DE102005008339A1 - Leuchtdiode (LED) und Herstellungsverfahren dafür - Google Patents

Leuchtdiode (LED) und Herstellungsverfahren dafür Download PDF

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Publication number
DE102005008339A1
DE102005008339A1 DE102005008339A DE102005008339A DE102005008339A1 DE 102005008339 A1 DE102005008339 A1 DE 102005008339A1 DE 102005008339 A DE102005008339 A DE 102005008339A DE 102005008339 A DE102005008339 A DE 102005008339A DE 102005008339 A1 DE102005008339 A1 DE 102005008339A1
Authority
DE
Germany
Prior art keywords
led
funnel
silicon substrate
electrodes
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102005008339A
Other languages
German (de)
English (en)
Inventor
Kazuhiko Ueno
Yoshiaki Yasuda
Masanao Tani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Publication of DE102005008339A1 publication Critical patent/DE102005008339A1/de
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07552—Controlling the environment, e.g. atmosphere composition or temperature changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
DE102005008339A 2004-02-23 2005-02-23 Leuchtdiode (LED) und Herstellungsverfahren dafür Ceased DE102005008339A1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004046173 2004-02-23
JP2004-46173 2004-02-23
JP2004-338624 2004-11-24
JP2004338624A JP4572312B2 (ja) 2004-02-23 2004-11-24 Ｌｅｄ及びその製造方法

Publications (1)

Publication Number Publication Date
DE102005008339A1 true DE102005008339A1 (de) 2005-10-06

Family

ID=34980776

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005008339A Ceased DE102005008339A1 (de) 2004-02-23 2005-02-23 Leuchtdiode (LED) und Herstellungsverfahren dafür

Country Status (3)

Country Link
US (1) US20060001055A1 (https=)
JP (1) JP4572312B2 (https=)
DE (1) DE102005008339A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1791190A1 (en) * 2005-11-25 2007-05-30 Samsung Electro-Mechanics Co., Ltd. Side view light emitting diode package
WO2008025625A1 (de) * 2006-08-30 2008-03-06 Robert Bosch Gmbh Leuchtmodul
WO2009015798A3 (en) * 2007-08-02 2009-04-23 Perkinelmer Elcos Gmbh Mounting structure for leds, led assembly, led assembly socket, method for forming a mounting structure
EP1958266A4 (en) * 2005-12-08 2012-10-17 Korea Electronics Telecomm SILICON LED WITH MIRROR REFLECTIVE LATERAL
DE102012103161A1 (de) * 2012-04-12 2013-10-17 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil

