TW200528531A - Anisotropic conduction connecting method and anisotropic conduction adhesive film - Google Patents

Anisotropic conduction connecting method and anisotropic conduction adhesive film Download PDF

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Publication number
TW200528531A
TW200528531A TW093130213A TW93130213A TW200528531A TW 200528531 A TW200528531 A TW 200528531A TW 093130213 A TW093130213 A TW 093130213A TW 93130213 A TW93130213 A TW 93130213A TW 200528531 A TW200528531 A TW 200528531A
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Taiwan
Prior art keywords
anisotropic conductive
adhesive film
connection
conductive adhesive
light
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Application number
TW093130213A
Other languages
Chinese (zh)
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TWI274780B (en
Inventor
Misao Konishi
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Sony Chemicals Corp
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Publication of TW200528531A publication Critical patent/TW200528531A/en
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Publication of TWI274780B publication Critical patent/TWI274780B/en

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    • H—ELECTRICITY
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

When the connection terminal of a circuit board and the connecting part of an electronic element are connected electrically through an anisotropic conduction adhesive film, overall fluidity is ensured at the time of anisotropic conductive connection while enhancing the capturing performance of conductive particles without increasing a pressing force at pressure-bonding, and the circuit board and the electronic element can be bonded temporarily with a sufficient strength. In the present invention, an UV-curing anisotropic conduction adhesive film (4) containing conductive particles (2) is arranged on a circuit board (1), an exposure mask (5) (having an exposure pattern corresponding to the connection terminal (1b) of the circuit board (1)) is arranged on the anisotropic conduction adhesive film (4), the anisotropic conduction adhesive film (4) is irradiated with light through the exposure mask (5), the exposure part (4a) of the anisotropic conduction adhesive film (4) irradiated with light is photo-polymerized in order to increase the melt viscosity thereof, the exposure mask (5) is then removed, the connecting part (6a) of an electronic element (6) is bonded to the connection terminal (1b) of the circuit board (1) after being aligned with each other from the anisotropic conduction adhesive film (4) side, and then the anisotropic conduction adhesive film (4) is photo-polymerized thus connecting the connection terminal (1b) of the circuit board (1) and the connecting part (6a) of an electronic element (6).

