 赛晶亚太半导体科技(北京)有限公司 一种具有栅极沟槽的半导体功率器件
CN117476756A (zh) * 2023-12-28 2024-01-30 深圳天狼芯半导体有限公司 一种具备沟槽发射极的碳化硅igbt及制备方法

Citations (4)

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DE102008052422A1 (de) * 2008-05-13 2009-12-03 Mitsubishi Electric Corp. Halbleitervorrichtung mit reduzierter Kapazität
JP2010050211A (ja) * 2008-08-20 2010-03-04 Denso Corp 半導体装置の製造方法
JP2010135677A (ja) * 2008-12-08 2010-06-17 Denso Corp 半導体装置
WO2011111500A1 (ja) * 2010-03-09 2011-09-15 富士電機システムズ株式会社 半導体装置

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JP3307785B2 (ja) 1994-12-13 2002-07-24 三菱電機株式会社 絶縁ゲート型半導体装置
JPH09331063A (ja) 1996-04-11 1997-12-22 Mitsubishi Electric Corp 高耐圧半導体装置およびその製造方法
JP3400348B2 (ja) 1998-05-19 2003-04-28 株式会社東芝 絶縁ゲート型半導体装置
JP2001102579A (ja) * 1999-09-30 2001-04-13 Toshiba Corp トレンチゲート付き半導体装置
JP4200626B2 (ja) 2000-02-28 2008-12-24 株式会社デンソー 絶縁ゲート型パワー素子の製造方法
JP4904612B2 (ja) * 2000-05-22 2012-03-28 富士電機株式会社 Ｉｇｂｔ
JP2002016252A (ja) * 2000-06-27 2002-01-18 Toshiba Corp 絶縁ゲート型半導体素子
WO2002058160A1 (en) 2001-01-19 2002-07-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP5025071B2 (ja) * 2001-02-01 2012-09-12 三菱電機株式会社 半導体装置およびその製造方法
DE10203164B4 (de) * 2002-01-28 2005-06-16 Infineon Technologies Ag Leistungshalbleiterbauelement und Verfahren zu dessen Herstellung
JP3971327B2 (ja) * 2003-03-11 2007-09-05 株式会社東芝 絶縁ゲート型半導体装置
JP5223235B2 (ja) * 2007-05-14 2013-06-26 株式会社デンソー 半導体装置
JP5359182B2 (ja) * 2008-01-28 2013-12-04 富士電機株式会社 半導体装置
DE102009005914B4 (de) * 2008-01-28 2014-02-13 Denso Corporation Halbleitervorrichtung mit Halbleiterelement mit isoliertem Gate und bipolarer Transistor mit isoliertem Gate
CN101933141B (zh) * 2008-01-29 2013-02-13 富士电机株式会社 半导体装置
JP5422930B2 (ja) 2008-06-30 2014-02-19 株式会社デンソー 半導体装置
JP2010232335A (ja) * 2009-03-26 2010-10-14 Sanyo Electric Co Ltd 絶縁ゲートバイポーラトランジスタ

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DE102008052422A1 (de) * 2008-05-13 2009-12-03 Mitsubishi Electric Corp. Halbleitervorrichtung mit reduzierter Kapazität
JP2010050211A (ja) * 2008-08-20 2010-03-04 Denso Corp 半導体装置の製造方法
JP2010135677A (ja) * 2008-12-08 2010-06-17 Denso Corp 半導体装置
WO2011111500A1 (ja) * 2010-03-09 2011-09-15 富士電機システムズ株式会社 半導体装置

Also Published As

Publication number Publication date
CN102751329B (zh) 2015-04-08
KR101440397B1 (ko) 2014-09-15
JP5634318B2 (ja) 2014-12-03
DE102012204420A1 (de) 2012-10-25
US20120267680A1 (en) 2012-10-25
CN102751329A (zh) 2012-10-24
US8698195B2 (en) 2014-04-15
KR20120123192A (ko) 2012-11-08
JP2012227335A (ja) 2012-11-15

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