Families Citing this family (155)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI302382B (en) * 2004-09-15 2008-10-21 Yu Nung Shen Light emitting diode package and its packaging method
US20060125716A1 (en) * 2004-12-10 2006-06-15 Wong Lye Y Light-emitting diode display with compartment
BRPI0519478A2 (pt) 2004-12-27 2009-02-03 Quantum Paper Inc display emissivo endereÇÁvel e imprimÍvel
JP4698234B2 (ja) * 2005-01-21 2011-06-08 スタンレー電気株式会社 表面実装型半導体素子
JP2006210402A (ja) * 2005-01-25 2006-08-10 Matsushita Electric Ind Co Ltd 半導体装置
KR100663906B1 (ko) * 2005-03-14 2007-01-02 서울반도체 주식회사 발광 장치
WO2006106901A1 (ja) * 2005-04-01 2006-10-12 Matsushita Electric Industrial Co., Ltd. Ｌｅｄ部品およびその製造方法
KR20080006634A (ko) * 2005-04-28 2008-01-16 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 리세스 내에 배치된 ｌｅｄ를 포함하는 광원
US20060292747A1 (en) * 2005-06-27 2006-12-28 Loh Ban P Top-surface-mount power light emitter with integral heat sink
KR101232505B1 (ko) * 2005-06-30 2013-02-12 엘지디스플레이 주식회사 발광다이오드 패키지 제조방법, 백라이트 유닛 및액정표시장치
JP3978456B2 (ja) * 2005-11-02 2007-09-19 株式会社トリオン 発光ダイオード実装基板
JP2007134602A (ja) * 2005-11-11 2007-05-31 Stanley Electric Co Ltd 表面実装型半導体発光装置
JP4817820B2 (ja) * 2005-12-01 2011-11-16 スタンレー電気株式会社 Ｌｅｄパッケージ、発光装置及びｌｅｄパッケージの製造方法
JP2007157805A (ja) * 2005-12-01 2007-06-21 Stanley Electric Co Ltd Ｌｅｄパッケージ、発光装置及びｌｅｄパッケージの製造方法
JP2007288097A (ja) * 2006-04-20 2007-11-01 Showa Denko Kk フリップチップ型半導体発光素子用の実装基板、フリップチップ型半導体発光素子の実装構造及び発光ダイオードランプ
JP4996096B2 (ja) * 2006-01-06 2012-08-08 新光電気工業株式会社 発光装置及びその製造方法
JP2007194385A (ja) * 2006-01-19 2007-08-02 Stanley Electric Co Ltd 半導体発光装置及び半導体発光装置の製造方法
US8044412B2 (en) * 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP4955422B2 (ja) * 2006-03-08 2012-06-20 三菱電機株式会社 発光装置
JP5192666B2 (ja) * 2006-03-28 2013-05-08 パナソニック株式会社 発光装置
JP2007266314A (ja) * 2006-03-28 2007-10-11 Matsushita Electric Works Ltd 発光装置
JP2007266313A (ja) * 2006-03-28 2007-10-11 Matsushita Electric Works Ltd 発光装置
CN101421844A (zh) * 2006-04-10 2009-04-29 皇家飞利浦电子股份有限公司 发光二极管模块
EP1848042A1 (en) * 2006-04-21 2007-10-24 LEXEDIS Lighting GmbH LED package with submount
JP4710713B2 (ja) * 2006-05-17 2011-06-29 市光工業株式会社 発光ダイオードの固定構造
KR100735432B1 (ko) * 2006-05-18 2007-07-04 삼성전기주식회사 발광소자 패키지 및 발광소자 패키지 어레이
US8866007B2 (en) * 2006-06-07 2014-10-21 California Institute Of Technology Plasmonic photovoltaics
JP2008016565A (ja) * 2006-07-04 2008-01-24 Shinko Electric Ind Co Ltd 発光素子収容体及びその製造方法、及び発光装置
KR100854328B1 (ko) * 2006-07-07 2008-08-28 엘지전자 주식회사 발광 소자 패키지 및 그 제조방법
US20090273004A1 (en) * 2006-07-24 2009-11-05 Hung-Yi Lin Chip package structure and method of making the same
US20090273005A1 (en) * 2006-07-24 2009-11-05 Hung-Yi Lin Opto-electronic package structure having silicon-substrate and method of forming the same
JP5192667B2 (ja) * 2006-07-26 2013-05-08 パナソニック株式会社 発光装置
JP5148849B2 (ja) * 2006-07-27 2013-02-20 スタンレー電気株式会社 Ｌｅｄパッケージ、それを用いた発光装置およびｌｅｄパッケージの製造方法
TWI418054B (zh) * 2006-08-08 2013-12-01 Ｌｇ電子股份有限公司 發光裝置封裝與製造此封裝之方法
US7763478B2 (en) 2006-08-21 2010-07-27 Cree, Inc. Methods of forming semiconductor light emitting device packages by liquid injection molding
TWI324403B (en) * 2006-11-07 2010-05-01 Opto Tech Corp Light emitting diode and method manufacturing the same
US8283683B2 (en) * 2006-11-07 2012-10-09 Opto Tech Corporation Chip-bonding light emitting diode chip
JP4963950B2 (ja) * 2006-12-12 2012-06-27 スタンレー電気株式会社 半導体発光装置およびその製造方法