Description

200528531 九、發明說明： 【發明所屬之技術領域】 本發明係關於使電路基板之連接端子與電子元件之連 接部形成電氣連接之方法、以及使用於該方法之異向性導 電黏著膜。 【先前技術】 以往’電路基板之連接端子與其他電路基板或晶片 等電子元件之連接部，係利用圖4(a)所示之異向性導電黏著 膜43(將導電粒子41分散在熱硬化型樹脂42而成）進行連 接。 然而’為了提昇該異向性導電黏著膜之連接可靠性， 在進行異向性導電連接時，須提昇在電路基板之連接端子 與電子元件之連接部間之導電粒子捕捉性。針對此，如圖 4(b)所示，係使異向性導電黏著膜43整體之導電粒子數較 圖4(a)之情形增加，亦或如圖4(c)所示，雖導電粒子數與圖 4(a)之情形相同，但將導電粒子密度增大之薄膜與不含導電 粒子之熱硬化型黏著劑層44積層而作成異向性導電黏著膜 43。 ' 然而，如圖4(b)與圖4(c)所示之狀態中，導電粒子捕捉 性並不夠，因此，在專利文獻1，係利用調整附層間絕緣黏 著劑之薄膜其熔融黏度之技術，調整樹脂組成使異向性導 電黏著膜整體之熔融黏度增加，藉以在進行異向性導電連 接之熱壓接時，抑制導電粒子由連接區域向非連接區域移 動0 200528531 (專利文獻1)日本特開2〇〇(M〇4〇33號公報 然而’若異向性導電黏著膜整體之炼融黏度增加 於在進行異向性導電連接士先文 ^电逆得％整體不易流動，故必須增加廢 接知之壓力，在某些情形下有可能會損傷電路基板或電子 元件m熱壓接前’ t電路基板與電子元件間 暫黏著時，黏著力不夠，導六 J導致合易產生剝離或偏移之問題。 【發明内容】 叙明之目的在於，當電路基板之連接端子與電子元 件連接部利用異向性導電黏著膜進行異向性導電連接時， 為提升導電粒子之捕捉性，同時，不增大壓接時之壓力以確 保異向性導電黏著膜整體之流動性，且可使電路基板與電 子元件彼此間以足夠的強度進行暫黏著。 本發明人等發現出，關於異向性導電黏著膜之絕緣性 黏著劑，若使用光硬化型絕緣性樹脂，以光線照射電路基 板之連接端子上或連接端子之周圍上之異向性導電點著膜 :寺，電路基板與電子元件彼此間能以^夠的強度進行暫黏 者’且可確保在#向性導電連接時整體之流動十生，同時可 2各連接端子上或連接端子之周圍上之異向性導電黏著膜 ，、匕融黏度增加，其結果’不須增加麼接時之麼力即可提 升異向性連接部位之導電粒子捕捉性，而完成本發明。 亦即，本發明之第丨形態，係提供一種異向性導電連 接方法’用以使電路基板之連接端子與電子元件連接部進 订異向性導電連接，其包含下列步驟（a)〜(d): 步驟（a)在電路基板上配置異向性導電黏著膜，該黏著 膜係將導電粒子分散在光硬化型絕緣性黏㈣而構成^ 200528531 V驟（b)在忒異向性導電黏著膜上配置曝光用光罩，其 /、有與電路基板之連接端子對應之曝光圖案； —步驟（C)透過曝光用光罩以光線照射該異向性導電黏 2膜，使該異向性導電黏著膜受光線照射之曝光部進行光 聚合，而增加其熔融黏度；以及 ^ ^驟（d)取下曝光用光罩，在電路基板之連接端子相對 應處，由異向性導電黏著膜側將電子元件之連接部與其對 位使兩者密合，以光線照射異向性導電黏著膜整體，使整 體進行光聚合，藉此使電路基板之連接端子與電子元件之 連接部連接。 又本發明之第2形態，係提供一種異向性導電連接 2方法，用來使電路基板之連接端子與電子元件連接部進 行異向性導電連接，其包含下列步驟（a，）〜(d，）： ^步驟（a，）在電路基板上配置積層型異向性導電黏著 膜，该黏著膜具有：將導電粒子分散在光硬化型絕緣性黏 著劑而成之異向性導電黏著劑層，與至少設於其單面之熱 硬化型黏著劑層； 步驟03，）在該積層型異向性導電黏著膜上設置曝光用 光罩其具有與電路基板之連接端子對應之曝光圖案； 步驟（C’）透過曝光用光罩以光線照射該積層型異向性 導電黏著膜，使積層型異向性導電黏著膜之光硬化型異向 性導電黏著劑層受光線照射之曝光部進行光聚合，而增加 其熔融黏度；以及 步驟（d，）取下曝光用光罩，在電路基板之連接端子相 200528531 ’由導電黏著膜㈣電子㈣之連接部與其 電路基：者广至少使熱硬化型黏著劑層硬化，藉此使 ^ "之連接端子與電子元件之連接部連接。 +再者纟發明之第3形態，係提供一種異向性 導U子分散在光硬化型絕緣性㈣劑而成之 〃 σ導電黏著劑層所構成者，其特徵在於·· t、、、異向性導電連接圖案，而在異向性導電黏著膜之 -向性導電黏著劑層中設置㈣黏度相異之區域。、 λ根據本發明，當電路基板之連接端子與電子元件連接 部制異向性導電料劑或異向性導電黏著膜進行導電連 接日”可提升導電粒子之捕捉性，同時確保在進行異向性 導弘連接日寸整體之流動性，不須增加壓接時之壓力，且可 使電路基板與電子元件之連接強度非常強。 【實施方式】 關於本發明第1形態其電路基板之連接端子與電子元 件連接部進行異向性導電連接之方法，參照圖1說明每— 道步驟。 步驟（a) “如圖1 (a)所示，在電路基板1上配置光硬化型異向性導 電黏著膜4,該黏著膜4係將導電粒子2分散在光硬化型絕 緣性黏著劑3而構成。 關於電路基板1，可使用軟性印刷配線基板（特開平 1 1 013654唬公報等）、半導體裝置用中繼基板（特開平 1 ^097101號公報等）、附凸塊之配線電路基板（特開 200528531 2000-303745號公報等）、陶瓷配線電路基板、使用預浸物 (pi epreg)之多層配線電路基板等周知之電路基板，但基本上 所使用者，係在聚醯亞胺膜或氧化鋁板等之絕緣性基板& 上形成銅箔等金屬箔經圖案化而成之配線電路（未圖未），並 在配線电路為部形成連接端子lb(用來與其他之電子元件 (如U配線基板、IC晶片、天線元件、電容元件、電阻元 件等）連接）。在端子間亦可形成周知之絕緣性覆蓋層1 c。 構成光硬化型之異向性導電黏著膜4之導電粒子，可 為-般用於異向性導電黏著膜之導電粒子。可使用例如. 鎳、鐵、銅、銘、錫、錯、絡、始、銀、金等各種金屬或 金屬，金粒子、金屬氧化物，在碳、石墨、玻璃或陶究、 塑勝專粒子表面塗布金屬泰 m金屬者’或更進—步在該等粒子表面 地 寺導電粒子之粒徑或材質可根據待連 接之電路基板之配線間距< _ 次圖案、連接端子之厚度或材質 等適當選擇。 μ貝 構成光硬化型之異向性導 ^ ^ „ 等冤黏者膜4之光硬化型絕緣 性黏著劑3，可使用周知之6山#胃 土巴琢 自由基聚合型或陽離子聚合型之 光硬化型黏著劑。在此，「 l % 口生之 λα ^ . A 〇 W為糸外線、電子線、X射 線寻活性硓1射線等。再. 者關於光硬化型黏著劑之黏荖 成分，例如可為光聚合性 ^之^者 旦i Μ \ 佈0夂糸化合物，尤以分子量Γ曹 置平均分子量）10000以下 （重 士、甘、/ 之兩知酉夂糸單體或低聚物較佳。 尤〃、以（甲基）丙烯酸烷基g旨 气妒㈣α (甲基）丙烯酸芳基烷基酯、螯 虱S曰變性丙烯酸酯、環氧 曰录 使用上？π入一 夂性丙烯酸酯等更理想。可單獨 使用上途化合物或將兩者以上合併使用。 200528531 在光硬化型絕緣性黏著劑3中，光聚合起始劑可使用 公知之光硬化型丙烯酸系黏著劑所採用者。可列舉如：二 苯曱酮系乙&笨系、苯偶姻、苯偶姻烧基鍵系、苯偶酸、 苯偶一曱基酮縮醇、醯基膦氧化物系、硫雜憩酮系等之 各光聚合起始劑。該等光聚合起始劑可單獨使用，亦可組 口使用#者，亦可添加脂肪族胺或芳香族胺作為光聚合 助劑。 口 雖然光聚合起始劑之用量隨使用t光硬化型黏著成分 而異，但在使用聚合性丙烯酸系化合物時，以每1〇〇重量 知之聚合型丙烯酸系化合物添加〇1〜1〇重量份較佳。 在光硬化型絕緣性黏著劑3 +，除了上述成分，亦可 視而要適當配合苯氧樹脂或環氧樹脂等熱塑型樹脂、交聯 劑、各種橡膠成分、填充物、均化劑、黏度調整劑、氧化 防止劑等。 先硬化型之異向性導電黏著膜4之製造，例如將構成 光硬化型絕緣性黏著劑3之各成分、導電粒子、光聚合起 始劑以及其他添加成分、與視需要之甲苯等溶劑均勻混 :’而塗布在聚對苯二甲酸乙二醇醋（ρΕτ)板等的剝離板 ’經乾燥成膜而製造出。 步驟（b) 接著如圖l(bl)與（b2)所示，在異向性導電黏著膜4 =置曝光用光罩5,其具有與電路基板〗之連接端子、化 使：之曝光圖案。在此’曝光用光罩5之曝光圖案，係為 使笔路基板】之連接端子lb上之異向性導電黏著 200528531 為使在電路基板1之連接端子1 b周 4义光知、之圖案（圖i(b2))。在此， ,½之圖案（圖1 (b 1 ))，或 圍之異向性導電黏著膜 所吕胃連接端子1 b之用if)廿y甘士一 乃圍並非僅表示以圓或正方形將連接端 匕圍亦包含以線狀包夾之情形或L型包圍之情形。 又，曝光用光罩5除 lb相對應之曝光圖案外， 同之結構。 了具有與電路基板1之連接端子 可為與先前周知之曝光用光罩相 4, ：/向:二過：光用光罩5以光照射異向性導電黏著膜 /、°分電黏著膜4受光照之曝光部進行光聚合，以 該部分之溶融黏度。在此，在圖咖)之曝光圖案之情 “ 了在電路基板i之連接端子lb 之/、向性導電黏著膜其曝光部4a之炫 可=該曝光“中導電粒子之捕捉性。並且二 路膜4之非曝光部並未進行光聚合反應，故電 確：M电子70件間可進行強度十分強之暫黏著，且可 行異向性導電連接時，異向性導電黏著膜4二 机動性，而不必過度提高壓接時之壓力。 干，^’在圖】⑽之曝光圖案之情形中，如目i(c2)所 广了在電路基板〗之連接端子ib周圍上之異 “黏者膜其曝光部4a之熔融黏度。1 : 之異向性導電黏著膜非曝光部4,之二„上 此雖然由熔融黏度之觀點，從連接广子h 一提尚，因 粒子2較易逃逸，…/妾而子1以麼接時，導電 逸但由於在該非曝光部外周圍形成炫融黏 200528531 度高之區域，結果可提高在該非曝光部4b中導電粒子之捕 捉性。再者，由於在異向性導電勒著膜4非曝光部並未: 订先1合反應，故電路基板}與電子元件間可進行強度十 刀強之暫黏著’且可確保在進行異向性導電連接時，異向 性導電黏著m 4整體之流動性，壓接時之壓力與圖工⑹) 之=形相較，可降得更低。因此，適合大面積之凸塊連接 之情形。 步驟（d) 接著，取下曝光用光罩5,在電路基板】之連接端子 几相對應處，由異向性導電黏著膜"將電子元件6之連 ，部6a與其對位使兩者密合，且以光線照射異向性導電黏 者膜4整體，使其進行光聚合而使電路基板i之連接端子 化與電子凡件之連接部以良好連接可靠性進行異向性導電 =接(圖1(d))。在此，電子元件6可舉出如與電路基板"目 。之電路基板或軟性配線基板、IC晶片、天線元件、電容 ::電阻元件等’再者’該連接…為-般之凸塊或 ▲接著，關於本發明第2形態之異向性導電連接方法， :照圖2說明每一道步驟。再者，在第2形態之異向性導 声連接方法中’關於使用至少在其單面設置熱硬化型黏著 9之積層型異向性導電黏著膜這點，係與第1形能之異向 連接方法相異。如圖4⑷之相關說明，藉由：用該積 曰i八向性導電黏著膜，可使含導電粒子之層 提高導電粒子密度，故不須增加導電粒子總；，； = = 12 200528531 良好之連接可靠性，其結果，可降低異向性連接之成本。 步驟（a ’） 首先如圖2(A1)或圖2(A2)所示，在電路基板21上配 置積層型異向性導電黏著膜25，該黏著膜^具有：將導電 ^子=分散在光硬化型絕緣性黏著劑U而成之異向性導 $ J•占著d層24 ’與至少設於其單面之熱硬化型黏著劑層 Μ。在此，在圖2(幻）之情形中，雖然將在單面設有熱硬/匕 型黏者劑層25之積層型異向性導電黏著膜％以異向性導 :黏著劑層24在電路基板21側之方式配置，但亦 硬=型黏著劑層25置於電路基板21側。再者，在圖咖） 形中，亦可使用在雙面設置熱硬化型黏著劑層乃之積 層型異向性導電黏著膜26。 、 —構成熱硬化型黏著劑層25之熱硬化型樹脂可列舉如環 巩樹脂、聚氨酿樹脂、不飽和聚醋樹脂等。1 ; ::為固體之環氧樹脂較佳。此時，亦可併用在常溫為液 軋樹脂。常溫為固體之環氧樹脂中常溫為液狀之環 A S的配合比率，可按照異向性導電黏著膜所要求之性 ^。再者’為了提升上述固態或液狀環氧樹脂所 二=可撓性程度’且藉此提升異向性導電黏著膜之 P離強度日Τ’除了該等環氧樹脂外’以進一步併用可撓性 二樹脂較佳。在此，熱硬化型絕緣性點著劑中之可挽性 7樹脂含量，若添加過少無法得到充分之可繞性環氧樹 〇曰之添加效果，添加過多則將降低耐熱性，故以$〜35 %較佳，又以5〜25重量％較理想。 里 13 200528531 再者，導電基板21、導電粒子2 著劑23 7八則蚀田你θ >、尤硬化型絕緣性黏 者片"3可为別使用與圖〇斤說明之導電基板卜 2與光硬化型絕緣性黏著劑3相同者。 包厂 積層型異向性導電黏著膜26之製 化型絕緣性黏著劑3之各種成分、導電粒子 ，以及其他添加成分、與視需要之甲苯等溶劑_起= ° ΡΕΤ板寻剝離板上塗布經乾燥而作成光硬化型之里 向性導電黏著膜；另—方面，熱硬化型樹脂可利用模鑄、; 或塑核擠出法成膜，而兩膜利用周知之 而 製作出。 逆仃積層而 步驟（b’） 接者在如圖2(A1)所示之積層型異向性導電黏 上配置曝光用光罩27，其具有與電路基板21之連心 21b相對應之曝光圖案。該步驟與圖】之形態之步而 作方式相同。在此，當曝光用光罩27之 ： :…基:…連接端子21b上之積層型異向性= 者腰26之b形時，其圖案如圖2(叫所示；其係供光 在電路基板21之連接端子21b周圍上之積層型 導' 黏著膜Μ之情形時，其圖案如圖卿斤示。 電 再者，在目2(A2)之情形中，可與圖2(A1)之情形 設置曝光用光罩27(圖未標示）。 ^ 步驟（c5) 接著’透過曝光用光罩27以光照射積層型 黏著膜26，使籍Μ _田丄Ll、* ^ ^ 積層型異向性導電黏著膜26之異向性導電黏 200528531 著劑層24其受光照之曝 一 、 Μ進订光聚合，使該部分之 W黏度增大。在此，當其為圖2⑻）之曝光圖案時，如圖 2(C1)所示，電路基板21 埂接鳊子21b上之異向性導電黏 著膜26其異向性導電黏著 d層24之曝先部24a熔融黏度變 大。其結果，可提升該曝光部24a之導電粒子22之捕捉性。 再者，由於在異向性導電黏著膜26其異向性導電黏著劑層 24之非曝光部24b並夫i隹^- jji a I禾進仃先聚合，故電路基板21與電子 几件間可進行強度十分強之暫黏著，且可確保在進行異向200528531 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for electrically connecting a connection terminal of a circuit substrate and a connection part of an electronic component, and an anisotropic conductive adhesive film used in the method. [Prior art] In the past, the connection portion between the connection terminal of a circuit board and other circuit boards or electronic components, such as a wafer, uses an anisotropic conductive adhesive film 43 (dispersing conductive particles 41 in a thermosetting state) as shown in FIG. 4 (a). Type 42 resin) for connection. However, in order to improve the connection reliability of the anisotropic conductive adhesive film, when conducting anisotropic conductive connection, it is necessary to improve the capture of conductive particles between the connection terminal of the circuit substrate and the connection portion of the electronic component. In view of this, as shown in FIG. 4 (b), the number of conductive particles in the entire anisotropic conductive adhesive film 43 is increased as compared with that in FIG. 4 (a), or as shown in FIG. 4 (c), although the conductive particles The number is the same as in the case of FIG. 4 (a), but a film having an increased density of conductive particles and a heat-curable adhesive layer 44 containing no conductive particles are laminated to form an anisotropic conductive adhesive film 43. '' However, in the states shown in Figs. 4 (b) and 4 (c), the capturing properties of conductive particles are not sufficient. Therefore, in Patent Document 1, a technique for adjusting the melt viscosity of a film with an interlayer insulating adhesive is used. The resin composition is adjusted to increase the melt viscosity of the anisotropic conductive adhesive film as a whole, thereby suppressing the movement of conductive particles from the connected region to the non-connected region during thermal compression bonding of the anisotropic conductive connection. 0 200528531 (Patent Document 1) Japan However, if the melting and melting viscosity of the anisotropic conductive adhesive film as a whole is increased, an anisotropic conductive connection is required. The first step is to obtain %% electricity, which is difficult to flow, so it must be used. Increasing the pressure of waste connection may cause damage to the circuit board or electronic components in some cases. Before the thermal bonding of the circuit board and the electronic components, the adhesion force is not enough. [Disclosure] The purpose of the description is to improve the conductivity when the connection terminals of the circuit board and the electronic component connection are anisotropically conductively connected using an anisotropic conductive adhesive film. At the same time, the particles do not increase the pressure at the time of crimping to ensure the fluidity of the entire anisotropic conductive adhesive film, and can temporarily adhere the circuit substrate and the electronic component with sufficient strength to each other. It was found that, as for the insulating adhesive of the anisotropic conductive adhesive film, if a light-curable insulating resin is used, the anisotropic conductive dots on the connection terminals of the circuit board or around the connection terminals are irradiated with light: temple The circuit substrate and the electronic components can be temporarily adhered with sufficient strength between each other ', and can ensure that the overall flow is ten years in the #directional conductive connection, and at the same time, it can be different on each connection terminal or on the periphery of the connection terminal. For anisotropic conductive adhesive film, the melt viscosity increases, and as a result, the capture of conductive particles at the anisotropic connection site can be improved without increasing the force at the time of connection, and the present invention has been completed.