CN1926675A - 各向异性导电连接方法及各向异性导电粘合膜 - Google Patents

各向异性导电连接方法及各向异性导电粘合膜 Download PDF

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CN1926675A
CN1926675A CNA200480041972XA CN200480041972A CN1926675A CN 1926675 A CN1926675 A CN 1926675A CN A200480041972X A CNA200480041972X A CN A200480041972XA CN 200480041972 A CN200480041972 A CN 200480041972A CN 1926675 A CN1926675 A CN 1926675A
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anisotropic conductive
adhesive film
circuit board
conductive adhesive
anisotropic
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CN1926675B (zh
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小西美佐夫
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Dexerials Corp
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Sony Chemical and Information Device Corp
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Abstract

本发明使得用各向异性导电粘合膜电连接电路板的连接端子与电子元件的连接部时，提高导电粒子的捕获性的同时，确保各向异性导电连接时全体的流动性，并可在不增大压接时压力的情况下，将电路板和电子元件以充分的强度互相虚粘合。在电路板1上配置含有导电粒子2的光固化型各向异性导电粘合膜4，在该各向异性导电粘合膜4上，配置具有与电路板1的连接端子1b对应的曝光图案的曝光用掩模5，隔着曝光用掩模5，对该各向异性导电粘合膜4照射光，使光照射的该各向异性导电粘合膜4的曝光部4a光聚合，使其熔融粘度增大，接着除去曝光用掩模5，从各向异性导电粘合膜4侧使电子元件6的连接部6a对电路板1的连接端子1b定位并使两者粘接，通过使各向异性导电粘合膜4光聚合，将电路板1的连接端子1b与电子元件6的连接部6a连接。

Description

各向异性导电连接方法及各向异性导电粘合膜
技术领域
本发明涉及将电路板的连接端子与电子元件的连接部电连接的方法，以及使用该方法的各向异性导电粘合膜。
背景技术
一直以来，如图4(a)所示，使用在热固化型树脂42上分散导电粒子41的各向异性导电粘合膜43进行电路板的连接端子与其它电路板或IC芯片等电子元件的连接部的连接。
可是，为了提高这种各向异性导电粘合膜的连接可靠性，要求提高各向异性导电连接时电路板的连接端子与电子元件的连接部之间的导电粒子的捕获性。为此，如图4(b)所示，与图4(a)的场合相比增大整个各向异性导电粘合膜43的导电粒子数，或者，如图4(c)所示，与图4(a)的场合相比导电粒子数的总量不变，但层叠增大了导电粒子密度的薄膜和不含导电粒子的热固化型粘合剂层44，作成各向异性导电粘合膜43。
