JP6406454B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6406454B2 JP6406454B2 JP2017527147A JP2017527147A JP6406454B2 JP 6406454 B2 JP6406454 B2 JP 6406454B2 JP 2017527147 A JP2017527147 A JP 2017527147A JP 2017527147 A JP2017527147 A JP 2017527147A JP 6406454 B2 JP6406454 B2 JP 6406454B2
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- 239000004065 semiconductor Substances 0.000 title claims description 161
- 239000000758 substrate Substances 0.000 claims description 108
- 239000010410 layer Substances 0.000 claims description 21
- 239000011229 interlayer Substances 0.000 claims description 17
- 230000001681 protective effect Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- 239000005380 borophosphosilicate glass Substances 0.000 claims description 2
- 230000000994 depressogenic effect Effects 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 15
- 229920005591 polysilicon Polymers 0.000 description 15
- 238000009825 accumulation Methods 0.000 description 14
- 239000012535 impurity Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- 239000011669 selenium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000293849 Cordylanthus Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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Description
[先行技術文献]
[特許文献]
特許文献1 特開2002−353456号公報
Claims (18)
- 第1導電型の半導体基板と、
前記半導体基板の表面において予め定められた延伸方向に延伸して形成されたダミートレンチ部と、
前記ダミートレンチ部と対向する範囲において前記延伸方向に延伸して、前記半導体基板の表面に形成されたゲートトレンチ部と、
前記延伸方向と垂直な方向において隣り合う前記ダミートレンチ部および前記ゲートトレンチ部に挟まれた前記半導体基板のメサ部と、
前記メサ部の表面側に設けられた第2導電型のベース領域と、
前記ゲートトレンチ部と前記ダミートレンチ部とをつなぐようにそれぞれに接し、前記ベース領域の表面に形成された第1導電型のエミッタ領域と、
前記半導体基板の表面の上方に形成された、金属を含む第1表面側電極と
を備え、
前記ダミートレンチ部は、
前記半導体基板の表面に形成されたダミートレンチと、
前記ダミートレンチの側壁を含む内壁に接して形成されたダミー絶縁膜と、
前記ダミートレンチの内部において、前記内壁に接する前記ダミー絶縁膜で囲まれた領域に充填されたダミー導電部と、
前記延伸方向に延伸する前記ダミートレンチの前記延伸方向とは垂直な方向における中央部で前記ダミー導電部の少なくとも一部を露出させるダミーコンタクトホールを有し、且つ、前記半導体基板の表面において前記ダミー絶縁膜を覆う保護部と
を有し、
前記ゲートトレンチ部は、
前記半導体基板の表面に形成されたゲートトレンチと、
前記ゲートトレンチの側壁を含む内壁に接して形成されたゲート絶縁膜と、
前記ゲートトレンチの内部において、前記内壁に接する前記ゲート絶縁膜で囲まれた領域に充填されたゲート導電部と、
前記ゲート導電部の上方に設けられ、前記ゲート導電部と前記第1表面側電極とを絶縁するゲート絶縁部と
を有し、
前記ゲート絶縁部は、前記半導体基板の表面において前記ゲートトレンチを覆って設けられ、
隣り合う前記保護部および前記ゲート絶縁部との間には、メサコンタクトホールが設けられており、