TWI338385B (en) * 2006-12-13 2011-03-01 Silicon Base Dev Inc Side light package structure of light diode and its producing method
JP4836769B2 (ja) * 2006-12-18 2011-12-14 スタンレー電気株式会社 半導体発光装置およびその製造方法
US9061450B2 (en) * 2007-02-12 2015-06-23 Cree, Inc. Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
US7732234B2 (en) * 2007-02-15 2010-06-08 Hymite A/S Fabrication process for package with light emitting device on a sub-mount
JP5179766B2 (ja) * 2007-03-08 2013-04-10 スタンレー電気株式会社 半導体発光装置およびその製造方法
EP1988577B1 (en) * 2007-04-30 2017-04-05 Tridonic Jennersdorf GmbH Light emitting diode module with silicon platform
US7972031B2 (en) * 2007-05-31 2011-07-05 Nthdegree Technologies Worldwide Inc Addressable or static light emitting or electronic apparatus
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8384630B2 (en) 2007-05-31 2013-02-26 Nthdegree Technologies Worldwide Inc Light emitting, photovoltaic or other electronic apparatus and system
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
AU2008259989A1 (en) * 2007-05-31 2008-12-11 Nthdegree Technologies Worldwide Inc. Method of manufacturing addressable and static electronic displays, power generating or other electronic apparatus and such apparatus
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8133768B2 (en) 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8889216B2 (en) 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8767983B2 (en) * 2007-06-01 2014-07-01 Infineon Technologies Ag Module including a micro-electro-mechanical microphone
EP2031657A1 (en) * 2007-08-31 2009-03-04 ILED Photoelectronics, Inc. Package structure for a high-luminance light source
KR100877881B1 (ko) * 2007-09-06 2009-01-08 엘지이노텍 주식회사 발광다이오드 패키지 및 그 제조방법
JP5550558B2 (ja) * 2007-11-01 2014-07-16 インシアヴァ （ピーテーワイ） リミテッド 光誘導機構を有するオプトエレクトロニック・デバイスおよびその機構を形成する方法
DE102008011153B4 (de) * 2007-11-27 2023-02-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Anordnung mit mindestens zwei lichtemittierenden Halbleiterbauelementen
DE102008014121A1 (de) * 2007-12-20 2009-06-25 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Halbleiterchips und Halbleiterchip
JP2009164225A (ja) * 2007-12-28 2009-07-23 Stanley Electric Co Ltd 発光装置およびその製造方法
US8384997B2 (en) 2008-01-21 2013-02-26 Primesense Ltd Optical pattern projection
EP2235584B1 (en) * 2008-01-21 2020-09-16 Apple Inc. Optical designs for zero order reduction
JP5275642B2 (ja) * 2008-02-12 2013-08-28 スタンレー電気株式会社 発光装置およびその製造方法
KR101463039B1 (ko) * 2008-02-15 2014-11-19 삼성디스플레이 주식회사 백라이트 유닛 및 이를 구비하는 표시 장치
JP5104385B2 (ja) * 2008-02-20 2012-12-19 豊田合成株式会社 Ｌｅｄランプモジュール
DE102008021659A1 (de) * 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh LED-Element mit Dünnschicht-Halbleiterbauelement auf Galliumnitrid-Basis
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
KR100992778B1 (ko) * 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
US8490678B2 (en) * 2008-06-02 2013-07-23 Gerald Ho Kim Silicon-based thermal energy transfer device and apparatus
US8130506B2 (en) * 2008-06-19 2012-03-06 Infineon Technologies Ag Sensor module
US8238401B2 (en) * 2008-08-25 2012-08-07 Gerald Ho Kim Silicon-based lens support structure for diode laser
TW201020643A (en) * 2008-11-25 2010-06-01 Chi Mei Lighting Tech Corp Side view type light-emitting diode package structure, and manufacturing method and application thereof
JP2010226078A (ja) * 2009-02-24 2010-10-07 Sony Corp 発光装置およびその製造方法
JPWO2010119830A1 (ja) * 2009-04-13 2012-10-22 パナソニック株式会社 発光ダイオード