但是，如图4(b)或图4(c)所示形态中，导电粒子的捕获性并不充分，因此，尝试利用专利文献1的带层间绝缘粘合剂的膜的熔融粘度调节技术，调节树脂成分，增大整个各向异性导电粘合膜的熔融粘度，从而各向异性导电连接时抑制导电粒子在热压接过程中从连接区域移动到非连接区域。
专利文献1：日本特开2000-104033号公报
发明的公开
但是，增大各向异性导电粘合膜全体的熔融粘度，各向异性导电连接时全体难以流动，因此需要增大压接时的压力，根据情况会有电路板或电子元件受损伤的问题。另外，在热压接前使电路板和电子元件互相虚粘合时，粘合力并不充分，存在容易发生剥离或错位的问题。
本发明的目的在于：在用各向异性导电粘合膜将电路板的连接端子与电子元件的连接部各向异性导电连接时，提高导电粒子的捕获性，同时确保各向异性导电粘合膜全体的流动性，以使压接时的压力不会增大，并可使电路板与电子元件以充分的强度互相虚粘合。
本发明人使用光固化型绝缘性树脂作为用于各向异性导电粘合膜的绝缘性粘合剂，若光照射到电路板的连接端子上或连接端子周围上的各向异性导电粘合膜，使电路板和电子元件以充分的强度互相虚粘合，且确保各向异性导电连接时全体的流动性，同时能够增大各连接端子上或连接端子周围上的各向异性导电粘合膜的熔融粘度，结果，发现了压接时不增大压力也能提高各向异性连接部位的导电粒子的捕获性，完成本发明。
即，本发明第一方面提供各向异性导电连接方法，将电路板的连接端子与电子元件的连接部各向异性导电连接，其中包括以下工序(a)～(d)：
工序(a)在电路板上，配置导电粒子分散到光固化型绝缘性粘合剂而构成的各向异性导电粘合膜的工序；
工序(b)在该各向异性导电粘合膜上，配置具有与电路板的连接端子对应的曝光图案的曝光用掩模的工序；
工序(c)隔着曝光用掩模对该各向异性导电粘合膜照射光，使光照射的该各向异性导电粘合膜的曝光部光聚合，增大其熔融粘度的工序；以及
工序(d)除去曝光用掩模，从各向异性导电粘合膜侧将电子元件的连接部对于电路板的连接端子定位并使两者粘接，然后对各向异性导电粘合膜全体照射光，使全体光聚合，从而将电路板的连接端子与电子元件的连接部连接的工序。
另外，本发明第二方面提供各向异性导电连接方法，将电路板的连接端子与电子元件的连接部各向异性导电连接，其中包括以下工序(a′)～(d′)：
工序(a′)在电路板上，配置导电粒子分散到光固化型绝缘性粘合剂而构成的各向异性导电粘合剂层和其至少一面上设置热固化型粘合剂层的层叠型各向异性导电粘合膜的工序；
工序(b′)在层叠型各向异性导电粘合膜上，配置具有与电路板的连接端子对应的曝光图案的曝光用掩模的工序；
工序(c′)隔着曝光用掩模对该层叠型各向异性导电粘合膜照射光，使光照射的层叠型各向异性导电粘合膜的光固化型各向异性导电粘合剂层的曝光部光聚合，增大其熔融粘度的工序；以及
工序(d′)除去曝光用掩模，从层叠型各向异性导电粘合膜侧将电子元件的连接部对电路板的连接端子定位并使两者粘接，然后至少将热固化型粘合剂层固化，从而将电路板的连接端子与电子元件的连接部连接的工序。
另外，本发明第三方面提供各向异性导电粘合膜，该各向异性导电粘合膜由导电粒子分散到光固化型绝缘性粘合剂而构成的各向异性导电粘合剂层构成，其中，按照各向异性导电连接图案，在各向异性导电粘合膜的各向异性导电粘合剂层中设置不同熔融粘度的区域。
依据本发明，用各向异性导电粘合剂或各向异性导电粘合膜将电路板的连接端子与电子元件的连接部电连接时，能够提高导电粒子的捕获性，并可确保各向异性导电连接时全体的流动性，可不增大压接时的压力，并可使电路板和电子元件以充分的强度互相粘合。
附图的简单说明
图1是本发明的各向异性导电连接方法的工序说明图。
图2是本发明的各向异性导电连接方法的工序说明图。
图3是本发明的各向异性导电粘合膜的剖视图。
图4是传统的各向异性导电粘合膜的剖视图。