丨 The form is to provide an anisotropic conductive connection method 'for making an anisotropic conductive connection between a connection terminal of a circuit board and an electronic component connection part, which includes the following steps (a) ~ (d ): Step (a) An anisotropic conductive adhesive film is arranged on the circuit substrate, and the adhesive film is formed by dispersing conductive particles in a light-hardening insulating adhesive ^ 200528531 V step (b) anisotropic conductive adhesive An exposure mask is disposed on the film, and / or has an exposure pattern corresponding to the connection terminal of the circuit substrate;-step (C) irradiates the anisotropic conductive adhesive film with light through the exposure mask to make the anisotropy The light-exposed portion of the conductive adhesive film undergoes photopolymerization to increase its melt viscosity; and ^ ^ (d) Remove the exposure mask and place the anisotropic conductive adhesive film at the corresponding position of the connection terminal of the circuit substrate. The connection part of the electronic component and the opposite side are brought into close contact with each other, and the entire anisotropic conductive adhesive film is irradiated with light, so that the whole is photopolymerized, thereby connecting the connection terminal of the circuit board and the connection part of the electronic component. The second aspect of the present invention provides an anisotropic conductive connection 2 method for making anisotropic conductive connection between a connection terminal of a circuit board and an electronic component connection portion, which includes the following steps (a,) to (d ,): ^ Step (a,) arrange a laminated anisotropic conductive adhesive film on the circuit substrate, the adhesive film has: an anisotropic conductive adhesive layer formed by dispersing conductive particles in a light-hardening insulating adhesive And a heat-curable adhesive layer provided on at least one side thereof; step 03,) setting an exposure mask on the laminated anisotropic conductive adhesive film having an exposure pattern corresponding to the connection terminal of the circuit substrate; step (C ') The laminated anisotropic conductive adhesive film is irradiated with light through an exposure mask, so that the light-curing anisotropic conductive adhesive layer of the laminated anisotropic conductive adhesive film is exposed to light and exposed to light. Polymerize and increase its melt viscosity; and step (d,) remove the photomask for exposure, and connect the circuit board to the connection terminal phase 200528531 'the connection portion of the conductive adhesive film ㈣ electron 与其 and its circuit base Wide by at least the thermosetting adhesive agent layer is hardened, whereby the ^ " and the connecting portion of the connecting terminal of the electronic component is connected. + Furthermore, the third aspect of the invention is to provide a σ conductive adhesive layer composed of an anisotropic conductive element dispersed in a light-hardening insulating elixir, which is characterized by t, ..., Anisotropic conductive connection patterns, and regions with different viscosities are provided in the anisotropic conductive adhesive layer of the anisotropic conductive adhesive film. According to the present invention, when an anisotropic conductive material or an anisotropic conductive adhesive film is used to make a conductive connection on the connection terminal of a circuit substrate and an electronic component connection portion, the "capacity of conducting particles can be improved, and at the same time, anisotropy can be ensured. The conductivity of the connection leads to the overall fluidity of the Japanese inch, which does not need to increase the pressure during crimping, and can make the connection strength between the circuit board and the electronic component very strong. [Embodiment] About the connection terminal of the circuit board of the first form of the present invention A method for anisotropic conductive connection with the electronic component connection portion will be described with reference to FIG. 1. Step (a) “As shown in FIG. 1 (a), a photo-hardening type anisotropic conductive is arranged on the circuit substrate 1. An adhesive film 4 is formed by dispersing conductive particles 2 in a photocurable insulating adhesive 3. As the circuit board 1, a flexible printed wiring board (Japanese Unexamined Patent Publication No. 1 1 013654, etc.), a relay substrate for a semiconductor device (Japanese Unexamined Patent Publication No. ^ 097101, etc.), and a printed circuit board with bumps (Japanese Unexamined Patent Application No. 200528531) can be used. No. 2000-303745, etc.), ceramic wiring circuit boards, multilayer wiring circuit boards using prepregs, and other well-known circuit boards, but basically, the users are based on polyimide films or alumina boards. A wiring circuit (not shown) formed by patterning metal foils such as copper foil on the insulating substrate & and forming connection terminals lb (for connecting with other electronic components such as U wiring substrate) , IC chip, antenna element, capacitor element, resistor element, etc.)). A well-known insulating coating 1 c may be formed between the terminals. The conductive particles constituting the photo-curable anisotropic conductive adhesive film 4 can be conductive particles generally used for an anisotropic conductive adhesive film. Various metals or metals such as nickel, iron, copper, Ming, tin, copper, metal, silver, gold, gold particles, metal oxides, carbon, graphite, glass or ceramics, plastic particles can be used Surface coated with metal or metal, or more-the particle size or material of the conductive particles on the surface of the particles can be based on the wiring pitch of the circuit board to be connected < _ sub-pattern, thickness or material of the connection terminal, etc. Choose appropriately. μ shell constitutes a light-hardening type anisotropic guide ^ ^ „The light-hardening type insulating adhesive 3 of the unacceptable film 4 can use the well-known 6 mountain # 土 土 巴卓 radical polymerization type or cation polymerization type Light-curing adhesive. Here, "l% oral λα ^. A 〇W is 糸 external line, electron beam, X-ray search activity 硓 1 ray, etc. Furthermore, the adhesive component of the light-curing adhesive For example, it can be a photopolymerizable compound, such as i Μ \ i0 夂 糸 compound, especially the molecular weight Γ Cao Zhi average molecular weight) less than 10,000 (the two known monomers or oligomers) In particular, the use of alkyl (meth) acrylic acid for the purpose of α (meth) acrylic acid aryl alkyl esters, chewing lice, modified acrylic esters, epoxy resins? More preferred are acrylic acrylates. The compounds used above may be used alone or in combination of two or more. 200528531 In the photocurable insulating adhesive 3, the photopolymerization initiator may be a known photocurable acrylic adhesive. Adopted. Examples include: benzophenone ethyl & stupid, benzoin , Benzoin-based bond system, benzoic acid, benzoyl fluorenyl ketal, fluorenylphosphine oxide system, thioxanthone system, and other photopolymerization initiators. These photopolymerization initiators It can be used alone or in combination with #, and aliphatic amines or aromatic amines can also be added as photopolymerization aids. Although the amount of photopolymerization initiator varies with the use of t-curable adhesive components, When a polymerizable acrylic compound is used, it is preferable to add 0.01 to 10 parts by weight per 100 weight of the polymerizable acrylic compound. In addition to the above components, the photocurable insulating adhesive 3+ may be considered as necessary. Appropriately mix with thermoplastic resins such as phenoxy resins, epoxy resins, cross-linking agents, various rubber components, fillers, leveling agents, viscosity modifiers, oxidation inhibitors, etc. Anisotropic conductive adhesive films of pre-curing type 4 For manufacturing, for example, each component constituting the photocurable insulating adhesive 3, conductive particles, photopolymerization initiator, and other added components are uniformly mixed with a solvent such as toluene as needed: 'and coated on polyterephthalic acid Glycol vinegar (ρΕτ) board The peeling plate such as this is dried and formed into a film. Step (b) Next, as shown in FIGS. 1 (bl) and (b2), an anisotropic conductive adhesive film 4 is provided with a photomask 