WO2010151600A1 (en) 2009-06-27 2010-12-29 Michael Tischler High efficiency leds and led lamps
JP2011101054A (ja) * 2009-07-03 2011-05-19 Sharp Corp 半導体発光素子搭載用基板、バックライトシャーシ、表示装置、及び、テレビ受信装置
KR101081055B1 (ko) * 2009-07-24 2011-11-07 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
CN102576789B (zh) * 2009-09-20 2016-08-24 维亚甘有限公司 电子器件的晶片级封装
US20120267674A1 (en) * 2009-09-24 2012-10-25 Kyocera Corporation Mounting substrate, light emitting body, and method for manufacturing mounting substrate
CN102042516A (zh) * 2009-10-16 2011-05-04 富士迈半导体精密工业（上海）有限公司 照明装置
JP5588310B2 (ja) * 2009-11-15 2014-09-10 プライムセンス リミテッド ビームモニタ付き光学プロジェクタ
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
US8384121B2 (en) 2010-06-29 2013-02-26 Cooledge Lighting Inc. Electronic devices with yielding substrates
US9480133B2 (en) 2010-01-04 2016-10-25 Cooledge Lighting Inc. Light-emitting element repair in array-based lighting devices
KR101072212B1 (ko) * 2010-01-05 2011-10-10 엘지이노텍 주식회사 발광 소자 및 그 제조방법
US20110188054A1 (en) * 2010-02-02 2011-08-04 Primesense Ltd Integrated photonics module for optical projection
US20110187878A1 (en) * 2010-02-02 2011-08-04 Primesense Ltd. Synchronization of projected illumination with rolling shutter of image sensor
AT509562A1 (de) * 2010-02-24 2011-09-15 Thallner Erich Leuchteinrichtung und verfahren zur herstellung einer solchen
US9013890B2 (en) 2010-03-26 2015-04-21 Infineon Technologies Ag Semiconductor packages and methods for producing the same
JP5082083B2 (ja) * 2010-04-15 2012-11-28 株式会社リキッド・デザイン・システムズ Ｌｅｄ照明装置
KR101028329B1 (ko) * 2010-04-28 2011-04-12 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
KR101039994B1 (ko) 2010-05-24 2011-06-09 엘지이노텍 주식회사 발광소자 및 이를 구비한 라이트 유닛
KR101103674B1 (ko) * 2010-06-01 2012-01-11 엘지이노텍 주식회사 발광 소자
CN103053167B (zh) 2010-08-11 2016-01-20 苹果公司 扫描投影机及用于3d映射的图像捕获模块
US9036158B2 (en) 2010-08-11 2015-05-19 Apple Inc. Pattern projector
TWI414050B (zh) * 2010-10-19 2013-11-01 聯京光電股份有限公司 封裝板與其製造方法
US20120268928A1 (en) * 2010-10-26 2012-10-25 Sargent Robert L Large single chip led device for high intensity packing
WO2012057276A1 (ja) * 2010-10-29 2012-05-03 東芝ライテック株式会社 発光モジュール、および照明器具
WO2012066501A1 (en) 2010-11-19 2012-05-24 Primesense Ltd. Depth mapping using time-coded illumination
US9131136B2 (en) 2010-12-06 2015-09-08 Apple Inc. Lens arrays for pattern projection and imaging
KR101883839B1 (ko) * 2010-12-07 2018-08-30 엘지이노텍 주식회사 발광소자 모듈 및 이를 포함하는 백라이트 유닛
DE202010016958U1 (de) * 2010-12-23 2011-06-27 Automotive Lighting Reutlingen GmbH, 72762 Leuchtmodul für eine Beleuchtungseinrichtung eines Kraftfahrzeugs mit auf einem Silizium-Substrat angeordneten Halbleiterlichtquellen
JP2012142410A (ja) * 2010-12-28 2012-07-26 Rohm Co Ltd 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置
KR20120093679A (ko) * 2011-02-15 2012-08-23 삼성전자주식회사 발광소자 패키지 및 그 제조방법
JP2014156614A (ja) * 2011-04-11 2014-08-28 Hitachi Ltd 電気アルミニウムめっき液
DE102011007328A1 (de) * 2011-04-13 2012-10-18 Robert Bosch Gmbh Vorrichtung und Verfahren zum Beeinflussen einer Abstrahlcharakteristik einer lichtemittierenden Diode
KR101865272B1 (ko) * 2011-07-26 2018-06-07 삼성전자주식회사 발광소자 모듈 및 이의 제조방법
US8749796B2 (en) 2011-08-09 2014-06-10 Primesense Ltd. Projectors of structured light
US8908277B2 (en) 2011-08-09 2014-12-09 Apple Inc Lens array projector
DE102011113483B4 (de) * 2011-09-13 2023-10-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Bauelementen und optoelektronisches Bauelement