(符号说明)
1、21电路板，1b、21b连接端子，2、22导电粒子，3、33光固化型绝缘性粘合剂，4、26各向异性导电粘合膜，24光固化型各向异性导电粘合剂层，4a、24a曝光部，4b、24b非曝光部
本发明的最佳实施方式
以下参照图1，按每个工序说明本发明第一方面的将电路板的连接端子与电子元件的连接部各向异性导电连接的方法。
工序(a)
如图1(a)所示，在电路板1上，配置导电粒子2分散到光固化型绝缘性粘合剂3的光固化型的各向异性导电粘合膜4。
作为电路板1，可使用具以下结构的电路板：柔性印刷电路板(日本特开平11-013654号公报等)、半导体装置用中继板(日本特开平11-097101号公报等)、带凸起的布线电路板(日本特开2000-303745号公报等)、陶瓷布线电路板、使用预成型料的多层布线电路板等公知的电路板，但基本上使用聚酰亚胺膜或铝片等绝缘性基板1a上形成将铜箔等金属箔图案化的布线电路(未图示)，在布线电路的端部上，形成用以与其它电子元件(例如，柔性电路板、IC芯片、天线元件、电容器元件、电阻元件等)连接的连接端子1b。可在端子间形成公知的绝缘性覆盖层1c。
作为构成光固化型的各向异性导电粘合膜4的导电粒子，可使用各向异性导电粘合膜中使用的公知导电粒子。可采用例如镍、铁、铜、铝、锡、铅、铬、钴、银、金等各种金属或金属合金的粒子、金属氧化物、碳、石墨、玻璃或陶瓷、塑料等在粒子表面镀金属的导电粒子，或者在这些粒子表面再镀覆绝缘薄膜的导电粒子等。这些导电粒子的粒径或材料，可根据需连接的电路板的布线节距或图案、连接端子的厚度或材料等进行适当选择。
作为构成光固化型的各向异性导电粘合膜4的光固化型绝缘性粘合剂3，可使用公知的游离基聚合型或者阳离子聚合型的光固化型粘合剂。这里，“光”指的是例如紫外线、电子束、X线等激活能射线等。另外，作为光固化型粘合剂的粘合成分，例如有光聚合性丙烯类化合物，优选分子量(重量平均分子量)10000以下的丙烯类单体或低聚物。尤其优选列举(甲基)丙烯酸烷基酯、(甲基)丙烯酸芳基烷基酯，氨基甲酸乙酯改性丙烯酸酯、环氧改性丙烯酸酯等。它们可单独使用或者并用2种以上。
光固化型绝缘性粘合剂3中，作为光聚合引发剂，可使用公知的光固化型丙烯类粘合剂中使用的光聚合引发剂。可列举例如二苯甲酮类、苯乙酮类、苯偶姻、苯偶姻烷基醚类、苄基、苄基二甲醛缩苯乙酮、酰基氧化磷类、噻吨酮类的各光聚合引发剂。这些光聚合引发剂可单独或者组合使用。另外，也可添加脂肪族胺或芳族胺作为光聚合助剂。
光聚合引发剂的使用量因使用的光固化型粘合成分而异，但使用聚合性丙烯类化合物时，相对聚合性丙烯类化合物100重量分，优选0.1～10重量分。
在光固化型绝缘性粘合剂3中，除了上述成分以外，根据需要适当配合酚氧树脂或环氧树脂等热塑性树脂、交联剂、各种橡胶组成、充填剂、拉平剂、粘度调节剂，防氧化剂等。
根据需要光固化型的各向异性导电粘合膜4将例如构成光固化型绝缘性粘合剂3的各成分、导电粒子、光聚合引发剂以及其它添加成分，与甲苯等溶剂和均匀地混合，并在聚对苯二甲酸乙酯(PET)片等剥离片上涂敷，可通过干燥后膜化来制造。
工序(b)
接着，如图1(b1)或(b2)所示，在各向异性导电粘合膜4上配置具有与电路板1的连接端子1b对应的曝光图案的曝光用掩模5。在这种情况下，曝光用掩模5的曝光图案是使光照射到电路板1的连接端子1b上各向异性导电粘合膜4的图案(图1(b1))，或者是使光照射到电路板1的连接端子1b周围的各向异性导电粘合膜4的图案(，图1(b2))。这里，连接端子1b周围不仅包括以圆或正方形包围连接端子1b的场合，而且还包括线状挟持的场合或以L字形包围的场合。
还有，曝光用掩模5除了具有与电路板1的连接端子1b对应的曝光图案以外，可作成与传统公知的曝光用掩模相同的结构。