5 for exposure. [Circuit substrate] connection terminal, and make: exposure pattern. Here, the exposure pattern of the "exposure mask 5" is to make the pen circuit substrate] anisotropic conductive adhesion on the connection terminal lb 200528531 to make the circuit substrate 1 of the connection terminal 1 b week 4 Yiguangzhi, the pattern (Figure i (b2)). Here, the pattern of ½ (Figure 1 (b 1)), or the surrounding anisotropic conductive adhesive film The use of the connection terminal 1 b if) 廿 y Gan Shiyi Naiwei does not mean only the case where the connecting end is enclosed by a line or a square or the shape of an L-shape. The exposure mask 5 has the same structure except the exposure pattern corresponding to lb. The connection terminal with the circuit board 1 can be the same as the photomask 4 used for exposure, which is previously known:: / direction: double pass: the photomask 5 irradiates the anisotropic conductive adhesive film with light, and the ° -distribution adhesive film 4 The light-exposed part performs photopolymerization to the melting viscosity of the part. Here, the exposure pattern in FIG. 2) shows that the exposure of the exposed portion 4a of the anisotropic conductive adhesive film on the connection terminal lb of the circuit board i may be equal to the capture of the conductive particles in the exposure. In addition, the non-exposed part of the two-way film 4 does not undergo photopolymerization, so the electricity is indeed: 70 pieces of M electrons can be temporarily bonded with very strong strength, and anisotropic conductive adhesive film 4 is possible when anisotropic conductive connection is possible Two mobility, without having to excessively increase the pressure during crimping. Dry, ^ 'In the case of the exposure pattern of ⑽, the melting viscosity of the exposed portion 4a of the adhesive film on the periphery of the connection terminal ib of the circuit substrate as shown in item i (c2) is wide. 1:: The anisotropic conductive adhesive film non-exposed part 4, the second "Although from the viewpoint of melting viscosity, from the connection of Hiroko h, it is mentioned that because particle 2 is easier to escape, ... It is conductive, but since a region with a high degree of 200528531 degrees is formed around the non-exposed portion, the capture property of the conductive particles in the non-exposed portion 4b can be improved as a result. In addition, since the non-exposed portion of the anisotropic conductive grip film 4 does not: order a first reaction, the circuit board} and electronic components can be temporarily adhered to each other with a ten-strength strength, and it can ensure that anisotropy is being performed. When conducting conductive connection, the anisotropic conductive adhesive adheres to the overall flow of m 4, and the pressure during crimping can be lowered compared to the shape of the drawing. Therefore, it is suitable for a large area bump connection. Step (d) Next, remove the photomask 5 for exposure, and connect the electronic components 6 with an anisotropic conductive adhesive film at the corresponding positions of the connection terminals on the circuit board], and place the parts 6a and the two in alignment. Tightly, and irradiate the entire anisotropic conductive adhesive film 4 with light to make it photo-polymerize to make the connection terminals of the circuit board i and the connection parts of the electronic parts to perform anisotropic conduction with good connection reliability = connection (Figure 1 (d)). Here, the electronic component 6 can be used as a circuit board. Circuit board or flexible wiring board, IC chip, antenna element, capacitor: 'more', such as a resistance element, the connection ... is a general bump or ▲ Next, the anisotropic conductive connection method of the second aspect of the present invention ,: As shown in Figure 2 each step. Furthermore, in the anisotropic sound-conducting connection method of the second aspect, the use of a laminated anisotropic conductive adhesive film in which a thermosetting adhesive 9 is provided at least on one side is a difference from the first physical energy. Different connection methods. As shown in the relevant explanation in Figure 4 (b), by using this product, the octatropic conductive adhesive film can increase the density of conductive particles in the layer containing conductive particles, so there is no need to increase the total number of conductive particles; = = 12 200528531 Good Connection reliability, as a result, can reduce the cost of anisotropic connection. Step (a ′) First, as shown in FIG. 2 (A1) or FIG. 2 (A2), a laminated anisotropic conductive adhesive film 25 is arranged on the circuit substrate 21, and the adhesive film has: conductive conductivity = dispersed in The anisotropic conductivity formed by the light-hardening type insulating adhesive U takes up the d layer 24 ′ and the heat-hardening type adhesive layer M provided on at least one side thereof. Here, in the case of FIG. 2 (fantasy), although a laminated anisotropic conductive adhesive film having a heat-hard / dagger-type adhesive layer 25 provided on one side is used, the anisotropic conductive: adhesive layer 24 It is arranged on the circuit board 21 side, but the hard-type adhesive layer 25 is also placed on the circuit board 21 side. Further, in the figure, a laminated anisotropic conductive adhesive film 26 in which a thermosetting adhesive layer is provided on both sides may be used. The thermosetting resin constituting the thermosetting adhesive layer 25 may be exemplified by a sclerosing resin, a polyurethane resin, an unsaturated polyester resin, and the like. 1; :: Solid epoxy resin is preferred. In this case, it may be used in combination with a liquid rolled resin at room temperature. The mixing ratio of the ring A S in the epoxy resin which is solid at normal temperature can be in accordance with the required properties of the anisotropic conductive adhesive film. Furthermore, 'in order to improve the above-mentioned solid or liquid epoxy resin = flexibility degree' and thereby improve the P-off strength of the anisotropic conductive adhesive film 'in addition to these epoxy resins' to further use Flexible two resins are preferred. Here, if the content of the reversible 7 resin in the thermosetting insulating igniting agent is too small, the sufficient winding epoxy resin cannot be obtained. If it is added too much, the heat resistance will be reduced. It is preferably 35%, and more preferably 5-25% by weight. Li 13 200528531 In addition, conductive substrate 21, conductive particles 2 adhesive 23 7 eight eclipses you θ >, especially hardening type insulating adhesive sheet " 3 can be used as a conductive substrate as illustrated in Fig. 2 is the same as the light-curing insulating adhesive 3. Various components, conductive particles, and other added components of the laminated anisotropic conductive adhesive film 26 of the manufacturing plant, conductive particles, and other added components, as well as solvents such as toluene, etc._ From = ° Peet coating on peeling board After drying, a light-hardening inner-oriented conductive adhesive film is formed. On the other hand, the heat-hardening resin can be formed by die casting, or plastic core extrusion, and the two films are made by well-known methods. Step (b ') is reversed, and then a photomask 27 for exposure is provided on the laminated anisotropic conductive adhesive as shown in FIG. 2 (A1), which has an exposure corresponding to the connection center 21b of the circuit substrate 21. pattern. This step works the same way as the step shown in the figure. Here, when the exposure mask 27 :: ... base: ... layer anisotropy on the connection terminal 21b = b shape of the waist 26, the pattern is as shown in FIG. 2 (called; it is provided for light in In the case of the laminated film on the periphery of the connection terminal 21b of the circuit substrate 21, the pattern is shown in the figure. In addition, in the case of head 2 (A2), it can be compared with FIG. 2 (A1). In the case, an exposure mask 27 (not shown in the figure) is set. ^ Step (c5) Then, the laminated adhesive film 26 is irradiated with light through the exposure mask 27, so that M__field 丄 Ll, * ^ ^ The anisotropic conductive adhesive of the anisotropic conductive adhesive film 26 200528531 The adhesive layer 24 is exposed to light, and the photopolymerization is advanced to increase the W viscosity of this part. Here, when it is the exposure of FIG. 2 (a) During the patterning, as shown in FIG. 2 (C1), the anisotropic conductive adhesive film 26 on the circuit substrate 21 connected to the die 21b has a higher melt viscosity at the exposed portion 24a of the anisotropic conductive adhesive d layer 24. As a result, the capturing property of the conductive particles 22 in the exposed portion 24a can be improved. In addition, since the non-exposed portion 24b of the anisotropic conductive adhesive layer 24 and the anisotropic conductive adhesive layer 26 are combined at the non-exposed portion 24b and the first polymerization, the circuit substrate 21 and several electronic components are polymerized first. Can be used for temporary adhesion with strong strength

