HK1103169A1 - Anisotropic conduction connecting method and anisotropic conduction adhesive film - Google Patents

Anisotropic conduction connecting method and anisotropic conduction adhesive film

Info

Publication number
HK1103169A1
HK1103169A1 HK07107556.4A HK07107556A HK1103169A1 HK 1103169 A1 HK1103169 A1 HK 1103169A1 HK 07107556 A HK07107556 A HK 07107556A HK 1103169 A1 HK1103169 A1 HK 1103169A1
Authority
HK
Hong Kong
Prior art keywords
adhesive film
anisotropic conduction
connection
conductive adhesive
anisotropic conductive
Prior art date
Application number
HK07107556.4A
Other languages
English (en)
Inventor
Misao Konishi
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1103169A1 publication Critical patent/HK1103169A1/xx

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
HK07107556.4A 2004-02-26 2007-07-13 Anisotropic conduction connecting method and anisotropic conduction adhesive film HK1103169A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004052260A JP4385794B2 (ja) 2004-02-26 2004-02-26 異方性導電接続方法
PCT/JP2004/014330 WO2005083772A1 (ja) 2004-02-26 2004-09-30 異方性導電接続方法及び異方性導電接着フィルム

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Publication Number Publication Date
HK1103169A1 true HK1103169A1 (en) 2007-12-14

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HK07107556.4A HK1103169A1 (en) 2004-02-26 2007-07-13 Anisotropic conduction connecting method and anisotropic conduction adhesive film

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US (1) US7655107B2 (zh)
JP (1) JP4385794B2 (zh)
KR (1) KR101086182B1 (zh)
CN (1) CN1926675B (zh)
HK (1) HK1103169A1 (zh)
TW (1) TWI274780B (zh)
WO (1) WO2005083772A1 (zh)

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Publication number Publication date
TW200528531A (en) 2005-09-01
US20070068622A1 (en) 2007-03-29
TWI274780B (en) 2007-03-01
JP2005243950A (ja) 2005-09-08
KR20060126574A (ko) 2006-12-07
CN1926675A (zh) 2007-03-07
US7655107B2 (en) 2010-02-02
WO2005083772A1 (ja) 2005-09-09
KR101086182B1 (ko) 2011-11-25
CN1926675B (zh) 2012-07-04
JP4385794B2 (ja) 2009-12-16

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