工序(c)
接着，隔着曝光用掩模5，对各向异性导电粘合膜4照射光，使光照射的各向异性导电粘合膜4的曝光部光聚合，使该部分的熔融粘度增大。这里，采用图1(b1)的曝光图案的场合，如图1(c1)所示，电路板1的连接端子1b上各向异性导电粘合膜的曝光部4a的熔融粘度变高。结果，能够提高该曝光部4a上的导电粒子的捕获性。而且，在各向异性导电粘合膜4的非曝光部不进行光聚合反应，因此能够将电路板1和电子元件以充分的强度互相虚粘合，并且能够确保各向异性导电连接时各向异性导电粘合膜4全体的流动性，无需过分提升压接时的压力。
另外，采用图1(b2)的曝光图案的场合，如图1(c2)所示，电路板1的连接端子1b周围上的各向异性导电粘合膜的曝光部4a的熔融粘度变高。结果，连接端子上各向异性导电粘合膜的非曝光部4b的熔融粘度不会变高，因而从熔融粘度的方面来看导电粒子2在压接时容易从连接端子1b上逃脱，在该非曝光部4b周围形成熔融粘度高的区域，结果，可提高该非曝光部4b的导电粒子的捕获性。并且，由于在各向异性导电粘合膜4的非曝光部中不进行光聚合反应，可使电路板1和电子元件以充分的强度互相虚粘合，并且能够确保各向异性导电连接时各向异性导电粘合膜4全体的流动性，与图1(c1)的场合相比，可进一步减小压接时的压力。因而，适合以较大面积凸起连接的场合。
工序(d)
接着，除去曝光用掩模5，从各向异性导电粘合膜4侧将电子元件6的连接部6a对电路板1的连接端子1b进行定位并使两者粘接，使光照射到各向异性导电粘合膜4全体，使全体光聚合，从而能以良好的连接可靠性将电路板1的连接端子1b和电子元件的连接部各向异性导电连接(图1(d))。这里，作为电子元件6，例如有与电路板1同样的电路板或柔性线路板、IC芯片、天线元件、电容器元件、电阻元件等，另外该连接部6a可采用公知的凸起或电极焊盘结构。
接着，参照图2的每个工序说明本发明第二方面的各向异性导电连接方法。还有，在第二方面的各向异性导电连接方法中，与第一方面的各向异性导电连接方法的不同点在于：使用至少在一面设有热固化型粘合层的层叠型各向异性导电粘合膜。通过使用这种层叠型各向异性导电粘合膜，如图4(c)相关说明那样，能够减薄含有导电粒子的层厚度并提高导电粒子密度，并可在不增大导电粒子总量的情况下实现良好的连接可靠性，结果能降低各向异性连接成本。
工序(a′)
首先，如图2(A1)或图2(A2)所示，在电路板21上，配置导电粒子22分散到光固化型绝缘性粘合剂23的光固化型的各向异性导电粘合剂层24和在其至少一面设有热固化型粘合剂层25的层叠型各向异性导电粘合膜26。这里，在图2(A1)的场合，使在一面设有热固化型粘合剂层25的层叠型各向异性导电粘合膜26配置成在电路板21侧设有各向异性导电粘合剂层24，但也可不在电路板21侧设置热固化型粘合剂层25。另外，在图2(A2)的场合，可使用在两面设有热固化型粘合剂层25的层叠型各向异性导电粘合膜26。
作为构成热固化型粘合剂层25的热固化型树脂，例如有环氧树脂、氨基甲酸乙酯树脂、未饱和聚酯树脂等。其中，优选使用在常温下固体的环氧树脂。这时，可以并用在常温下液状的环氧树脂。液状环氧树脂对常温下固形的环氧树脂的配合比率，可根据对各向异性导电粘合膜的要求性能适当确定。另外，当进一步提高上述的由固形或液状的环氧树脂构成的膜的可挠性程度，从而进一步提高各向异性导电粘合膜的剥离强度时，尤其优选这些环氧树脂上再并用可挠性环氧树脂。这时，由于热固化性绝缘性粘合剂中可挠性环氧树脂的含有量过少时不能得到充分的可挠性环氧树脂的添加效果，而过多时耐热性下降，所以优选5～35重量％，更优选5～25重量％。
还有，电路板21、导电粒子22及光固化型绝缘性粘合剂23也可使用分别与图1相关说明同样的电路板1、导电粒子2及光固化型绝缘性粘合剂3。