性導電連接時，異向性導電黏著膜26整體之流動性，而不 必過度提高壓接時之壓力。 再者，當其為圖2(B2)之曝光圖案時，如圖2(C2)所示，During the conductive connection, the fluidity of the anisotropic conductive adhesive film 26 as a whole is not necessarily increased excessively during the pressure bonding. Furthermore, when it is the exposure pattern of FIG. 2 (B2), as shown in FIG. 2 (C2),

電路基板21之連接端子21b周圍上之異向性導電黏著膜26 其異向性導電黏著劑層24之曝光部24a炫融黏度變大。其 結果’由於在連接端子21b上之異向性導電黏著膜％里里 向性導電黏著劑層24之非曝光物之炫融黏度並未提 T ’因此雖然由炼融點度之觀點’從連接端+川上麼接 時’、導電粒子22較易逃逸η旦由於在該非曝光部冰周圍 形成炫融黏度高之區域（擋堤）’故可提高在該非曝光部鳩 中導電粒子22之捕捉性。再者’由於在異向性導電黏著膜 =之異向性導電黏著劑層24其非曝光部2仆並未進行光聚 °反應，故電路基板2 1與電子元件間可進行強度十分強之 曰黏著，且可確保在進行異向性導電連接時，異向性導電 黏者膜26整體之流動性，壓接時之壓力與圖丄（ci)之情形 車乂可降得更低。因此，適合大面積之凸塊連接之情形。 15 200528531 步驟（d’） 接者’取下曝光用光罩27,在電路基板2】之連接端子 p相對應處，由積層型異向性導電黏著膜％側將電子元 件28之連接部…與其對位使兩者密合，至少使敎硬化型 ::劑層25熱硬化，而使電路基…連接端子^ 連接部28a連接。在此，亦可利用光線照射 路基二：性山導電黏著膜24使其硬化。藉此，可使電 料接了 土\ ^而子21b與電子元件28之連接部…以良 =接可罪性進行異向性導電連接（圖2⑽。在此，電子元 8可使用與如圖1⑷所說明之電子元件6相同者。 向性使用上述本發明之第1與第2形態之異 粒子32”在：所得之異向性導電黏著臈31，係將導電 二二成者硬化型絕㈣^ 電黏著安照異向性導電連接圖案，異向性導 黏度相對心「 黏度相異之區域，亦即，具有炫融 2對阿之區域X與相對低之區域Υ。 當異向性導電連接部位 2⑻）所說明，區域X相如圖1(bl)與圖 加炼融黏度之眠光邻之照射進行光聚合而增 在區域X令=此，如圖1(Cl)與圖狗之說明， 與電子元件門二電粒子之捕捉性。再者，電路基板 行異向強度十分強之暫黏著’…保在進 導電連接時，異向性導電黏 而不必過度提高塵接時之塵力。 1體之-動性 再者，當異向性導電連接部位為區域¥時，如圖㈣ 16 200528531 與圖2(B2)所說明，區域γ係被異向性導電連接部位周圍之 熔融黏度大之區域X所包圍之區域，城』 其結果’可提高在該區域γ中之導電粒子捕捉性。 :者’電路基板與電子元件間可進行強度十分強之暫黏 者’且可確保在進行異向性導電連接時，4向性導電黏著 膜整體之流動性’壓接時之壓力與圖1(ei)之情形相較，可 降得更低，因此適合較大面積之凸塊連接之情形。 再者，如圖3(b)所示，在該異向性導電黏著膜3ι，可 在其單面（圖3(b))或雙面設置熱硬化型黏著劑層34。 再者，導電粒子32、光硬化型絕緣性黏著劑33、孰硬 化型黏著劑層34可分別與前述之導電粒子2、光硬化型絕 緣性黏著劑33、熱硬化型黏著劑層25之構成相同。 實施例1〜3、比較例丨〜2 將表1所示之成分以固體成分為6〇重量％的方式均勻 混合在甲苯與乙酸乙@旨之混合溶劑(重量& 1:1)中，調製紫 外線硬化型黏著劑組成物，以乾燥厚成為2〇卜扭或4叫㈤之 方式塗布在已進行剝離處理之聚對苯二甲酸乙二醇酿膜 上在80 C進行5分鐘之乾燥而製成光硬化型異向性導電 黏著膜。該膜之熔融黏度（以流變儀Rsl5〇(哈克公司）測量） 在糸外線照射前為6.0xl〇6mPa s(8〇c>c)，在紫外線照射 (20〇mj/cm2(32〇〜39〇nm))後為 3 〜i〇8mpa s(8〇〇c)。 、再者，將表2所示之成分以固體成分為60重量％的方 式均勻此合在甲苯與乙酸乙酯之混合溶劑（重量比〗：1)中， 凋製熱硬化型黏著劑組成物，以乾燥厚成為1〇pm、 200528531 或40μηι的方式塗布在已進行剝離處理之聚對苯二甲酸乙 二醇酯膜上，在80°C進行5分鐘之乾燥而製成熱硬化型黏 著膜。该膜之炫融黏度（以流變儀RS 150(哈克公司）測量）為 6.0xl06mPa.s(80oC)。 實施例1之光硬化型異向性導電黏著膜係使用4〇口爪厚 之單層者；實施例2之積層型異向性導電黏著膜係使用在 2〇μιη厚之光硬化型異向性導電黏著膜之單面以通常方法積 層2卟也厚之熱硬化型黏著膜者，實施例3之積層型里向性 導電黏著膜係使用在20μΐη厚之光硬化型異向性導電黏著 膜之雙面以通常方法積層10μιη厚之熱硬化型黏著膜者。 再者，比較例i之熱硬化型異向性導電黏著膜'，係將 表3所示之成分以固體成分為6〇重量％的方式均勻混合在 甲苯與乙酸乙醋之混合溶劑(重量比1:1)中，調製熱硬二型 黏著劑組成物，以乾燥厚為40μιη的方式塗布在已進行剝離 處理之聚對苯二甲酸乙二醇s旨膜上’在8代進行5分鐘^ 燥而製成熱硬化型黏著膜。該膜之溶融黏度(以流變： RS150(哈克公司）測量）為 6e0xl〇6mPa.s(8〇()c)。 再者，比較例2之熱硬化型異向性導電黏著膜， 表4所示之成分以固體成分為6〇重量％的方式均句混合在 甲讀乙酸乙S旨之混合溶劑（重量比1:1)中，調製熱硬化型 黏者劑組成物，以乾燥厚為4()μηι的方式塗布在已進行剝離 ^理之聚對苯二甲酸乙二醇賴上，在，進行$分鐘乾 秌而製成熱硬化型黏著膜。該膜之熔融黏度(以流變儀 RSl5〇(哈克公司）測量）為 9.0xi07mpa.s(80〇c)。 18The anisotropic conductive adhesive film 26 on the periphery of the connection terminal 21b of the circuit substrate 21 and the exposed portion 24a of the anisotropic conductive adhesive layer 24 become more viscous. As a result, "because the viscosity of the non-exposed material of the anisotropic conductive adhesive layer 24 in the anisotropic conductive adhesive film on the connection terminal 21b is not improved, T" When the connection end + Kawakami is connected ', the conductive particles 22 are easier to escape. Once the non-exposed part of the ice is formed with a region of high viscosity (dike), the capture of the conductive particles 22 in the non-exposed part can be improved. Sex. Furthermore, since the anisotropic conductive adhesive film = anisotropic conductive adhesive layer 24 has no photoconcentration reaction at the non-exposed portion 2 of the anisotropic conductive adhesive layer 24, the circuit substrate 21 and the electronic component can be very strong. It is sticky, and it can ensure the fluidity of the anisotropic conductive adhesive film 26 as a whole when anisotropic conductive connection is performed, and the pressure during crimping and the situation of figure ci (ci) can be lowered. Therefore, it is suitable for a large area bump connection. 15 200528531 Step (d ') The receiver' removes the exposure mask 27, and at the connection terminal p of the circuit board 2], the connection portion of the electronic component 28 is connected by the% anisotropic conductive adhesive film side ... The two are in close contact with each other, and at least the osmotic hardening type :: agent layer 25 is thermally hardened, and the circuit base ... connecting terminal ^ connecting portion 28a is connected. Here, it is also possible to use light to irradiate the roadbed 2: the conductive adhesive film 24 to harden it. With this, the electrical material can be connected to the ground, and the connection between the sub-21b and the electronic component 28 ... anisotropic conductive connection with good = conviction (Figure 2⑽. Here, the electronic element 8 can be used as The electronic component 6 illustrated in Fig. 1⑷ is the same. The anisotropic conductive adhesive 臈 31 obtained by using the above-mentioned first and second forms of the different particles 32 "in the present invention is a type of hardened conductive 22%. Definitely ^ Electrically bonded anisotropic conductive connection pattern, the anisotropic conductive viscosity is relative to the heart, "area with different viscosity, that is, the area X with 2 pairs of Ah and relatively low area." When the anisotropy As shown in Fig. 1 (bl), the phase X of the conductive connection is shown in Fig. 1 (bl), and the photo-polymerization is performed by the irradiation of the sleeping light adjacent to the melting viscosity. The description of the dog is related to the capture of the electric particles by the electronic component door. In addition, the circuit substrate has a very strong anisotropic temporary adhesion '... to ensure that the anisotropic conductive adhesion does not need to increase the dust connection excessively during the conductive connection. Dust force of 1 body-Mobility, and when the anisotropic conductive connection is in the area ¥, as shown in the figure 16 200528531 and Figure 2 (B2), the region γ is the region surrounded by the region X with a large melt viscosity around the anisotropic conductive connection site. The result "can improve the capture of conductive particles in the region γ" : "The circuit board and the electronic component can be very strong temporary adhesion" and can ensure the anisotropic conductive connection, the entire flow of the 4-directional conductive adhesive film 'pressure and pressure during crimping Compared with the case of Fig. 1 (ei), it can be lowered, so it is suitable for the connection of bumps with larger areas. Furthermore, as shown in Fig. 3 (b), in the anisotropic conductive adhesive film 3m, The heat-curable adhesive layer 34 may be provided on one side (FIG. 3 (b)) or both sides. Furthermore, the conductive particles 32, the light-curable insulating adhesive 33, and the osmium-cured adhesive layer 34 may be respectively The conductive particles 2, the photo-curable insulating adhesive 33, and the thermo-curable adhesive layer 25 have the same configuration. Examples 1 to 3 and Comparative Examples 1 to 2 The components shown in Table 1 were solid components of 60. By weight% method, uniformly mixed in toluene and ethyl acetate In 1: 1), a UV-curable adhesive composition is prepared, and coated on a polyethylene terephthalate film that has been peeled off at a temperature of 80 ° C. in a dry thickness of 20 μm or 4 μm. It was dried for 5 minutes to make a light-curing anisotropic conductive adhesive film. The melt viscosity of the film (measured by a rheometer Rsl50 (Hacker)) was 6.0x106 mPa s (8 〇c> c), after ultraviolet irradiation (20mj / cm2 (32〇 ~ 39〇nm)), it is 3 ~ 〇8mpa s (800c). Furthermore, the components shown in Table 2 The solid content was uniformly mixed in a mixed solvent of toluene and ethyl acetate (weight ratio: 1) so that the solid content was 60% by weight. The thermosetting adhesive composition was withered to a dry thickness of 10pm, 200528531 or The film was coated on a polyethylene terephthalate film having a peeling treatment of 40 μm, and dried at 80 ° C. for 5 minutes to prepare a thermosetting adhesive film. The viscosity of the film (measured with a rheometer RS 150 (Hacker)) was 6.0xl06mPa.s (80oC). The light-curing anisotropic conductive adhesive film of Example 1 uses a single layer with a thickness of 40 mouths; the laminated anisotropic conductive adhesive film of Example 2 uses a light-curing anisotropic film of 20 μm thickness. For one side of a conductive conductive adhesive film, a thermosetting adhesive film with a thickness of 2 porosity and a thickness of 2 layers is laminated in a conventional manner. The laminated type inward-oriented conductive adhesive film of Example 3 uses a light-curing anisotropic conductive adhesive film of 20 μΐη On both sides, a 10-μm-thick thermosetting adhesive film is laminated in a conventional manner. In addition, the thermosetting anisotropic conductive adhesive film 'of Comparative Example i was prepared by uniformly mixing the components shown in Table 3 in a mixed solvent of toluene and ethyl acetate (weight ratio of 60% by weight). In 1: 1), a thermosetting type II adhesive composition was prepared, and applied to a polyethylene terephthalate film having a peeling treatment in a dry thickness of 40 μm, for 5 minutes on the 8th generation ^ Dry and made into a thermosetting adhesive film. The melt viscosity of this film (measured by rheology: RS150 (Hacker)) was 6e0x106mPa.s (80 () c). In addition, in the thermosetting anisotropic conductive adhesive film of Comparative Example 2, the components shown in Table 4 were uniformly mixed with a mixed solvent of ethyl acetate (weight ratio 1) so that the solid content was 60% by weight. : 1), prepare a thermosetting adhesive composition, and apply it to the polyethylene terephthalate layer which has been peeled off in a dry thickness of 4 (μμm), and dry it for $ minutes. It is made into a thermosetting adhesive film. The melt viscosity of this film (measured by a rheometer RS150 (Hacker)) was 9.0xi07mpa.s (80 ° C). 18

