JP2007266313A - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP2007266313A JP2007266313A JP2006089564A JP2006089564A JP2007266313A JP 2007266313 A JP2007266313 A JP 2007266313A JP 2006089564 A JP2006089564 A JP 2006089564A JP 2006089564 A JP2006089564 A JP 2006089564A JP 2007266313 A JP2007266313 A JP 2007266313A
- Authority
- JP
- Japan
- Prior art keywords
- light
- led
- intensity
- leds
- blue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】発光部1は、赤色光を放射する赤色LED10と、緑色光を放射する緑色LED11と、青色光を放射する青色LED12とを備え、白色光を生成する。ベース部材2は、各LED10〜12が実装されたものである。各光検出部60〜62のそれぞれは、互いに異なるLED10〜12と対向してベース部材2内に設けられ、対向するLED10〜12から放射された光を検出する。制御部7は、各光検出部60〜62で検出された発色光の強度が、予め決められた発色光の強度となるように、各LED10〜12に供給される電流を制御する。
【選択図】図1
Description
本発明の実施形態1について図1を用いて説明する。図1は、実施形態1の発光装置を示す図である。
本発明の実施形態2について図1を用いて説明する。
本発明の実施形態3について図1を用いて説明する。
本発明の実施形態4について図2を用いて説明する。図2は、実施形態4の発光装置を示す図である。
本発明の実施形態5について図3を用いて説明する。図3は、実施形態5の発光装置を示す図である。
本発明の実施形態6について図1を用いて説明する。
本発明の実施形態7について図1を用いて説明する。
10 赤色LED
11 緑色LED
12 青色LED
2 ベース部材
60〜62 光検出部
7 制御部
Claims (1)
- 電流が供給されるとそれぞれが光を放射する複数のLEDと、
前記複数のLEDが実装されたベース部材と、
それぞれが、互いに異なる前記LEDと対向して前記ベース部材内に設けられ、対向する当該LEDから放射された光を検出する複数の光検出部と、
前記複数の光検出部のそれぞれで検出された光の強度が、予め決められた光の強度となるように、前記複数のLEDのそれぞれに供給される電流を制御する制御部と
を備えることを特徴とする発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006089564A JP2007266313A (ja) | 2006-03-28 | 2006-03-28 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006089564A JP2007266313A (ja) | 2006-03-28 | 2006-03-28 | 発光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007266313A true JP2007266313A (ja) | 2007-10-11 |
Family
ID=38639007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006089564A Pending JP2007266313A (ja) | 2006-03-28 | 2006-03-28 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2007266313A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011003594A (ja) * | 2009-06-16 | 2011-01-06 | Panasonic Electric Works Co Ltd | Led発光装置、ledモジュール及び照明装置 |
JP2013546184A (ja) * | 2010-11-10 | 2013-12-26 | ▲セン▼國光 | カバーの作製方法及びパッケージ化発光ダイオードの作製方法 |
CN108076563A (zh) * | 2016-11-16 | 2018-05-25 | 迈来芯科技有限公司 | 具有发光二极管的设备 |
US10193033B2 (en) | 2015-12-25 | 2019-01-29 | Nichia Corporation | Light emitting device |
US11837679B2 (en) | 2020-10-30 | 2023-12-05 | Tohoku University | Display device |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61224470A (ja) * | 1985-03-29 | 1986-10-06 | Toshiba Corp | 半導体発光装置 |
JPH03222384A (ja) * | 1990-01-26 | 1991-10-01 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JPH1049074A (ja) * | 1996-08-02 | 1998-02-20 | Shichizun Denshi:Kk | カラー表示装置 |
JPH11161197A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 画像表示装置 |
JP2002344031A (ja) * | 2001-03-14 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 照明装置 |
JP2004039691A (ja) * | 2002-06-28 | 2004-02-05 | Matsushita Electric Ind Co Ltd | Led照明装置用の熱伝導配線基板およびそれを用いたled照明装置、並びにそれらの製造方法 |
JP2005277380A (ja) * | 2004-02-23 | 2005-10-06 | Stanley Electric Co Ltd | Led及びその製造方法 |
JP2006278368A (ja) * | 2005-03-28 | 2006-10-12 | Sony Corp | 光源装置および表示装置 |
JP2007226246A (ja) * | 2006-02-23 | 2007-09-06 | Samsung Electronics Co Ltd | 発光ダイオード基板とその製造方法、及びそれを用いた液晶表示装置 |
-
2006
- 2006-03-28 JP JP2006089564A patent/JP2007266313A/ja active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61224470A (ja) * | 1985-03-29 | 1986-10-06 | Toshiba Corp | 半導体発光装置 |
JPH03222384A (ja) * | 1990-01-26 | 1991-10-01 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JPH1049074A (ja) * | 1996-08-02 | 1998-02-20 | Shichizun Denshi:Kk | カラー表示装置 |