层叠型各向异性导电粘合膜26例如根据需要将构成光固化型绝缘性粘合剂3的各成分、导电粒子、光聚合引发剂及其它添加成分均匀混合到甲苯等溶剂，并在PET片等剥离片上涂敷并干燥，从而作成光固化型的各向异性导电粘合膜，另一方面，能够通过铸造法或冲模挤出法等将热固化性树脂薄膜化，并通过公知的叠片法层叠两膜来作成。
工序(b′)
接着，在图2(A1)所示的层叠型各向异性导电粘合膜26上，配置具有与电路板21的连接端子21b对应的曝光图案的曝光用掩模27。该工序是与图1形态的工序(b)相同的操作。这里，图2(B1)中示出曝光用掩模27的曝光图案是可使光照射到电路板21的连接端子21b上层叠型各向异性导电粘合膜26的图案的场合，而在图2(B2)示出曝光用掩模5的曝光图案是可使光照射到电路板21的连接端子21b周围上的层叠型各向异性导电粘合膜26的图案的场合。
还有，图2(A2)的场合也与图2(A1)的场合同样可配置曝光用掩模27(未图示)。
工序(c′)
接着，隔着曝光用掩模27，使光照射到层叠型各向异性导电粘合膜26，使光照射的层叠型各向异性导电粘合膜26的各向异性导电粘合剂层24的曝光部24a光聚合，使该部分的熔融粘度增大。这里，在图2(B1)的曝光图案的场合，如图2(C1)所示，电路板21的连接端子21b上各向异性导电粘合膜26的各向异性导电粘合剂层24的曝光部24a的熔融粘度变高。结果，能够提高该曝光部24a的导电粒子22的捕获性。而且，由于不会在各向异性导电粘合膜26的各向异性导电粘合剂层24的非曝光部24b中进行光聚合反应，可将电路板21和电子元件以充分的强度互相虚粘合，而且能够确保各向异性导电连接时各向异性导电粘合膜26全体的流动性，不必过度提升压接时压力。
另外，在图2(B2)的曝光图案的场合，如图2(C2)所示，电路板21的连接端子21b周围上各向异性导电粘合膜26的各向异性导电粘合剂层24的曝光部24a的熔融粘度变高。结果，连接端子21b上各向异性导电粘合膜26的各向异性导电粘合剂层24的非曝光部24b的熔融粘度不会变高，因而从熔融粘度的观点来说导电粒子22容易在压接时从连接端子21b上逃脱，但由于该非曝光部24b周围形成熔融粘度高的区域(坝)，结果能够提高该非曝光部24b的导电粒子22的捕获性。并且，由于不会在各向异性导电粘合膜26的各向异性导电粘合剂层24的非曝光部24b进行光聚合反应，可将电路板21和电子元件以充分的强度互相虚粘合，而且能够确保各向异性导电连接时各向异性导电粘合膜26全体的流动性，与图1(c1)的场合相比，可进一步减小压接时压力，适合较大面积的凸起连接。
工序(d′)
接着，除去曝光用掩模27，将电子元件28的连接部28a从层叠型各向异性导电粘合膜26侧对电路板21的连接端子21b定位并使两者粘接，通过至少将热固化型粘合剂层25热固化，将电路板21的连接端子21b与电子元件28的连接部28a连接。这时，可对光固化型的各向异性导电粘合剂层24照射光来固化。由此，能够使电路板21的连接端子21b与电子元件28的连接部28a以良好的连接可靠性各向异性导电连接(图2(D))。这里，作为电子元件28，可使用与图1(d)中说明的电子元件6相同的电子元件。
以上可在本发明第一和第二方面的各向异性导电连接方法中使用的各向异性导电粘合膜31，如图3(a)所示，由导电粒子32分散到光固化型绝缘性粘合剂33而构成的各向异性导电粘合剂层构成，根据各向异性导电连接图案，在各向异性导电粘合膜31中具有熔融粘度不同的区域，即相对熔融粘度较高的区域X和较低的区域Y。
当各向异性导电连接部位为区域X时，如图1(b1)和图2(B1)中说明的那样，区域X相当于熔融粘度增大的曝光部，因光照射而产生光聚合。因而，如图1(c1)和图2(C1)中说明的那样，可在区域X提高导电粒子的捕获性。另外，能够将电路板和电子元件以充分的强度互相虚粘合，而且能够确保各向异性导电连接时各向异性导电粘合膜全体的流动性，不必过度提升压接时压力。