差量份 10^ 10^ 10^ 10 200528531 [表l] 成分 苯氧樹脂(YP50，東都化學公司製) 環氧樹脂(HP7200H，大日本油墨化學工業公司舉j) 含環氧基之環氧丙烯酸S旨低聚物(ΕΒ3605，聯邦電石八^製> 環氧樹脂(ΗΧ3941ΗΡ，大日本油墨化學工^司製） 光聚合起始劑(ΤΡΟ，BASF公司製） 導電粒子(鐘Ni/金樹脂粒子(3.2μιη)，日本掣） [表2] 成分 差^樹脂(YP50，東都化學公司製） 環氧樹脂(HP4032D，環氧基當量136〜150g/eq，大^ 工業公司製） 土學 ^^欠咪唑系硬化劑（HX3941HP，旭化成環^^ [表3] 成色 ，東都化學公司製） 環氧樹脂(HP4032D，環氧基當量136〜150g/eq，大^ 製） H金隻咪唑系硬化劑（HX3941HP，旭化成環氧含司） 鍍Ni/金樹脂粒子(3·2μπι)，日本化學工羡 I 910 ^ 10 ^ 10 ^ 10 200528531 [Table l] Ingredients Phenoxy resin (YP50, manufactured by Todo Chemical Co., Ltd.) Epoxy resin (HP7200H, Dainippon Ink Chemical Industry Co., Ltd.) j Epoxy epoxy acrylic acid S purpose oligomer (ΕΒ3605, manufactured by Federal calcium carbide > epoxy resin (; × 3941ΗΡ, manufactured by Dainippon Ink Chemicals)) photopolymerization initiator (TPO, manufactured by BASF) conductive particles (bell Ni / gold resin Particles (3.2μιη), Japan) [Table 2] Poor composition ^ Resin (YP50, manufactured by Toto Chemical Co., Ltd.) Epoxy resin (HP4032D, epoxy equivalent 136 ~ 150g / eq, manufactured by Daikaku Corporation) Earth science ^ ^ Imidazole-based hardener (HX3941HP, Asahi Kasei ring ^^ [Table 3] Color, manufactured by Todo Chemical Co., Ltd.) Epoxy resin (HP4032D, epoxy equivalent 136 ~ 150g / eq, manufactured by Da ^) H gold imidazole-based hardener Agent (HX3941HP, Asahi Kasei Epoxy Co., Ltd.) Ni / gold resin particles (3 · 2μπι), Japan Chemical Industry Co., Ltd. I 9