US9329080B2 (en) 2012-02-15 2016-05-03 Aplle Inc. Modular optics for scanning engine having beam combining optics with a prism intercepted by both beam axis and collection axis
JP5985661B2 (ja) 2012-02-15 2016-09-06 アップル インコーポレイテッド 走査深度エンジン
US9201237B2 (en) 2012-03-22 2015-12-01 Apple Inc. Diffraction-based sensing of mirror position
JP2013222499A (ja) * 2012-04-12 2013-10-28 Sharp Corp 光源基板ユニット
US8877561B2 (en) 2012-06-07 2014-11-04 Cooledge Lighting Inc. Methods of fabricating wafer-level flip chip device packages
US8816383B2 (en) * 2012-07-06 2014-08-26 Invensas Corporation High performance light emitting diode with vias
JP2012216868A (ja) * 2012-07-10 2012-11-08 Shinko Electric Ind Co Ltd 電子部品用パッケージ及び電子部品装置
JP5131668B2 (ja) * 2012-07-27 2013-01-30 株式会社リキッド・デザイン・システムズ Ｌｅｄ照明装置
JP6209874B2 (ja) * 2012-08-31 2017-10-11 日亜化学工業株式会社 発光装置及びその製造方法
US9064773B2 (en) * 2012-10-26 2015-06-23 Lg Innotek Co., Ltd. Light emitting device package
CN113745962A (zh) 2013-06-19 2021-12-03 苹果公司 集成结构化光投影仪
US9230486B2 (en) * 2013-10-10 2016-01-05 Google Technology Holdings LLC Method and apparatus for displaying content on a display of an electronic device during different device operating modes
JP6255884B2 (ja) * 2013-10-16 2018-01-10 大日本印刷株式会社 光半導体装置、光半導体装置用リードフレーム、及びそれらの製造方法
US9528906B1 (en) 2013-12-19 2016-12-27 Apple Inc. Monitoring DOE performance using total internal reflection
US9823725B2 (en) 2014-08-11 2017-11-21 Google Technology Holdings LLC Method and apparatus for adjusting a sleep mode display mechanism of an electronic device
JP6374339B2 (ja) 2015-03-26 2018-08-15 日亜化学工業株式会社 発光装置
US10573794B2 (en) * 2015-05-29 2020-02-25 Hongli Zhihui Group Co.,Ltd. Method of packaging CSP LED and CSP LED
US10012831B2 (en) 2015-08-03 2018-07-03 Apple Inc. Optical monitoring of scan parameters
JP2017037900A (ja) 2015-08-07 2017-02-16 ローム株式会社 半導体装置およびその製造方法
JP6595840B2 (ja) 2015-08-20 2019-10-23 ローム株式会社 半導体装置およびその製造方法
JP6813314B2 (ja) 2016-09-15 2021-01-13 ローム株式会社 半導体装置およびその製造方法
US10073004B2 (en) 2016-09-19 2018-09-11 Apple Inc. DOE defect monitoring utilizing total internal reflection
JP6885701B2 (ja) 2016-10-17 2021-06-16 ローム株式会社 半導体装置
JP6894754B2 (ja) 2017-05-10 2021-06-30 ローム株式会社 半導体装置
US10153614B1 (en) 2017-08-31 2018-12-11 Apple Inc. Creating arbitrary patterns on a 2-D uniform grid VCSEL array
JP7252386B2 (ja) * 2018-02-13 2023-04-04 ローム株式会社 半導体装置および半導体装置の製造方法
JP7025948B2 (ja) 2018-02-13 2022-02-25 ローム株式会社 半導体装置および半導体装置の製造方法
EP3544066A1 (en) * 2018-03-23 2019-09-25 Excellence Opto. Inc. High heat dissipation light emitting diode package structure having at least two light cups and lateral light emission
US11422292B1 (en) 2018-06-10 2022-08-23 Apple Inc. Super-blazed diffractive optical elements with sub-wavelength structures
KR20200129867A (ko) * 2019-05-10 2020-11-18 안상정 반도체 발광소자
CN113228312B (zh) * 2018-12-27 2024-08-13 波主有限公司 半导体发光器件
JP7267767B2 (ja) 2019-02-20 2023-05-02 ローム株式会社 半導体装置および半導体装置の製造方法
US11681019B2 (en) 2019-09-18 2023-06-20 Apple Inc. Optical module with stray light baffle
US11506762B1 (en) 2019-09-24 2022-11-22 Apple Inc. Optical module comprising an optical waveguide with reference light path
US11754767B1 (en) 2020-03-05 2023-09-12 Apple Inc. Display with overlaid waveguide
TWI765569B (zh) * 2021-02-08 2022-05-21 健策精密工業股份有限公司 導線架結構及其製造方法
WO2022197339A1 (en) 2021-03-17 2022-09-22 Apple Inc. Waveguide-based transmitters with adjustable lighting

