DE102005053767A1 - MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau - Google Patents

MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau Download PDF

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Publication number
DE102005053767A1
DE102005053767A1 DE102005053767A DE102005053767A DE102005053767A1 DE 102005053767 A1 DE102005053767 A1 DE 102005053767A1 DE 102005053767 A DE102005053767 A DE 102005053767A DE 102005053767 A DE102005053767 A DE 102005053767A DE 102005053767 A1 DE102005053767 A1 DE 102005053767A1
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DE
Germany
Prior art keywords
carrier substrate
manufacture
installation
mems microphone
microphone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102005053767A
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English (en)
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DE102005053767B4 (de
Inventor
Wolfgang Pahl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE102005053767.7A priority Critical patent/DE102005053767B4/de
Priority to US12/092,423 priority patent/US8229139B2/en
Priority to JP2008539239A priority patent/JP5054703B2/ja
Priority to PCT/DE2006/001946 priority patent/WO2007054071A1/de
Publication of DE102005053767A1 publication Critical patent/DE102005053767A1/de
Application granted granted Critical
Publication of DE102005053767B4 publication Critical patent/DE102005053767B4/de
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2225/00—Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
    • H04R2225/49—Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)

Abstract

Es wird ein Mikrofon in miniaturisierter Bauweise vorgeschlagen, welches auf einer ersten Oberfläche eines flachen Trägersubstrats einen elektroakustischen Wandler trägt, der über einer Ausnehmung des Trägersubstrats angeordnet ist. Auf der zweiten Oberfläche des Trägersubstrats wird die Ausnehmung von einer auf dem Trägersubstrat aufsitzenden und mit dessen Oberfläche dicht abschließenden Kappe überspannt, die zumindest eine metallische Schicht zur elektromagnetischen Abschirmung aufweist. Unter der Kappe können Halbleiterbauelemente angeordnet sein, die die Funktion des Mikrofons unterstützen oder gewährleisten.
DE102005053767.7A 2005-11-10 2005-11-10 MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau Active DE102005053767B4 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102005053767.7A DE102005053767B4 (de) 2005-11-10 2005-11-10 MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
US12/092,423 US8229139B2 (en) 2005-11-10 2006-11-06 MEMS microphone, production method and method for installing
JP2008539239A JP5054703B2 (ja) 2005-11-10 2006-11-06 Ｍｅｍｓマイクロフォン、ｍｅｍｓマイクロフォンの製造方法およびｍｅｍｓマイクロフォンの組み込み方法
PCT/DE2006/001946 WO2007054071A1 (de) 2005-11-10 2006-11-06 Mems-mikrofon, verfahren zur herstellung und verfahren zum einbau

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005053767.7A DE102005053767B4 (de) 2005-11-10 2005-11-10 MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau

Publications (2)

Publication Number Publication Date
DE102005053767A1 true DE102005053767A1 (de) 2007-05-16
DE102005053767B4 DE102005053767B4 (de) 2014-10-30

Family

ID=37700795

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005053767.7A Active DE102005053767B4 (de) 2005-11-10 2005-11-10 MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau

Country Status (4)

Country Link
US (1) US8229139B2 (de)
JP (1) JP5054703B2 (de)
DE (1) DE102005053767B4 (de)
WO (1) WO2007054071A1 (de)

Cited By (7)

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US8218794B2 (en) 2006-09-29 2012-07-10 Epcos Ag Component comprising a MEMS microphone and method for the production of said component
US8737674B2 (en) 2011-02-11 2014-05-27 Infineon Technologies Ag Housed loudspeaker array
WO2016180841A1 (de) * 2015-05-13 2016-11-17 USound GmbH Leiterplattenmodul mit durchgehender aussparung sowie diesbezügliche schallwandleranordnung sowie herstellungsverfahren
CN108622845A (zh) * 2017-03-16 2018-10-09 日月光半导体制造股份有限公司 半导体装置封装及其制造方法
CN112697262A (zh) * 2020-12-08 2021-04-23 联合微电子中心有限责任公司 水听器及其制造方法
DE102014214153B4 (de) 2013-07-22 2021-12-23 Infineon Technologies Ag Oberflächenmontierbares Mikrofonpackage

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WO2016180841A1 (de) * 2015-05-13 2016-11-17 USound GmbH Leiterplattenmodul mit durchgehender aussparung sowie diesbezügliche schallwandleranordnung sowie herstellungsverfahren
US10206046B2 (en) 2015-05-13 2019-02-12 USound GmbH Circuit board module comprising a continuous cavity, associated sonic transducer assembly, and production method
CN108622845A (zh) * 2017-03-16 2018-10-09 日月光半导体制造股份有限公司 半导体装置封装及其制造方法
CN108622845B (zh) * 2017-03-16 2023-12-01 日月光半导体制造股份有限公司 半导体装置封装及其制造方法
CN112697262A (zh) * 2020-12-08 2021-04-23 联合微电子中心有限责任公司 水听器及其制造方法

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US8229139B2 (en) 2012-07-24
JP5054703B2 (ja) 2012-10-24
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JP2009515443A (ja) 2009-04-09
US20080279407A1 (en) 2008-11-13

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