1515

19 200528531 [表4] 單位重量 成分 苯氧樹脂rvT5g^_^^化學公司製） 環氧樹脂(HP4032D，環氧基當量136〜150g/eq，大曰本油墨化學工 業公司製） 環氧分散咪唑系硬化劑（HX3941HP，旭化成環 導電粒子(鍍Ni/金^旨粒子(3·2μπι)，日本^ 關於所製成之各實施例與比較例之異向性導電黏著 膜’如下述說明進行黏著性評估。再者，使用所製成：各 實施例與比較例之異向性導電黏著膜，將測試用電路基板 與測試用透明液晶基板進行異向性導電連接。此時捕二之 粒子數量依照下述說明測量之。所得之結果如表/所示。 再者，關於實施例！之異向性導電黏著膜，在測試用 透明液晶基板上設置異向性導電黏著膜，而以 200mjW(320〜390nm)之條件照射在連接端子上之里向性 導電黏著膜後，使其與^ f w 、判忒用電路基板對位，以 170 Cx80MPaxl0sec之條件進行熱壓接。 關於實施例2〜3之異向性導 曰 f生等電黏者臈，在測試用透明 液晶基板上設置里6 /、向性導電黏著膜，而以 200mJ/cm (320〜390nm)之條钍 077 以 士土 條件&射在連接端子上之異向性 導電黏著膜後，使其鱼 /、门性 ，、測试用電路基板對位， 170 Cx80MPaxl0sec 之侔杜、也 <保件進行熱壓接。又 之異向性導電黏著膜， ’ ““列2 ^ β ^月側之光硬化性異向性導雷勤牮 劑層設置在測試用透明液曰電黏者 叹日日基板側。 20 200528531 再者，關於比較例i〜2之熱硬化型異向性導電黏著膜 在測試用透明液晶基板上設置異向性導電黏著膜，使其鱼 測試用電路基板對位，以170〇Cx80MPaxl0sec之淮二 熱壓接。 Θ 黏著性 在玻璃板利用熱壓機將ACF(異向性導電黏著膜汐剝離 處理PET(聚對苯二甲酸乙二醇醋）以4〇(>Cx〇 5Mpax2sec之 條件進熱壓接，之後將剝離處理之pET剝下，觀察 之ACF狀態。 mi19 200528531 [Table 4] Unit weight component phenoxy resin rvT5g ^ _ ^^ manufactured by Chemical Co., Ltd.) Epoxy resin (HP4032D, epoxy equivalent 136 ~ 150g / eq, manufactured by Daiyoku Ink Chemical Co., Ltd.) Epoxy dispersed imidazole System hardener (HX3941HP, Asahi Kasei ring conductive particles (Ni / gold plated particles (3 · 2 μm), Japan ^ The anisotropic conductive adhesive film of each of the examples and comparative examples is prepared as described below) In addition, the anisotropic conductive adhesive films prepared in the respective examples and comparative examples were used to conduct anisotropic conductive connection between the test circuit substrate and the test transparent liquid crystal substrate. The number of particles captured at this time Measure it in accordance with the following description. The results obtained are shown in Table /. Moreover, regarding the anisotropic conductive adhesive film of the Example !, an anisotropic conductive adhesive film was set on the transparent liquid crystal substrate for testing, and 200 mjW ( 320 ~ 390nm). After being irradiated to the inner conductive adhesive film on the connection terminal, it was aligned with ^ fw and the circuit board for determination, and thermocompression bonding was performed under the conditions of 170 Cx80MPax10sec. About Examples 2 to 3 Dissent Introduce the electro-adhesive person, etc. on the transparent liquid crystal substrate for testing, and install a 6 /, anisotropic conductive adhesive film, and shoot at 200mJ / cm (320 ~ 390nm) with 077 in the soil condition & After connecting the anisotropic conductive adhesive film on the terminal, make it fish /, gate, and test circuit board alignment, 170 Cx80MPaxl0sec, also < warranty for thermocompression bonding. Another anisotropic conductive Adhesive film, "" "column 2 ^ β ^ moon-side light-hardening anisotropic lightning-conducting tincture layer is provided on the side of the transparent liquid for testing. The heat-curable anisotropic conductive adhesive film of i ~ 2 is provided with an anisotropic conductive adhesive film on the transparent liquid crystal substrate for testing, and the circuit board for fish testing is aligned, and it is thermocompression-bonded at 170 ° Cx80MPax10sec. Θ Adhesiveness: ACF (anisotropic conductive adhesive film peeling treatment PET (polyethylene terephthalate)) was thermocompression-bonded on a glass plate using a hot press under conditions of 40 (> Cx〇5Mpax 2sec), and thereafter, Peel off the treated pET and observe the ACF state.

(評價標準） 等級 標準 〇：ACF轉黏在玻璃上 x:ACF未轉黏在玻璃上 粒子捕捉性 以顯微鏡算出壓接後之IC凸塊（每一個凸塊之表面積 = 2500μηι2)上之導電粒子數，以其平均值作為粒子捕捉數。(Evaluation Criteria) Grade Criteria 0: ACF is transferred to the glass x: ACF is not transferred to the glass. The particle capture property is calculated by microscopy with conductive particles on IC bumps (surface area of each bump = 2500 μηι2) Number, and the average value is used as the number of particle captures.

[表5] 評價項目 實施例 比較例 1 2 3 1 2 黏著性 〇 〇 〇 〇 X 導電粒子捕捉數(個/2500μιη2) 25 24 22 16 19 21 200528531 表5可知’在貫施例1之情形下，使用單層紫外線 硬二型異向性導電黏著劑之異向性導電黏著膜，由於使連 接端子上之黏著劑溶融黏度增加，故黏著性佳，導電粒子 =捕捉性亦佳。在實施例2之情形下，與實施例i之情形 >同使連接鳊子上之黏著劑熔融黏度增加，但相較於實 施例1之情形，不僅在單㈣置熱硬化 外線硬化型異向性導電黏著劑層之厚度亦減半。^此^ ^者=之問題’而且雖然紫外線硬化型異向性導電黏著 :丨：：厚：減半’但導電粒子捕捉數僅降低4%，在實際應 =不會產生問題。在實施例3之情形下，與實施例丨 =相同，使連接端子上之黏著劑炫融黏度增加，但相 ΐ紫ΓΓ1之情形，不僅在雙面設置熱硬化性黏著劑層， 此、二硬化型異向性導電黏著劑層之厚度亦減半。因 電黏著紫外線硬_異向性導 在實際應用上並:會:生:::電粒如 埶：方面’在比較例1肖2之情形下，由於使用單層 :=向性導電黏著劑之異向性導電黏著膜 之問題。在比較例2之情形下，則有黏著性 ==發明之異向性導電連接方法，當電路基板之連 二口 Γ元件連接部利用異向性導電黏著劑或異向性 電連接時，可提升導電粒子之捕捉性， 在騎異向性導電連接時整體之流㈣，不須增 22 200528531 元件之連接強度 方法係適用於各 加壓接時之壓力，而可使電路基板與電子 非常強。因此，本發明之異向性導電連接 種電路基板與電子元件間之連接者。 【圖式簡單說明】[Table 5] Comparative Examples of Evaluation Item Examples 1 2 3 1 2 Adhesiveness 0.0000 × Number of captured conductive particles (pieces / 2500 μm 2) 25 24 22 16 19 21 200528531 Table 5 shows that in the case of the implementation of Example 1 An anisotropic conductive adhesive film using a single-layer ultraviolet hard type-II anisotropic conductive adhesive, because the adhesive viscosity on the connection terminal is increased, so the adhesiveness is good, and the conductive particles = good capture properties. In the case of Example 2, the melt viscosity of the adhesive on the joint rafter was increased as in the case of Example i>, but compared to the case of Example 1, not only was the heat curing type of the external curing type different The thickness of the anisotropic conductive adhesive layer is also halved. ^ 此 ^ ^ 者 = 的 问题 ’And although UV-curable anisotropic conductive adhesion: 丨 :: thickness: halved’, the number of conductive particles captured is only reduced by 4%, which should not cause problems in practice. In the case of Example 3, the same as in Example 丨 =, the viscosity of the adhesive on the connection terminal is increased, but in the case of purple ΓΓ1, not only a thermosetting adhesive layer is provided on both sides. The thickness of the hardened anisotropic conductive adhesive layer is also halved. Due to the electrical adhesion, UV hard _ anisotropic conductivity is practically combined with: will: raw ::: electron particles such as: in the case of Comparative Example 1 and Xiao 2 due to the use of a single layer: = anisotropic conductive adhesive The problem of anisotropic conductive adhesive film. In the case of Comparative Example 2, there is adhesiveness == an anisotropic conductive connection method of the invention. When the two-port Γ element connection portion of the circuit substrate uses an anisotropic conductive adhesive or anisotropic electrical connection, Improve the capture of conductive particles, the overall flow when riding anisotropic conductive connections, no need to increase the 22 200528531 component connection strength method is applicable to the pressure of each pressure connection, and can make the circuit board and electrons very strong . Therefore, the anisotropic conductive connection of the present invention is a connection between a circuit board and an electronic component. [Schematic description]

1(a)〜(d)係本發明之異 向性導電連接方法之步驟說 圖說明圖 2(A1)〜(〇)係本發明 之異向性導電連接方法之步驟1 (a) ~ (d) are the steps of the anisotropic conductive connection method of the present invention. Figure 2 (A1) ~ (〇) are the steps of the anisotropic conductive connection method of the present invention.