JPH11161197A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 画像表示装置 |
JP2002344031A (ja) * | 2001-03-14 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 照明装置 |
JP2004039691A (ja) * | 2002-06-28 | 2004-02-05 | Matsushita Electric Ind Co Ltd | Led照明装置用の熱伝導配線基板およびそれを用いたled照明装置、並びにそれらの製造方法 |
JP2005277380A (ja) * | 2004-02-23 | 2005-10-06 | Stanley Electric Co Ltd | Led及びその製造方法 |
JP2006278368A (ja) * | 2005-03-28 | 2006-10-12 | Sony Corp | 光源装置および表示装置 |
JP2007226246A (ja) * | 2006-02-23 | 2007-09-06 | Samsung Electronics Co Ltd | 発光ダイオード基板とその製造方法、及びそれを用いた液晶表示装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011003594A (ja) * | 2009-06-16 | 2011-01-06 | Panasonic Electric Works Co Ltd | Led発光装置、ledモジュール及び照明装置 |
JP2013546184A (ja) * | 2010-11-10 | 2013-12-26 | ▲セン▼國光 | カバーの作製方法及びパッケージ化発光ダイオードの作製方法 |
US10193033B2 (en) | 2015-12-25 | 2019-01-29 | Nichia Corporation | Light emitting device |
US10490714B2 (en) | 2015-12-25 | 2019-11-26 | Nichia Corporation | Light emitting device |
CN108076563A (zh) * | 2016-11-16 | 2018-05-25 | 迈来芯科技有限公司 | 具有发光二极管的设备 |
US11837679B2 (en) | 2020-10-30 | 2023-12-05 | Tohoku University | Display device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2027412B1 (en) | Lighting device | |
JP4857633B2 (ja) | Led光源 | |
KR102454413B1 (ko) | 발광 장치 및 이를 포함하는 차량용 램프 | |
JP5192666B2 (ja) | 発光装置 | |
US8030672B2 (en) | Semiconductor light emitting device including a plurality of semiconductor light emitting elements and a wavelength conversion layer having different thickness portions | |
TWI588969B (zh) | 可調控色溫元件產生具有不同色溫之白光的方法 | |
KR20130063527A (ko) | Led 기반 발광 시스템 및 디바이스 | |
KR20080054402A (ko) | 가변 컬러 발광 장치와, 그를 포함하는 조명 시스템, 조명시스템 네트워크 및 어셈블리, 및 그를 위한 제어기 및제어 방법 | |
EP2527728B1 (en) | Variable color light emitting device and illumination apparatus using the same | |
JP2009534866A (ja) | 横向き平面実装白色led | |
JP2010129583A (ja) | 照明装置 | |
EP2672513B1 (en) | Multichip package structure for generating a symmetrical and uniform light-blending source | |
US8941335B2 (en) | Semiconductor light-emitting element and flash-light device | |
JP2011187962A (ja) | 発光装置 | |
JP2010118531A (ja) | 白色照明装置および車輛用灯具 | |
WO2009104135A1 (en) | Illumination device with integrated light sensor | |
KR20080017053A (ko) | Led가 포함된 조명 시스템 | |
US10412808B2 (en) | Light emitting module and lighting device having same | |
JP2007266313A (ja) | 発光装置 | |
JP2006344617A (ja) | 発光装置ユニット | |
US11004834B2 (en) | LED unit | |
JP2013191685A (ja) | 発光装置及びそれを用いた照明装置 | |
JP2007266314A (ja) | 発光装置 | |
JP6694292B2 (ja) | Ledモジュール | |
JP2010073592A (ja) | 照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090113 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20100802 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110525 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110628 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110829 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20111025 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20120112 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120125 |
|
A911 | Transfer of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20120130 |
|
A912 | Removal of reconsideration by examiner before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20120302 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130218 |