另外，在各向异性导电连接部位为区域Y的场合，如图1(b2)和图2(B2)中说明的那样，区域Y是由各向异性导电接部位周围熔融粘度较高的区域X包围的区域，如图1(c1)和图2(C1)中说明的那样，结果能够提高该区域Y中导电粒子的捕获性。另外，能够将电路板和电子元件以充分的强度互相虚粘合，而且能够确保各向异性导电连接时各向异性导电粘合膜全体的流动性，与图1(c1)的场合相比，可进一步减小压接时压力，适合较大面积的凸起连接。
另外，该各向异性导电粘合膜31中，如图3(b)所示，可在其一面(图3(b))或两面设置热固化型粘合剂层34。
还有，导电粒子32、光固化型绝缘性粘合剂33、热固化型粘合剂层34可作成分别与上述的导电粒子2、光固化型绝缘性粘合剂3、热固化型粘合剂层25同样的结构。
实施例
实施例1～3、比较例1～2
将表1所示的成分均匀混合到甲苯和乙酸酯的混合溶剂(重量比1∶1)，使固形量成为60重量％，从而调制出紫外线固化型粘合剂组成物，将该紫外线固化型粘合剂组成物涂敷到经剥离处理后的聚对苯二甲酸乙酯膜，使干燥厚度成为20μm或40μm，并在80℃干燥5分钟后制作出光固化型各向异性导电粘合膜。该膜的熔融粘度(用电流计RS150(哈克(HAAKE)公司)测定)在紫外线照射前为6.0×106mPa·s(80℃)，在紫外线照射(200mJ/cm2(320～390nm))后为3.0×108mPa·s(80℃))。
另外，将表2所示成分均匀混合到甲苯和乙酸酯的混合溶剂(重量比1∶1)，使固形量成为60重量％，从而调制出热固化型粘合剂组成物，将该热固化型粘合剂组成物涂敷到经剥离处理后的聚对苯二甲酸乙酯膜，使干燥厚度成为10μm、20μm或40μm，并在80℃干燥5分钟后制作出热固化型粘合膜。该膜的熔融粘度(用电流计RS150(哈克公司)测定)为6.0×106mPa·s(80℃)。
作为实施例1的光固化型各向异性导电粘合膜，使用40μm厚度的单层光固化型各向异性导电粘合膜，作为实施例2和实施例3的层叠型各向异性导电粘合膜，使用在20μm厚度的光固化型各向异性导电粘合膜的一面上用普通的叠片法层叠20μm厚度的热固化型粘合膜的层叠膜，作为实施例3的层叠型各向异性导电粘合膜，使用在20μm厚度的光固化型各向异性导电粘合膜的两面上用普通的叠片法层叠10μm厚度的热固化型粘合膜的层叠膜。
另外，作为比较例1的热固化型各向异性导电粘合膜，将表3所示成分均匀混合到甲苯和乙酸酯的混合溶剂(重量比1∶1)，使固形量成为60重量％，从而调制出热固化型粘合剂组成物，并将该热固化型粘合剂组成物涂敷到经剥离处理后的聚对苯二甲酸乙酯膜，使干燥厚度成为40μm，在80℃干燥5分钟后制作出热固化型粘合膜。该膜的熔融粘度(用电流计RS150(哈克公司)测定)为6.0×106mPa·s(80℃)。
另外，作为比较例2的热固化型各向异性导电粘合膜，将表4所示成分均匀混合到甲苯和乙酸酯的混合溶剂(重量比1∶1)，使固形量成为60重量％，从而调制出热固化型粘合剂组成物，并将该热固化型粘合剂组成物涂敷到经剥离处理后的聚对苯二甲酸乙酯膜，使干燥厚度成为40μm，在80℃干燥5分钟后制作出热固化型粘合膜。该膜的熔融粘度(用电流计RS150(哈克公司)测定)为9.0×107mPa.s(80℃)。
(表1)
 成分   重量分
 苯氧基树脂(YP50，东都化学公司制)   10
 环氧树脂(HP720H，大日本墨水化学工业公司制)   10
 含有环氧基的环氧丙烯酸酯低聚物(EB3605，UNION CARBIDE公司制)   10
 环氧树脂(HX3941HP，大日本墨水化学工业公司制)   10