前記第1表面側電極は、前記ダミーコンタクトホール内に形成された部分を有し、前記ダミー導電部と接触し、
前記第1表面側電極は、前記メサコンタクトホール内に形成された部分を有し、前記エミッタ領域と接触し、
前記ダミー導電部の表面の縁部分が、前記エミッタ領域の表面よりも深い位置に配置され、
前記保護部は、前記ダミー導電部の表面の縁部分を直接覆う
半導体装置。 - 前記ダミーコンタクトホールの幅は、前記メサコンタクトホールの幅よりも小さい
請求項1に記載の半導体装置。 - 前記第1表面側電極は、
前記ダミーコンタクトホール内に形成され、前記ダミー導電部と接触する金属のダミープラグ部と、
前記ダミープラグ部の上方に接して形成され、前記ダミープラグ部とは材料の異なる金属の電極部と
を有する請求項1に記載の半導体装置。 - 前記ダミープラグ部はタングステンを含む
請求項3に記載の半導体装置。 - 前記第1表面側電極は、前記ダミープラグ部と同一の材料で、前記メサコンタクトホールに形成され、前記メサ部の表面に接触するメサプラグ部を更に備える
請求項3に記載の半導体装置。 - 前記ダミープラグ部は、前記メサプラグ部よりも深さ方向において長い
請求項5に記載の半導体装置。 - 前記ゲートトレンチ部は、
前記ダミートレンチ部と対向する範囲において前記延伸方向に延伸して形成された対向部と、
前記対向部から更に延伸して、前記ダミートレンチ部と対向しない範囲に形成された突出部と
を有し、
前記突出部の前記ゲート絶縁部は、前記ゲート導電部を露出させるゲートコンタクトホールを有し、
前記突出部の上方に形成された第2表面側電極を更に備え、
前記第2表面側電極は、前記ゲート絶縁部の前記ゲートコンタクトホール内に形成され、
前記突出部における前記ゲート導電部が、前記第2表面側電極と電気的に接続し、
前記突出部の前記ゲート導電部の前記延伸方向と平行な断面における形状と、前記ダミー導電部の前記延伸方向と垂直な断面における形状は同一であり、
前記ゲートコンタクトホールの深さ方向の長さは前記ダミーコンタクトホールの深さ方向の長さと同一であり、
前記ゲートコンタクトホールの幅は前記ダミーコンタクトホールの幅と同一である
請求項3から6のいずれか一項に記載の半導体装置。 - 前記第2表面側電極は、前記ゲート絶縁部の前記ゲートコンタクトホール内に形成され、前記ゲート導電部と接触する金属のゲートプラグ部を有する
請求項7に記載の半導体装置。 - 前記ゲートプラグ部は、前記ダミープラグ部と同一の材料で形成される
請求項8に記載の半導体装置。 - 前記ゲートプラグ部は、前記ダミープラグ部と深さ方向において同一の長さを有する
請求項8に記載の半導体装置。 - 前記ゲート絶縁部および前記保護部は、前記半導体基板の表面において予め定められたパターンで形成された同一層の層間絶縁膜の一部である
請求項1から10のいずれか一項に記載の半導体装置。 - 前記ゲート絶縁部および前記保護部は、前記半導体基板の表面において予め定められたパターンで形成された層間絶縁膜であり、
層間絶縁膜はPSG膜またはBPSG膜である
請求項1から11のいずれか一項に記載の半導体装置。 - 前記ダミー導電部の中央部は窪んでいる形状を有し、
前記第1表面側電極は、前記ダミー導電部の窪んでいる中央部に接触する
請求項1から12のいずれか一項に記載の半導体装置。 - 前記半導体基板の深さ方向における前記ゲートトレンチ部および前記ダミートレンチ部の長さよりも深く形成された第2導電型のウェル領域を、前記半導体基板の表面にさらに備え、
前記ウェル領域は、平面視で、
前記ダミートレンチ部の延伸方向の端と、
前記ゲートトレンチ部の前記突出部と、
前記第2表面側電極と、を含む
請求項7から10のいずれか一項に記載の半導体装置。 - 前記ダミートレンチ部は、平面視で、前記第2表面側電極から離れている
請求項7から10のいずれか一項に記載の半導体装置。 - 前記ダミーコンタクトホールは、前記メサコンタクトホールよりも深さ方向において長い
請求項2に記載の半導体装置。 - 前記ゲートトレンチ部と前記ダミートレンチ部とをつなぐようにそれぞれに接し、前記ベース領域の表面に形成された第2導電型のコンタクト領域をさらに備え、
前記エミッタ領域と前記コンタクト領域は前記延伸方向にそって前記メサ部表面に交互に露出し、
前記第1表面側電極は、前記メサコンタクトホール内に形成された部分で前記コンタクト領域と接触する
請求項1に記載の半導体装置。 - 前記保護部は、前記半導体基板の表面を覆う部分と、前記ダミー導電部の表面の縁部分と接触して前記縁部分を直接覆う部分とを有し、前記半導体基板の表面を覆う部分と、前記ダミー導電部の表面の縁部分と接触する部分とが、同一の層間絶縁膜の一部である
請求項1から17のいずれか一項に記載の半導体装置。
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