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5418692A (en) * 1977-07-13 1979-02-10 Oki Electric Ind Co Ltd Light emitting device with reflector
JP2574388B2 (ja) * 1988-05-10 1997-01-22 松下電器産業株式会社 発光ダイオードおよびその電極の形成方法
JP2508409Y2 (ja) * 1990-10-12 1996-08-21 サンケン電気株式会社 発光表示装置
JP2525554Y2 (ja) * 1990-11-19 1997-02-12 サンケン電気株式会社 発光表示装置
JPH0529659A (ja) * 1991-07-23 1993-02-05 Sharp Corp 側面発光型ｌｅｄランプとその製造方法
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP2001308443A (ja) * 2000-04-26 2001-11-02 Hitachi Ltd サブマウント
JP4555504B2 (ja) * 2000-05-11 2010-10-06 株式会社ミツトヨ 機能デバイスユニット及びその製造方法
JP3775480B2 (ja) * 2001-03-13 2006-05-17 セイコーエプソン株式会社 光モジュールの製造方法
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode
JP3973082B2 (ja) * 2002-01-31 2007-09-05 シチズン電子株式会社 両面発光ｌｅｄパッケージ
JP2004095482A (ja) * 2002-09-03 2004-03-25 Chi Mei Electronics Corp 画像表示装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1791190A1 (en) * 2005-11-25 2007-05-30 Samsung Electro-Mechanics Co., Ltd. Side view light emitting diode package
EP2112698A1 (en) * 2005-11-25 2009-10-28 Samsung Electro-Mechanics Co., Ltd. Side view light emitting diode package
EP2315265A1 (en) * 2005-11-25 2011-04-27 Samsung LED Co., Ltd. Side view light emitting diode package
US10096756B2 (en) 2005-11-25 2018-10-09 Samsung Electronics Co., Ltd. Side view light emitting diode package
EP1958266A4 (en) * 2005-12-08 2012-10-17 Korea Electronics Telecomm SILICON LED WITH MIRROR REFLECTIVE LATERAL
WO2008025625A1 (de) * 2006-08-30 2008-03-06 Robert Bosch Gmbh Leuchtmodul
WO2009015798A3 (en) * 2007-08-02 2009-04-23 Perkinelmer Elcos Gmbh Mounting structure for leds, led assembly, led assembly socket, method for forming a mounting structure
DE102012103161A1 (de) * 2012-04-12 2013-10-17 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil

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