 光聚合引发剂(TPO，BASF公司制)   1
 导电粒子(Ni/镀金树脂粒子(3.2μm)，日本化学工业公司制)   9
(表2)
  成分   重量分
  苯氧基树脂(YP50，东都化学公司制)   10
  环氧树脂(HP4032D，环氧当量136～150g/eq，大日本墨水化学工业公司制)   20
  环氧分散咪唑类固化剂(HX3941HP，旭化成环氧公司制)   15
(表3)
  成分   重量分
  苯氧基树脂(YP50，东都化学公司制)   10
  环氧树脂(HP4032D，环氧当量136～150g/eq，大日本墨水化学工业公司制)   20
  环氧分散咪唑类固化剂(HX3941HP，旭化成环氧公司制)   15
  导电粒子(Ni/镀金树脂粒子(3.2μm)，日本化学工业公司制)   10
(表4)
  成分   重量分
  苯氧基树脂(YP50，东都化学公司制)   20
  环氧树脂(HP4032D，环氧当量136～150g/eq，大日本墨水化学工业公司制)   10
  环氧分散咪唑类固化剂(HX3941HP，旭化成环氧公司制)   15
  导电粒子(Ni/镀金树脂粒子(3.2μm)，日本化学工业公司制)   10
对于制作的各实施例及比较例的各向异性导电粘合膜，按如下说明评价胶粘性。另外，使用制作的各实施例及比较例的各向异性导电粘合膜，对于实验用电路板和实验用透明液晶基板进行各向异性导电连接。按以下说明测定此时的粒子捕获数量。所获得的结果表示在表5中。
还有，对于实施例1的各向异性导电粘合膜，在实验用透明液晶基板上配置各向异性导电粘合膜，并对连接端子上各向异性导电粘合膜照射以200mJ/cm2(320～390nm)为条件的光后，使实验用电路板定位，以170℃×80MPa×10sec的条件进行热压接。
对于实施例2～3的各向异性导电粘合膜，在实验用透明液晶基板上配置各向异性导电粘合膜，并对连接端子上各向异性导电粘合膜照射以200mJ/cm2(320～390nm)为条件的光后，使实验用透明液晶基板定位，并在这种条件下进行热压接。还有，对于实施例2的各向异性导电粘合膜，在实验用透明液晶基板侧配置其背侧光固化性各向异性导电粘合剂层。
另外，对于比较例1～2的热固化型各向异性导电粘合膜，在实验用透明液晶基板上配置各向异性导电粘合膜，而且使实验用电路板定位，并在170℃×80MPa×10sec的条件下进行热压接。
胶粘性
用热压接法在40℃×0.5MPa×2sec的条件下，在玻璃板上热压接ACF(各向异性导电粘合膜)/剥离处理PET(聚对苯二甲酸乙酯)，然后，通过剥离处理剥去PET，并观察露出的ACF的状态。
(评价基准)
等级基准
○：ACF转贴到玻璃上的场合
×：ACF不转贴到玻璃上的场合
粒子捕获数量
用显微镜计算在压接后的IC的凸起(每个凸起的表面积＝2500μm2)上的导电粒子数量，并将该平均值作为粒子捕获数量。
(表5)
  评价标准            实施例        比较例
  1   2   3   1   2
  胶粘性   ○   ○   ○   ○   ×
  导电粒子捕获数量(个/2500μm2)   25   24   22   16   19
由表5可知，在实施例1的场合，使用紫外线固化型各向异性导电粘合剂单层的各向异性导电粘合膜，增大连接端子上粘合剂的熔融粘度，因此胶粘性也良好，导电粒子的捕获性也良好。在实施例2的场合，与实施例1的场合同样，增大连接端子上粘合剂的熔融粘度，但与实施例1的场合相比，在一面设置热固化性粘合剂层，同时使紫外线固化型各向异性导电粘合剂层的厚度成为一半。因此，不存在胶粘性的问题，而且，尽管将紫外线固化型各向异性导电粘合剂层的厚度减半，也能将导电粒子捕获数量的降低保持在实用上不会出问题的4％。在实施例3的场合，与实施例1的场合同样，增大连接端子上粘合剂的熔融粘度，但与实施例1的场合相比，在两面设置热固化性粘合剂层，并将紫外线固化型各向异性导电粘合剂层的厚度减半。因此，胶粘性上不会有问题，而且，尽管将紫外线固化型各向异性导电粘合剂层的厚度减半，也能将降低保持在实用上不会出问题的12％。