圖3⑷、（b)係本發明之異向性導電黏著膜之截面圖 圖4⑷〜(c)係習知異向性導電黏著膜之截面圖。 主要元件代表符號說明】 1、21 la lb 、 21b 1 c 2-22-32 3 、 23 、 33 4、31 4a 、 24a 4b 、 24b 5、27 6、28 6a 、 28a 電路基板 絕緣性基板 連接端子 覆蓋部 導電粒子 光硬化型絕緣性黏著劑 異向性導電著膜 曝光部 非曝光部 曝光用光罩 電子元件 連接部 光硬化型之異向性導電黏著劑層Figs. 3 (a) and (b) are cross-sectional views of an anisotropic conductive adhesive film of the present invention. Figs. 4 (a) to (c) are cross-sectional views of a conventional anisotropic conductive adhesive film. Description of main component symbols] 1, 21 la lb, 21b 1 c 2-22-32 3, 23, 33 4, 31 4a, 24a 4b, 24b 5, 27 6, 28 6a, 28a Covering part Conductive particles Photocurable insulating adhesive Anisotropic conductive film Exposure part Non-exposed part Exposure mask Electronic component connection part Photocurable anisotropic conductive adhesive layer

23 24 200528531 25 26 34 熱硬化型黏著劑層 積層型異向性導電黏著膜23 24 200528531 25 26 34 Thermosetting adhesive layer laminated anisotropic conductive adhesive film

24twenty four

Claims (1)

200528531 十、申請專利範圍： 1.一種異向性導電連接方法，係將電路基板之連接端子 與電子凡件連接部進行異向性導電連接之方法，其特徵在 於包含下列步驟（a)〜 +步驟（a)在電路基板上配置異向性導電黏著膜，該黏著 膜係將導电粒子分散在光硬化型絕緣性黏著劑而構成； 步驟（b)在該異向性導電黏著膜上配置曝光用光罩，其 /、有人電路基板之連接端子對應之曝光圖案；200528531 X. Scope of patent application: 1. An anisotropic conductive connection method, which is a method of anisotropic conductive connection between a connection terminal of a circuit substrate and a connection part of an electronic component, which is characterized by including the following steps (a) ~ + Step (a) An anisotropic conductive adhesive film is arranged on a circuit substrate, and the adhesive film is formed by dispersing conductive particles in a photo-hardening insulating adhesive; step (b) is arranged on the anisotropic conductive adhesive film. Exposure mask, its exposure pattern corresponding to the connection terminal of the circuit board; …步驟⑷ϋ過曝光用力罩以I線照射該異向性導電為 :::二異：性導電黏著膜受光線照射之曝光部進行光 '口，而增加其熔融黏度；以及 步：⑷$下曝光用光罩，在電路基板之連接端 應處，由異向性導電黏著膜側將電子元件之連接 =兩者密合，以光線照射異向性導電黏著膜整體y = 連 =接聚合，藉此使電路基板之連接端子與電心… Step: overexposing the anisotropic conductive layer with an irradiated force mask with I-rays as ::: two different: conductive conductive adhesive film exposed to light by the light exposure portion to increase its melt viscosity; and step: For exposure masks, at the connection end of the circuit substrate, the electronic components are connected by the anisotropic conductive adhesive film side = the two are closely connected, and the entire anisotropic conductive adhesive film is illuminated with light y = connected = connected and polymerized, This allows the connection terminals of the circuit board and the core 在如甲料利範圍第丨項之異向性導電連接方法， /驟（e)係將光照射在電路基板連接端子上之里 電黏著膜。 ，、问 〜啤不1，只心兴问性導電遠技士、+ ^ 在步驟⑷’係將光照射在電路基 中 導電黏著臈。 拱而子周圍之異向性 之連接端子 ’其特徵在 “4，m性導電連接方法，係將電路基板 〃包子70件連接部進行異向性導電連接之方法 25 200528531 於包含下列步驟（a，）〜（d’）： 步驟(a’）在電路基板上配置積層型異向性導電黏著 膜’該黏著膜具有：將導電粒子分散在光硬化型絕緣性點 著劑而成之異向性導電黏著劑層，與至少設於其單面之熱 硬化型黏著劑層； ' 步驟(b’）纟該積層型異向性導電黏著膜上配置曝光用 光罩，其具有與電路基板之連接端子對應之曝光圖案； 步驟⑹ϋ過曝光用光罩以光線照射該積層型異向性 導電黏著膜，使積層型異向性導電黏著膜之光硬化型里向 性導電黏著劑層受光線照射之曝光部進行光聚合，而 其熔融黏度；以及 曰 步驟（d，）$下曝光用光罩，在電路基板之連接端子相 應1，由異向性導電黏著膜側將電子元件之 =兩者密合，至少使熱硬化型黏著劑層硬化，藉此使 土板之連接端子與電子元件之連接部連接。 在2如申請專利範圍第4項之異向性導電連接方法，其中 ^ ^ (c ) ’係將光照射在電路基板 ^ 向性導電黏著膜。 &連“子上之積層型異 在步二^請專利範圍第4項之異向性導電連接方法，其甲 〃（c )，係將光照射在電路基板連 異向性導電黏著膜。 土板連接…圍之積層型 型絕異著:性導 特徵在於：”而之異向性導電黏著劑層所構成者，其 26 200528531 按照異向性導電連接圖案，而在異向性導電黏著膜之 異向性導電黏著劑層中設置熔融黏度相異之區域。 8.如申請專利範圍第7項之異向性導電黏著膜，其中至 少在異向性導電黏著層之單面形成熱硬化型黏著劑層。 十一、圖式： 如次頁。In the anisotropic conductive connection method as described in item 丨 of the article, the step (e) is an electric adhesive film that irradiates light onto the connection terminals of the circuit substrate. ,, ask ~ beer is not 1, only interested conductive remote technician, + ^ in step ⑷ 'is to irradiate light in the circuit base conductive adhesive 臈. The anisotropic connection terminal around the arch is characterized by "4m conductive connection method, which is a method of anisotropic conductive connection of 70 connection parts of a circuit board and a bun 25 200528531. The method includes the following steps (a () '~ (D'): Step (a ') Arrange a laminated anisotropic conductive adhesive film on the circuit substrate. The adhesive film has an anisotropy formed by dispersing conductive particles in a light-hardening insulating spotting agent. A conductive conductive adhesive layer and a heat-curable adhesive layer provided on at least one side thereof; 'Step (b'): The laminated anisotropic conductive adhesive film is provided with a photomask for exposure, which has a contact with a circuit board. The exposure pattern corresponding to the connection terminal; Step ⑹ϋ Over-exposure with a mask to irradiate the laminated anisotropic conductive adhesive film with light, so that the light-hardened inner conductive adhesive layer of the laminated anisotropic conductive adhesive film is illuminated by light The exposed portion undergoes photopolymerization and its melt viscosity; and in step (d,), the exposure mask is corresponding to 1 at the connection terminal of the circuit substrate, and the electron element is transferred from the anisotropic conductive adhesive film side. Pieces = The two are in close contact, at least the thermosetting adhesive layer is hardened, thereby connecting the connecting terminal of the soil plate and the connecting portion of the electronic component. In the method of anisotropic conductive connection according to item 4 of the scope of patent application , Where ^ ^ (c) 'is irradiating light on a circuit substrate ^ anisotropic conductive adhesive film. &Amp; The laminated type on the substrate is different in step 2 ^ Please apply the anisotropic conductive connection method of item 4 of the patent scope, The formazan (c) irradiates light onto a circuit substrate and an anisotropic conductive adhesive film. Soil board connection ... The surrounding layer type is absolutely different: sexual conductivity is characterized by: "The anisotropic conductive adhesive layer is composed of 26 200528531 according to the anisotropic conductive connection pattern, and the anisotropic conductive adhesion In the anisotropic conductive adhesive layer of the film, regions with different melt viscosities are provided. 8. The anisotropic conductive adhesive film according to item 7 of the scope of patent application, wherein at least one side of the anisotropic conductive adhesive layer is thermally cured. Type adhesive layer. 11. Schematic: See next page. 2727
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JP4385794B2 (en) 2009-12-16

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