另一方面，在比较例1和比较例2的场合，由于使用热固化型各向异性导电粘合剂单层的各向异性导电粘合膜，发现导电粒子的捕获性问题。在比较例2的场合，发现胶粘性问题。
工业上的利用可能性
依据本发明的各向异性导电连接方法，用各向异性导电粘合剂或各向异性导电粘合膜将电路板的连接端子与电子元件的连接部电连接时，尽管提高导电粒子的捕获性，也能确保各向异性导电连接时全体的流动性，并不会增大压接时压力，而且将电路板和电子元件以充分的强度互相粘合。因而，本发明的各向异性导电连接方法是适合连接各种电路板和电子元件的方法。

Claims (8)

1.一种各向异性导电连接方法，将电路板的连接端子与电子元件的连接部各向异性导电连接，其中包括以下工序(a)～(d)：
工序(a)在电路板上，配置导电粒子分散到光固化型绝缘性粘合剂而构成的各向异性导电粘合膜的工序；
工序(b)在该各向异性导电粘合膜上，配置具有与电路板的连接端子对应的曝光图案的曝光用掩模的工序；
工序(c)隔着曝光用掩模对该各向异性导电粘合膜照射光，使光照射的该各向异性导电粘合膜的曝光部光聚合，增大其熔融粘度的工序；以及
工序(d)除去曝光用掩模，从各向异性导电粘合膜侧将电子元件的连接部对于电路板的连接端子定位并使两者粘接，然后对各向异性导电粘合膜全体照射光，使全体光聚合，从而将电路板的连接端子与电子元件的连接部连接的工序。
2.如权利要求1所述的各向异性导电连接方法，其特征在于：在工序(c)中，对电路板的连接端子上各向异性导电粘合膜照射光。
3.如权利要求1所述的各向异性导电连接方法，其特征在于：在工序(c)中，对电路板的连接端子周围上的各向异性导电粘合膜照射光。
4.一种各向异性导电连接方法，将电路板的连接端子与电子元件的连接部各向异性导电连接，其中包括以下工序(a′)～(d′)：
工序(a′)在电路板上，配置导电粒子分散到光固化型绝缘性粘合剂而构成的各向异性导电粘合剂层和其至少一面上设置热固化型粘合剂层的层叠型各向异性导电粘合膜的工序；
工序(b′)在层叠型各向异性导电粘合膜上，配置具有与电路板的连接端子对应的曝光图案的曝光用掩模的工序；
工序(c′)隔着曝光用掩模对该层叠型各向异性导电粘合膜照射光，使光照射的层叠型各向异性导电粘合膜的光固化型各向异性导电粘合剂层的曝光部光聚合，增大其熔融粘度的工序；以及
工序(d′)除去曝光用掩模，从层叠型各向异性导电粘合膜侧将电子元件的连接部对电路板的连接端子定位并使两者粘接，然后至少将热固化型粘合剂层固化，从而将电路板的连接端子与电子元件的连接部连接的工序。
5.如权利要求4所述的各向异性导电连接方法，其特征在于：在工序(c′)中，对电路板的连接端子上层叠型各向异性导电粘合膜的各向异性导电粘合剂层照射光。
6.如权利要求4所述的各向异性导电连接方法，其特征在于：在工序(c′)中，对电路板的连接端子周围上的层叠型各向异性导电粘合膜的各向异性导电粘合剂层照射光。
7.一种各向异性导电粘合膜，其特征在于：该各向异性导电粘合膜由导电粒子分散到光固化型绝缘性粘合剂而构成的各向异性导电粘合剂层构成，其中，按照各向异性导电连接图案，在各向异性导电粘合膜的各向异性导电粘合剂层中设置不同熔融粘度的区域。
8.如权利要求7所述的各向异性导电粘合膜，其特征在于：在各向异性导电粘合层的至少一面形成有热固化型粘合剂层。
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